公开(公告)号：US20090236613A1

公开(公告)日：2009-09-24

申请号：US12407837

申请日：2009-03-20

申请人： Tetsumasa Maruo ,  Masanori Minamio ,  Satoru Waga ,  Tetsushi Nishio

发明人： Tetsumasa Maruo ,  Masanori Minamio ,  Satoru Waga ,  Tetsushi Nishio

IPC分类号： H01L33/00 ,  H01L21/50

CPC分类号： H01L33/483 ,  H01L27/14618 ,  H01L27/14685 ,  H01L31/0203 ,  H01L33/52 ,  H01L33/58 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： According to the present invention, a protective seal S1 for protecting a transparent member 11 is composed of an organic base 16, adhesive layers 17, and a second adhesive layer 18 having low adhesion. The adhesive layers 17 are provided only on edges corresponding, on the organic base 16, to sides 11b of the transparent member and the second adhesive layer 18 is provided on a portion corresponding, on the organic base 16, to a surface 11a of the transparent member. The organic base is fixed to the sides 11b and the surface 11a of the transparent member 11 with the adhesive layers 17 and 18.

摘要翻译： 根据本发明，用于保护透明构件11的保护密封件S1由有机基底16，粘合剂层17和具有低粘合力的第二粘合剂层18组成。 粘合剂层17仅设置在有机基底16上的与透明构件的侧面11b对应的边缘上，并且第二粘合剂层18设置在与有机基底16对应的部分上的透明构件的表面11a上 会员。 有机基底用粘合剂层17和18固定在透明构件11的侧面11b和表面11a上。

公开(公告)号：US07580075B2

公开(公告)日：2009-08-25

申请号：US10958500

申请日：2004-10-06

申请人： Masanori Minamio ,  Tetsushi Nishio ,  Kenji Tsuji

发明人： Masanori Minamio ,  Tetsushi Nishio ,  Kenji Tsuji

IPC分类号： H04N5/225 ,  H01L21/00

CPC分类号： H01L27/14625 ,  H01L24/97 ,  H01L27/14618 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A lead frame is buried in mold resin to form a mold structure. A wide blade is used to make an indentation having an alignment step in the mold structure. Then, a narrow blade is used to split the mold structure. At the outer perimeter portion of a base which is a separate part separated from the mold structure, an alignment step is formed. Due to the alignment step, an optical element, such as a mirror tube of an imaging optical system, or the like, is readily and quickly attached.

摘要翻译： 引线框架埋在模具树脂中以形成模具结构。 使用宽刀片来制造在模具结构中具有对准步骤的压痕。 然后，使用窄刀片分割模具结构。 在与模具结构分离的单独部分的基部的外周部分处，形成对准步骤。 由于对准步骤，容易且快速地附接诸如成像光学系统的镜管的光学元件等。

公开(公告)号：US20090184335A1

公开(公告)日：2009-07-23

申请号：US12244324

申请日：2008-10-02

申请人： Yoshiki Takayama ,  Masanori Minamio ,  Tetsushi Nishio

发明人： Yoshiki Takayama ,  Masanori Minamio ,  Tetsushi Nishio

IPC分类号： H01L33/00 ,  H01L31/0232

CPC分类号： H01L31/0203 ,  H01L33/54 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optical semiconductor device includes: a package having a bottom portion and a sidewall portion; a semiconductor chip having an optical element formed on one surface thereof and having an opposite surface to the one surface fixed to the bottom portion of the package; a transparent member fixed to the semiconductor chip so as to cover the optical element; and a sealing resin filling a space between the package and the semiconductor chip. The sidewall portion has in an upper part thereof an overhang portion that projects toward inside of the package. The transparent member is exposed from a window portion formed by the overhang portion.

摘要翻译： 光学半导体器件包括：具有底部和侧壁部分的封装; 半导体芯片，其具有在其一个表面上形成并且具有与固定到封装的底部的一个表面相对的表面的光学元件; 固定到所述半导体芯片以便覆盖所述光学元件的透明构件; 以及填充封装和半导体芯片之间的空间的密封树脂。 侧壁部分的上部具有向包装内部突出的突出部分。 透明构件从由突出部形成的窗口部露出。

公开(公告)号：US07511367B2

公开(公告)日：2009-03-31

申请号：US11111706

申请日：2005-04-22

申请人： Masanori Minamio

发明人： Masanori Minamio

IPC分类号： H01L23/02

CPC分类号： H01L27/14618 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/14 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： An optical device includes: a base 10; an optical element chip 5 mounted on the base 10; an integrated circuit chip 50 bonded to the back surface of the optical element chip 5; and a transparent member (window member 6). An interconnect 12 is buried in the base 10. The interconnect 12 has an inner terminal portion 12a, an outer terminal portion 12b and an intermediate terminal portion 12c. Pad electrodes 5b on the optical element chip 5 are connected to the inner terminal portion 12a via bumps 8. Pad electrodes 50b on the integrated circuit chip 50 are connected to the intermediate terminal portion 12c via fine metal wires 52. The integrated circuit chip 50 equipped with peripheral circuits and other circuits and the optical element chip 5 are combined into one package.

