SYSTEM AND METHOD TO INCREASE DISPLAY AREA UTILIZING A PLURALITY OF DISCRETE DISPLAYS

    公开(公告)号:US20190034150A1

    公开(公告)日:2019-01-31

    申请号:US16045269

    申请日:2018-07-25

    IPC分类号: G06F3/14 G01P1/07

    摘要: A method includes receiving, at a master agent, announcements from candidate consumer agents indicating the presence of the candidate consumer agents. Each announcement includes display parameters for a display of the corresponding candidate consumer agent. The method further includes receiving at the master agent content parameters from a producer agent, the content parameters defining characteristics of content to be provided by the consumer agent. A mosaic screen is configured based on the received announcements and the content parameters. This configuring of the mosaic screen includes selecting ones of the consumer agents for which an announcement was received and generating content distribution parameters based on the content parameters and the display parameters of the selected ones of the consumer agents. The generated content distribution parameters are provided to the consumer agent.

    Semiconductor device with fin and related methods

    公开(公告)号:US10177255B2

    公开(公告)日:2019-01-08

    申请号:US15723152

    申请日:2017-10-02

    摘要: A semiconductor device may include a substrate, a fin above the substrate and having a channel region therein, and source and drain regions adjacent the channel region to generate shear and normal strain on the channel region. A semiconductor device may include a substrate, a fin above the substrate and having a channel region therein, source and drain regions adjacent the channel region, and a gate over the channel region. The fin may be canted with respect to the source and drain regions to generate shear and normal strain on the channel region.

    Semiconductor device with fins including sidewall recesses

    公开(公告)号:US10153371B2

    公开(公告)日:2018-12-11

    申请号:US14175215

    申请日:2014-02-07

    IPC分类号: H01L29/78 H01L29/66

    摘要: A method is for making a semiconductor device. The method may include forming fins above a substrate, each fin having an upper fin portion including a first semiconductor material and a lower fin portion including a dielectric material. The method may include forming recesses into sidewalls of each lower fin portion to expose a lower surface of a respective upper fin portion, and forming a second semiconductor layer surrounding the fins including the exposed lower surfaces of the upper fin portions. The second semiconductor layer may include a second semiconductor material to generate stress in the first semiconductor material.

    LOW POWER BIOLOGICAL SENSING SYSTEM
    96.
    发明申请

    公开(公告)号:US20180344186A1

    公开(公告)日:2018-12-06

    申请号:US16041140

    申请日:2018-07-20

    发明人: John H. ZHANG

    摘要: It is recognized that, because of its unique properties, graphene can serve as an interface with biological cells that communicate by an electrical impulse, or action potential. Responding to a sensed signal can be accomplished by coupling a graphene sensor to a low power digital electronic switch that is activatable by the sensed low power electrical signals. It is further recognized that low power devices such as tunneling diodes and TFETs are suitable for use in such biological applications in conjunction with graphene sensors. While tunneling diodes can be used in diagnostic applications, TFETs, which are three-terminal devices, further permit controlling the voltage on one cell according to signals received by other cells. Thus, by the use of a biological sensor system that includes graphene nanowire sensors coupled to a TFET, charge can be redistributed among different biological cells, potentially with therapeutic effects.

    Leadframe package with side solder ball contact and method of manufacturing

    公开(公告)号:US10141246B2

    公开(公告)日:2018-11-27

    申请号:US15952068

    申请日:2018-04-12

    摘要: The present disclosure is directed to a leadframe package having a side solder ball contact and methods of manufacturing the same. A plurality of solder balls are coupled to recesses in a leadframe before encapsulation and singulation. After singulation, a portion of each solder ball is exposed on sidewalls of the package. This ensures that the sidewalls of the leads are solder wettable, which allows for the formation of stronger joints when the package is coupled to a substrate. This increased adhesion reduces resistance at the joints and also mitigates the effects of expansion of the components in the package such that delamination is less likely to occur. As a result, packages with a side solder ball contact have increased life cycle expectancies.