公开(公告)号：US20120171624A1

公开(公告)日：2012-07-05

申请号：US13419826

申请日：2012-03-14

Applicant: Joon Sung KIM ,  Sang Hoon Kim ,  Jae Hyun Jung ,  Han Seo Cho

Inventor： Joon Sung KIM ,  Sang Hoon Kim ,  Jae Hyun Jung ,  Han Seo Cho

IPC: G03F7/20

CPC classification number: G02B6/1221 ,  G02B2006/1219 ,  H05K1/0274

Abstract: Disclosed herein is a printed circuit board for an optical waveguide, including a base board, and an optical waveguide formed on the base board. The optical waveguide includes a lower clad layer formed on the base board, an insulation layer formed on the lower clad layer and having a core-forming through-hole, a core part formed on a region of the lower clad layer, which is exposed through the through-hole, and an upper clad layer formed in the through-hole and on the insulation layer.

Abstract translation: 这里公开了一种用于光波导的印刷电路板，包括基板和形成在基板上的光波导。 光波导包括形成在基板上的下包层，形成在下包层上并具有芯形成通孔的绝缘层，形成在下包层的区域上的芯部，其暴露于 所述通孔和形成在所述通孔中和所述绝缘层上的上覆层。

公开(公告)号：US08181339B2

公开(公告)日：2012-05-22

申请号：US12213703

申请日：2008-06-23

Applicant: Joon-Sung Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu

Inventor： Joon-Sung Kim ,  Je-Gwang Yoo ,  Chang-Sup Ryu

IPC: H05K3/02

CPC classification number: H05K3/007 ,  H05K1/0265 ,  H05K3/06 ,  H05K3/108 ,  H05K3/427 ,  H05K2201/0352 ,  H05K2201/0394 ,  H05K2201/09736 ,  H05K2203/0156 ,  H05K2203/1394 ,  H05K2203/1476 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method of manufacturing the printed circuit board can include forming a first protective layer over one surface of a core substrate, forming a first circuit pattern over the other surface of the core substrate by a first process, removing the first protective layer, forming a second protective layer over the other surface of the core substrate, and forming a second circuit pattern over the one surface of the core substrate by a second process.

Abstract translation: 公开了印刷电路板和印刷电路板的制造方法。 制造印刷电路板的方法可以包括在芯基板的一个表面上形成第一保护层，通过第一工艺在芯基板的另一表面上形成第一电路图案，去除第一保护层，形成第二保护层 保护层在芯基板的另一表面上，并且通过第二工艺在芯基板的一个表面上形成第二电路图案。

公开(公告)号：US08065797B2

公开(公告)日：2011-11-29

申请号：US11896774

申请日：2007-09-05

Applicant: Ryoichi Watanabe ,  Byoung-Youl Min ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Seung-Chul Kim ,  Myung-San Kang

Inventor： Ryoichi Watanabe ,  Byoung-Youl Min ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Seung-Chul Kim ,  Myung-San Kang

IPC: H01K3/10 ,  H05K3/36 ,  H05K3/02 ,  H05K3/10 ,  H05K1/00 ,  H05K1/09

CPC classification number: H05K3/0017 ,  H05K3/0014 ,  H05K3/045 ,  H05K3/06 ,  H05K3/107 ,  H05K3/20 ,  H05K3/205 ,  H05K3/426 ,  H05K3/4614 ,  H05K3/465 ,  H05K3/4658 ,  H05K2201/0361 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2201/09563 ,  H05K2203/0278 ,  H05K2203/0384 ,  H05K2203/0582 ,  H05K2203/1152 ,  H05K2203/1189 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A method of fabricating a printed circuit board is disclosed. A method of fabricating a printed circuit board that includes: stacking an insulation layer on at least one surface of a core layer, on which an inner circuit is formed, and forming an outer circuit pattern; burying the outer circuit pattern in the insulation layer; removing the outer circuit pattern to form minute grooves and curing the insulation layer; and forming an outer circuit by filling metal in the minute grooves, makes it possible to readily form high-resolution fine-line circuits, as well as to reduce fabrication costs and increase productivity.

