公开(公告)号：US08633557B2

公开(公告)日：2014-01-21

申请号：US13599960

申请日：2012-08-30

申请人： Sang-Hoon Kim ,  Chang-Rok Moon

发明人： Sang-Hoon Kim ,  Chang-Rok Moon

IPC分类号： H01L31/0232

CPC分类号： H01L27/14636 ,  H01L27/1464 ,  H01L27/14689

摘要： Image sensors include a first insulation interlayer structure on a first surface of a substrate and having a multi-layered structure. A first wiring structure is in the first insulation interlayer structure. A via contact plug extends from a second surface of the substrate and penetrates the substrate to be electrically connected to the first wiring structure. Color filters and micro lenses are stacked on the second surface in a first region of the substrate. A second insulation interlayer structure is on the second surface in a second region of the substrate. A second wiring structure is in the second insulation interlayer structure to be electrically connected to the via contact plug. A pad pattern is electrically connected to the second wiring structure and having an upper surface through which an external electrical signal is applied. Photodiodes are between the first and second wiring structures in the first region.

摘要翻译： 图像传感器包括在基板的第一表面上的具有多层结构的第一绝缘夹层结构。 第一布线结构处于第一绝缘夹层结构中。 通孔接触插塞从基板的第二表面延伸并穿透基板以电连接到第一布线结构。 彩色滤光器和微透镜在衬底的第一区域中的第二表面上堆叠。 第二绝缘层间结构位于衬底的第二区域中的第二表面上。 第二布线结构在第二绝缘层间结构中，以电连接到通孔接触插塞。 焊盘图案电连接到第二布线结构，并且具有施加外部电信号的上表面。 光电二极管位于第一区域中的第一和第二布线结构之间。

公开(公告)号：US20130149806A1

公开(公告)日：2013-06-13

申请号：US13612736

申请日：2012-09-12

申请人： Sang Hoon KIM ,  Gyungock KIM ,  In Gyoo KIM ,  JiHo JOO ,  Ki Seok JANG

发明人： Sang Hoon KIM ,  Gyungock KIM ,  In Gyoo KIM ,  JiHo JOO ,  Ki Seok JANG

IPC分类号： H01L31/18

CPC分类号： H01L31/1804 ,  G02B6/12004 ,  G02B6/131 ,  H01L31/02327 ,  H01L31/103 ,  H01L31/1037 ,  H01L31/109 ,  Y02E10/547 ,  Y02P70/521

摘要： Methods of forming photo detectors are provided. The method includes providing a semiconductor layer on a substrate, forming a trench in the semiconductor layer, forming a first single crystalline layer and a second single crystalline layer using a selective single crystalline growth process in the trench, and patterning the first and second single crystalline layers and the semiconductor layer to form a first single crystalline pattern, a second single crystalline pattern and an optical waveguide.

摘要翻译： 提供了形成光电检测器的方法。 该方法包括在衬底上提供半导体层，在半导体层中形成沟槽，在沟槽中使用选择性单晶生长工艺形成第一单晶层和第二单晶层，以及使第一和第二单晶 层和半导体层以形成第一单晶图案，第二单晶图案和光波导。

公开(公告)号：US20120289397A1

公开(公告)日：2012-11-15

申请号：US13288129

申请日：2011-11-03

申请人： Ji Young BYUN ,  Seung Hee HAN ,  Heon Phil HA ,  Byung Yong YU ,  Sang Hoon KIM ,  Do Hyung KIM ,  Chae Sun LIM

发明人： Ji Young BYUN ,  Seung Hee HAN ,  Heon Phil HA ,  Byung Yong YU ,  Sang Hoon KIM ,  Do Hyung KIM ,  Chae Sun LIM

IPC分类号： B01J37/34 ,  H01J37/317 ,  B82B3/00

CPC分类号： B01J37/349 ,  B01J21/04 ,  B01J23/40 ,  B01J23/42 ,  B01J23/70 ,  B01J35/006 ,  C01B3/326 ,  C01B2203/0261 ,  C01B2203/107 ,  C01B2203/1082 ,  C01B2203/1211 ,  C23C14/48 ,  Y02P20/52

摘要： Provided is a method of fabricating a nano particle complex catalyst including generating a plasma ion of a solid element and performing plasma ion implantation to carry a catalyst component of the solid element in a porous carrier. In the method, a pulse direct current voltage is applied to the deposition source to generate the plasma ion of the solid element, and a synchronized voltage is applied to the porous carrier, thereby instantly applying a pulse high voltage to the solid element. The ionized solid element is accelerated toward the porous carrier by the pulse high voltage instantly applied to the solid element, thereby performing the ion implantation.