Abstract translation: 公开了一种制造印刷电路板的方法。 一种制造印刷电路板的方法，包括：在形成有内部电路的芯层的至少一个表面上堆叠绝缘层，并形成外部电路图案; 将外部电路图案埋在绝缘层中; 去除外部电路图案以形成微小凹槽并固化绝缘层; 通过在金属槽中填充金属而形成外部电路，可以容易地形成高分辨率的细线电路，并且能够降低制造成本并提高生产率。

公开(公告)号：US08056220B2

公开(公告)日：2011-11-15

申请号：US12314450

申请日：2008-12-10

Applicant: Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Han Seo Cho

Inventor： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Han Seo Cho

IPC: H05K3/00 ,  G02B6/12

CPC classification number: G02B6/43 ,  G02B6/4214 ,  H05K1/0274 ,  H05K3/4691 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A printed circuit board is disclosed. A printed circuit board, which includes a first board part, a flexible board part which has one side coupled with the first board part and which includes an electrical wiring layer and an optical waveguide to transmit both electrical signals and optical signals, and a second board part coupled with the other side of the flexible board part, where the electrical wiring layer and the optical waveguide are disposed with a gap in-between, can provide greater bendability and reliability, by having the optical waveguide and electrical wiring layer separated with a gap in-between at the flexible portion of the board, and the optical waveguide can be manufactured with greater precision for even higher reliability, by having the optical waveguide manufactured separately and then inserted during the manufacturing process of the board.

Abstract translation: 公开了印刷电路板。 一种印刷电路板，包括第一板部分，柔性板部分，其一侧与第一板部分耦合并且包括电布线层和光波导以传输电信号和光信号;以及第二板 与柔性基板部分的另一侧耦合的部分，其中电布线层和光波导在其间具有间隙设置，可以通过使光波导和电布线层间隔开来提供更大的弯曲性和可靠性 在板的柔性部分之间，通过使光波导分别制造，然后在板的制造过程中插入，可以以更高的精度制造光波导以获得更高的可靠性。

公开(公告)号：US08036501B2

公开(公告)日：2011-10-11

申请号：US12588453

申请日：2009-10-15

Applicant: Sang Hoon Kim ,  Han Seo Cho ,  Jae Hyun Jung ,  Joon Sung Kim

Inventor： Sang Hoon Kim ,  Han Seo Cho ,  Jae Hyun Jung ,  Joon Sung Kim

IPC: G02B6/12

CPC classification number: G02B6/43 ,  B32B2307/51 ,  B32B2457/08 ,  C07D301/06 ,  G02B6/138 ,  H05K1/0274 ,  H05K1/028 ,  H05K3/281 ,  H05K3/4635 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T156/10

Abstract: The present invention relates to a printed circuit board for optical waveguides and a method of manufacturing the same. The present invention provides a printed circuit board for optical waveguides includes: a base substrate; an optical waveguide that is formed on an upper middle of the base substrate and includes a lower clad, a core formed on an upper middle of the lower clad, and an upper clad formed on the lower clad to surround an upper surface and a side surface of the core; and a side substrate that is formed on the base substrate and has a through hole, through which the optical waveguide penetrates, provided at the middle thereof and a circuit pattern formed therein and a method of manufacturing a printed circuit board for optical waveguides.