摘要翻译： 提供一种制造纳米颗粒复合催化剂的方法，包括产生固体元素的等离子体离子并进行等离子体离子注入，以将固体元素的催化剂组分携带在多孔载体中。 在该方法中，向沉积源施加脉冲直流电压以产生固体元素的等离子体离子，向多孔载体施加同步电压，从而立即向固体元件施加脉冲高电压。 电离固体元素通过立即施加到固体元件的脉冲高电压朝向多孔载体加速，从而进行离子注入。

公开(公告)号：US20120171624A1

公开(公告)日：2012-07-05

申请号：US13419826

申请日：2012-03-14

申请人： Joon Sung KIM ,  Sang Hoon Kim ,  Jae Hyun Jung ,  Han Seo Cho

发明人： Joon Sung KIM ,  Sang Hoon Kim ,  Jae Hyun Jung ,  Han Seo Cho

IPC分类号： G03F7/20

CPC分类号： G02B6/1221 ,  G02B2006/1219 ,  H05K1/0274

摘要： Disclosed herein is a printed circuit board for an optical waveguide, including a base board, and an optical waveguide formed on the base board. The optical waveguide includes a lower clad layer formed on the base board, an insulation layer formed on the lower clad layer and having a core-forming through-hole, a core part formed on a region of the lower clad layer, which is exposed through the through-hole, and an upper clad layer formed in the through-hole and on the insulation layer.

摘要翻译： 这里公开了一种用于光波导的印刷电路板，包括基板和形成在基板上的光波导。 光波导包括形成在基板上的下包层，形成在下包层上并具有芯形成通孔的绝缘层，形成在下包层的区域上的芯部，其暴露于 所述通孔和形成在所述通孔中和所述绝缘层上的上覆层。

公开(公告)号：US20120148244A1

公开(公告)日：2012-06-14

申请号：US13302371

申请日：2011-11-22

申请人： Sahnggi PARK ,  Gyungock KIM ,  In Gyoo KIM ,  Jeong Woo PARK ,  Sang Hoon KIM ,  Do Won KIM

发明人： Sahnggi PARK ,  Gyungock KIM ,  In Gyoo KIM ,  Jeong Woo PARK ,  Sang Hoon KIM ,  Do Won KIM

IPC分类号： H04J14/02

CPC分类号： H04J14/028 ,  G02B6/12007 ,  H01S5/026 ,  H01S5/1032 ,  H01S5/4087 ,  H04J14/02 ,  H04J14/0201

摘要： Provided is an optical network structure. To configure an optical network structure between hundreds or more of cores in a CPU, intersection between waveguides does not occur, and thus, the optical network structure enables two-way communication between all the cores without an optical switch disposed in an intersection point. The present invention enables a single chip optical network using a silicon photonics optical element, and a CPU chip configured with hundreds or thousands of cores can be developed.

摘要翻译： 提供了一种光网络结构。 为了在CPU中配置数百个或更多个核心之间的光网络结构，不会发生波导之间的交叉，因此，光网络结构在所有核心之间实现双向通信，而光交换机不设置在交叉点。 本发明使得能够使用硅光子学光学元件的单芯片光网络，并且可以开发配置有数百或数千个核的CPU芯片。

公开(公告)号：US08056220B2

公开(公告)日：2011-11-15

申请号：US12314450

申请日：2008-12-10

申请人： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Han Seo Cho

发明人： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Han Seo Cho

IPC分类号： H05K3/00 ,  G02B6/12

CPC分类号： G02B6/43 ,  G02B6/4214 ,  H05K1/0274 ,  H05K3/4691 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A printed circuit board is disclosed. A printed circuit board, which includes a first board part, a flexible board part which has one side coupled with the first board part and which includes an electrical wiring layer and an optical waveguide to transmit both electrical signals and optical signals, and a second board part coupled with the other side of the flexible board part, where the electrical wiring layer and the optical waveguide are disposed with a gap in-between, can provide greater bendability and reliability, by having the optical waveguide and electrical wiring layer separated with a gap in-between at the flexible portion of the board, and the optical waveguide can be manufactured with greater precision for even higher reliability, by having the optical waveguide manufactured separately and then inserted during the manufacturing process of the board.

摘要翻译： 公开了印刷电路板。 一种印刷电路板，包括第一板部分，柔性板部分，其一侧与第一板部分耦合并且包括电布线层和光波导以传输电信号和光信号;以及第二板 与柔性基板部分的另一侧耦合的部分，其中电布线层和光波导在其间具有间隙设置，可以通过使光波导和电布线层间隔开来提供更大的弯曲性和可靠性 在板的柔性部分之间，通过使光波导分别制造，然后在板的制造过程中插入，可以以更高的精度制造光波导以获得更高的可靠性。

公开(公告)号：US08036501B2

公开(公告)日：2011-10-11

申请号：US12588453

申请日：2009-10-15

申请人： Sang Hoon Kim ,  Han Seo Cho ,  Jae Hyun Jung ,  Joon Sung Kim

发明人： Sang Hoon Kim ,  Han Seo Cho ,  Jae Hyun Jung ,  Joon Sung Kim

IPC分类号： G02B6/12

CPC分类号： G02B6/43 ,  B32B2307/51 ,  B32B2457/08 ,  C07D301/06 ,  G02B6/138 ,  H05K1/0274 ,  H05K1/028 ,  H05K3/281 ,  H05K3/4635 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T156/10

摘要： The present invention relates to a printed circuit board for optical waveguides and a method of manufacturing the same. The present invention provides a printed circuit board for optical waveguides includes: a base substrate; an optical waveguide that is formed on an upper middle of the base substrate and includes a lower clad, a core formed on an upper middle of the lower clad, and an upper clad formed on the lower clad to surround an upper surface and a side surface of the core; and a side substrate that is formed on the base substrate and has a through hole, through which the optical waveguide penetrates, provided at the middle thereof and a circuit pattern formed therein and a method of manufacturing a printed circuit board for optical waveguides.

公开(公告)号：US20110103737A1

公开(公告)日：2011-05-05

申请号：US12761752

申请日：2010-04-16

申请人： Joon-Sung KIM ,  Han-Seo Cho ,  Jae-Hyun Jung ,  Sang-Hoon Kim

发明人： Joon-Sung KIM ,  Han-Seo Cho ,  Jae-Hyun Jung ,  Sang-Hoon Kim

IPC分类号： G02B6/12 ,  B32B37/00

CPC分类号： G02B6/138 ,  B32B38/06 ,  B32B2038/047 ,  B32B2457/08 ,  G02B6/1221 ,  H05K1/0274

摘要： An optical wiring board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a base substrate having a wiring groove formed therein, forming a first clad layer by filling a first clad substance in the wiring groove, stacking an intermediate insulating layer on the base substrate, in which the intermediate insulating layer has a through-hole formed therein and the through-hole corresponds to the wiring groove, forming a core unit on the first clad layer, forming a second clad layer by filling a second clad substance in the through-hole, in which the second clad layer covers the core unit, and stacking a cover insulting layer on the intermediate insulating layer, in which the cover insulating layer covers the second clad layer.