公开(公告)号：US20110103737A1

公开(公告)日：2011-05-05

申请号：US12761752

申请日：2010-04-16

Applicant: Joon-Sung KIM ,  Han-Seo Cho ,  Jae-Hyun Jung ,  Sang-Hoon Kim

Inventor： Joon-Sung KIM ,  Han-Seo Cho ,  Jae-Hyun Jung ,  Sang-Hoon Kim

IPC: G02B6/12 ,  B32B37/00

CPC classification number: G02B6/138 ,  B32B38/06 ,  B32B2038/047 ,  B32B2457/08 ,  G02B6/1221 ,  H05K1/0274

Abstract: An optical wiring board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a base substrate having a wiring groove formed therein, forming a first clad layer by filling a first clad substance in the wiring groove, stacking an intermediate insulating layer on the base substrate, in which the intermediate insulating layer has a through-hole formed therein and the through-hole corresponds to the wiring groove, forming a core unit on the first clad layer, forming a second clad layer by filling a second clad substance in the through-hole, in which the second clad layer covers the core unit, and stacking a cover insulting layer on the intermediate insulating layer, in which the cover insulating layer covers the second clad layer.

Abstract translation: 公开了一种光布线板及其制造方法。 根据本发明的一个实施例，该方法包括提供其中形成有布线槽的基底基板，通过在布线槽中填充第一包层物质形成第一覆盖层，在基底基板上堆叠中间绝缘层， 其中中间绝缘层具有形成在其中的通孔，并且通孔对应于布线槽，在第一包层上形成芯单元，通过在通孔中填充第二包层物质形成第二包层 其中第二覆盖层覆盖芯单元，并且在覆盖绝缘层覆盖第二覆层的中间绝缘层上堆叠覆盖绝缘层。

公开(公告)号：US20110007999A1

公开(公告)日：2011-01-13

申请号：US12923143

申请日：2010-09-03

Applicant: Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Jae-Hyun Jung ,  Han-Seo Cho

Inventor： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Jae-Hyun Jung ,  Han-Seo Cho

IPC: G02B6/12

CPC classification number: G02B6/12002 ,  G02B6/13 ,  G02B6/43 ,  H05K1/0274 ,  H05K3/4652 ,  H05K3/4691

Abstract: A printed circuit board including a first optical waveguide having a circuit pattern and a pad buried in one side thereof, a first insulation layer stacked over one side of the first optical waveguide, a first insulating material stacked over the first insulation layer, a first electrical wiring layer stacked over the first insulating material, a second optical waveguide having a circuit pattern and a pad buried in one side thereof, a second insulation layer stacked over one side of the second optical waveguide, a second insulating material stacked over the second insulation layer, a second electrical wiring layer stacked over the second insulating material, an intermediate layer interposed between the other side of the first optical waveguide and the other side of the second optical waveguide such that the first optical waveguide and the second optical waveguide are attached, and a via penetrating the first optical waveguide and the second optical waveguide.

Abstract translation: 一种印刷电路板，包括具有电路图案的第一光波导和埋在其一侧的焊盘，堆叠在所述第一光波导的一侧上的第一绝缘层，堆叠在所述第一绝缘层上的第一绝缘材料， 布线层堆叠在第一绝缘材料上，具有电路图案和埋在其一侧的焊盘的第二光波导，堆叠在第二光波导的一侧上的第二绝缘层，堆叠在第二绝缘层上的第二绝缘材料 层叠在所述第二绝缘材料上的第二电布线层，插入在所述第一光波导的另一侧和所述第二光波导的另一侧之间的中间层，使得附接所述第一光波导和所述第二光波导;以及 穿过第一光波导和第二光波导的通孔。

公开(公告)号：US20100142883A1

公开(公告)日：2010-06-10

申请号：US12385007

申请日：2009-03-27

Applicant: Joon Sung Kim ,  Han Seo Cho ,  Jae Hyun Jung ,  Sang Hoon Kim

Inventor： Joon Sung Kim ,  Han Seo Cho ,  Jae Hyun Jung ,  Sang Hoon Kim

IPC: G02B6/12 ,  H01K3/10

CPC classification number: H05K3/00 ,  G02B6/138 ,  G02B2006/12073 ,  H05K1/0274 ,  H05K3/28 ,  H05K2201/0187 ,  Y10T29/49165

Abstract: Disclosed herein is a printed circuit board for an optical waveguide, including: a substrate; an insulation layer having a through hole and formed on the substrate; a lower clad layer formed on a bottom of the through hole; core part formed on the lower clad layer; and an upper clad layer formed on the lower clad layer and the core part and thus covering an exposed surface of the core part.