摘要翻译： 公开了一种光布线板及其制造方法。 根据本发明的一个实施例，该方法包括提供其中形成有布线槽的基底基板，通过在布线槽中填充第一包层物质形成第一覆盖层，在基底基板上堆叠中间绝缘层， 其中中间绝缘层具有形成在其中的通孔，并且通孔对应于布线槽，在第一包层上形成芯单元，通过在通孔中填充第二包层物质形成第二包层 其中第二覆盖层覆盖芯单元，并且在覆盖绝缘层覆盖第二覆层的中间绝缘层上堆叠覆盖绝缘层。

公开(公告)号：US20110007999A1

公开(公告)日：2011-01-13

申请号：US12923143

申请日：2010-09-03

申请人： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Jae-Hyun Jung ,  Han-Seo Cho

发明人： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Jae-Hyun Jung ,  Han-Seo Cho

IPC分类号： G02B6/12

CPC分类号： G02B6/12002 ,  G02B6/13 ,  G02B6/43 ,  H05K1/0274 ,  H05K3/4652 ,  H05K3/4691

摘要： A printed circuit board including a first optical waveguide having a circuit pattern and a pad buried in one side thereof, a first insulation layer stacked over one side of the first optical waveguide, a first insulating material stacked over the first insulation layer, a first electrical wiring layer stacked over the first insulating material, a second optical waveguide having a circuit pattern and a pad buried in one side thereof, a second insulation layer stacked over one side of the second optical waveguide, a second insulating material stacked over the second insulation layer, a second electrical wiring layer stacked over the second insulating material, an intermediate layer interposed between the other side of the first optical waveguide and the other side of the second optical waveguide such that the first optical waveguide and the second optical waveguide are attached, and a via penetrating the first optical waveguide and the second optical waveguide.

摘要翻译： 一种印刷电路板，包括具有电路图案的第一光波导和埋在其一侧的焊盘，堆叠在所述第一光波导的一侧上的第一绝缘层，堆叠在所述第一绝缘层上的第一绝缘材料， 布线层堆叠在第一绝缘材料上，具有电路图案和埋在其一侧的焊盘的第二光波导，堆叠在第二光波导的一侧上的第二绝缘层，堆叠在第二绝缘层上的第二绝缘材料 层叠在所述第二绝缘材料上的第二电布线层，插入在所述第一光波导的另一侧和所述第二光波导的另一侧之间的中间层，使得附接所述第一光波导和所述第二光波导;以及 穿过第一光波导和第二光波导的通孔。

公开(公告)号：US20100292166A1

公开(公告)日：2010-11-18

申请号：US12095672

申请日：2005-12-20

申请人： Kee-Ho Lee ,  Sang-Hoon Kim ,  Hyun-Jung Baek ,  Kyoung-Mi Juhn ,  Jae-Min Jeong ,  Yeun-Jin Ju ,  Bu-Yeo Kim ,  Eun-Ju Lee ,  Yong-Ho Ham ,  Hee-Chung Kwon ,  Mi-Yong Yun ,  Gil-Hong Park

发明人： Kee-Ho Lee ,  Sang-Hoon Kim ,  Hyun-Jung Baek ,  Kyoung-Mi Juhn ,  Jae-Min Jeong ,  Yeun-Jin Ju ,  Bu-Yeo Kim ,  Eun-Ju Lee ,  Yong-Ho Ham ,  Hee-Chung Kwon ,  Mi-Yong Yun ,  Gil-Hong Park

IPC分类号： A61K38/16 ,  A61K31/7088 ,  C12N15/63 ,  C12N5/10 ,  C12P21/06 ,  A61P35/00 ,  C12N7/01 ,  C40B40/08 ,  C40B40/10

CPC分类号： A61K48/005

摘要： A pharmaceutical composition for the treatment of malignant tumors comprising a human p31comet gene encoding protein represented by SEQ ID NO: 3 or 4 as an effective component is provided. The pharmaceutical composition can suppress cancer cell growth, induce apoptosis and kill cells by overexpressing p31comet in the solid malignant tumor cells. Therefore, the pharmaceutical composition can be effectively used for gene therapy.

摘要翻译： 提供了用于治疗恶性肿瘤的药物组合物，其包含编码由SEQ ID NO：3或4表示的蛋白质的人p31comet基因作为有效成分。 药物组合物可以通过在实体恶性肿瘤细胞中过表达p31comet来抑制癌细胞生长，诱导细胞凋亡和杀死细胞。 因此，药物组合物可以有效地用于基因治疗。