Abstract translation: 本文公开了一种用于光波导的印刷电路板，包括：基板; 具有通孔并形成在所述基板上的绝缘层; 形成在所述通孔的底部的下包层; 芯部分形成在下包层上; 以及形成在下包层和芯部上并因此覆盖芯部的露出表面的上覆层。

公开(公告)号：US20090223044A1

公开(公告)日：2009-09-10

申请号：US12453616

申请日：2009-05-15

Applicant: Han Seo Cho ,  Je Gwang Yoo ,  Sang-Hoon Kim ,  Joon-Sung Kim

Inventor： Han Seo Cho ,  Je Gwang Yoo ,  Sang-Hoon Kim ,  Joon-Sung Kim

IPC: H05K3/10

CPC classification number: G02B6/1221 ,  G02B6/136 ,  G02B6/28 ,  G02B6/4214 ,  H05K1/0274 ,  H05K3/20 ,  Y10T29/49155

Abstract: A method of manufacturing a printed circuit board in which optical waveguides are formed for transmitting optical signals together with electrical signals, which includes a cladding, a core embedded in the cladding that transmits optical signals, and a wiring pattern embedded in the cladding that transmits electrical signals, can offer improved optical connection efficiency and reduced material costs by enabling the cladding to act as an insulation layer and embedding the wiring pattern in the cladding.

Abstract translation: 一种制造印刷电路板的方法，其中形成光波导以及电信号一起传输光信号，电信号包括包层，嵌入在传播光信号的包层中的芯，以及嵌入在包层中的布线图案，其传输电 信号，可以通过使包层充当绝缘层并且将布线图案嵌入包层中来提供改善的光学连接效率和降低的材料成本。

公开(公告)号：US20090084494A1

公开(公告)日：2009-04-02

申请号：US12007475

申请日：2008-01-10

Applicant: Jin-Yong An ,  Joon-Sung Kim ,  Jong-Kuk Hong ,  Chang-Sup Ryu

Inventor： Jin-Yong An ,  Joon-Sung Kim ,  Jong-Kuk Hong ,  Chang-Sup Ryu

IPC: B29C65/00

CPC classification number: H01L21/6835 ,  H01L21/4857 ,  H01L2221/68318 ,  H01L2221/68345 ,  H05K3/0052 ,  H05K3/0058 ,  H05K3/025 ,  H05K3/20 ,  H05K3/4682 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0152 ,  H05K2203/0228 ,  H05K2203/0384 ,  Y10T156/1052

Abstract: A substrate manufacturing method is disclosed. A substrate manufacturing method, comprising: providing a support body on which a first separation layer is formed; forming a second separation layer on the first separation layer; forming an adhesion layer which covers the first separation layer and the second separation layer; forming a circuit stack body on the adhesion layer; cutting the circuit stack body, the adhesion layer and the second separation layer to a pre-determined shape; and forming a circuit stack unit by separating the second layer from the first layer, provides easy separation of the circuit stack pattern, which formed on the support body, from the support body and reduced manufacturing cost by reducing number of process and required materials for manufacturing coreless thin substrate.

Abstract translation: 公开了一种基板制造方法。 一种基板制造方法，包括：提供其上形成有第一分离层的支撑体; 在所述第一分离层上形成第二分离层; 形成覆盖所述第一分离层和所述第二分离层的粘合层; 在所述粘合层上形成电路堆叠体; 将电路堆叠体，粘合层和第二分离层切割成预定形状; 并且通过将第二层与第一层分开来形成电路堆叠单元，使形成在支撑体上的电路堆叠图形容易地从支撑体分离，并通过减少工艺数量和所需的制造材料来减少制造成本 无芯薄基板。