摘要翻译： 光学装置包括：基座10; 安装在基座10上的光学元件芯片5; 结合到光学元件芯片5的背面的集成电路芯片50; 和透明构件（窗构件6）。 互连12埋在基座10中。互连件12具有内端子部分12a，外端子部分12b和中间端子部分12c。 光学元件芯片5上的衬垫电极5b通过凸块8连接到内部端子部分12a上。集成电路芯片50上的焊盘电极50b通过细金属线52连接到中间端子部分12c上。集成电路芯片50配备 外围电路和其他电路以及光学元件芯片5组合成一个封装。

公开(公告)号：US07273765B2

公开(公告)日：2007-09-25

申请号：US10676186

申请日：2003-09-30

申请人： Masanori Minamio ,  Kouichi Yamauchi

发明人： Masanori Minamio ,  Kouichi Yamauchi

IPC分类号： H01L21/00

CPC分类号： H01L27/14618 ,  H01L24/97 ,  H01L27/14683 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/16195 ,  H01L2924/00014 ,  H01L2924/00

摘要： A solid-state imaging device includes: a planar substrate; an imaging element fixed onto the substrate; a rib provided on the substrate so as to surround the imaging element; a transparent plate fixed to a top face of the rib; a plurality of wirings for conducting electricity from inside of a package to outside of the same, the package being composed of the substrate, the rib and the transparent plate; and thin metal wires for connecting electrodes of the imaging element with the respective wirings. Each of the wirings includes: an internal electrode disposed on a surface with the imaging element mounted thereon; an external electrode disposed on a rear surface of the imaging-element mounted surface and at a position corresponding to the internal electrode and an end face electrode disposed on an end face of the substrate, for connecting the internal electrode and the external electrode. An end face of the substrate, a side face of the rib and an end face of the transparent plate form a substantially coplanar surface. The structure of the substrate having an external terminal is simple, thus facilitating the miniaturization of the device.

摘要翻译： 固态成像装置包括：平面基板; 固定在基板上的成像元件; 设置在所述基板上以围绕所述成像元件的肋; 固定到所述肋的顶面的透明板; 多个用于从封装内部向外部引导电力的布线，所述封装由所述基板，所述肋和所述透明板构成; 以及用于将成像元件的电极与各个配线连接的细金属线。 每个布线包括：设置在其上安装有成像元件的表面上的内部电极; 设置在所述摄像元件安装面的背面和与所述内部电极对应的位置的外部电极和设置在所述基板的端面上的端面电极，用于连接所述内部电极和所述外部电极。 基板的端面，肋的侧面和透明板的端面形成基本上共面的表面。 具有外部端子的衬底的结构简单，从而有助于器件的小型化。

公开(公告)号：US07265340B2

公开(公告)日：2007-09-04

申请号：US11137549

申请日：2005-05-26

申请人： Masanori Minamio ,  Kiyokazu Itoi

发明人： Masanori Minamio ,  Kiyokazu Itoi

IPC分类号： H01L23/08

CPC分类号： H01S5/02208 ,  H01L2224/48091 ,  H01S5/0224 ,  H01L2924/00014

摘要： An optical device comprises a copper plate having an opening; a flexible board placed below the copper plate; a light receiving element substrate placed below the copper plate and mounted on a wiring pattern of the flexible board via bumps; a light emitting element and a light receiving element both provided at the principal surface of the light receiving element substrate; and a supporting frame supporting the flexile board in a downwardly posture. The supporting frame fixes the flexible board and the copper plate. Therefore, a thin optical device can be realized without employing a resin mold structure.

摘要翻译： 光学装置包括具有开口的铜板; 放置在铜板下面的柔性板; 光接收元件基板，设置在铜板的下方，通过凸块安装在柔性基板的布线图案上; 在所述受光元件基板的主面设置有发光元件和受光元件， 以及以向下姿势支撑柔性板的支撑框架。 支撑框架固定了柔性板和铜板。 因此，可以在不使用树脂模具结构的情况下实现薄的光学装置。

公开(公告)号：US07154156B2

公开(公告)日：2006-12-26

申请号：US10676135

申请日：2003-09-30

申请人： Masanori Minamio ,  Mutsuo Tsuji ,  Kouichi Yamauchi

发明人： Masanori Minamio ,  Mutsuo Tsuji ,  Kouichi Yamauchi

IPC分类号： H01L27/14 ,  H01L31/00

CPC分类号： H01L27/14618 ,  H01L2224/16225 ,  H01L2924/00014 ,  Y10T29/49121 ,  Y10T29/49158 ,  Y10T29/49167 ,  Y10T29/49176 ,  Y10T29/49204 ,  Y10T29/4922 ,  H01L2224/0401

摘要： A solid-state imaging device includes: a base made of an insulation material and having a frame form in planar shape with an aperture formed at an inner region; a plurality of wirings provided on one surface of the base and extending toward an outer periphery of the base from a region along the aperture; and an imaging element mounted on the surface of the base with wirings provided thereon so that a light-receptive region of the imaging element faces the aperture. An end portion on the aperture side of each of the plurality of wirings forms an internal terminal portion and an end portion on the outer peripheral side of each of the plurality of wirings forms an external terminal portion, the internal terminal portion of the wiring being connected electrically with an electrode of the imaging element. The wirings are made of thin metal plate leads, the base is made up of a resin molded member in which the thin metal plate leads are embedded, and at least a part of a side edge face of the thin metal plate leads is embedded in the base. The rigidity of the base is enhanced by the thin metal plate leads, thus reducing a curl and a warp of the base.

摘要翻译： 一种固态成像装置，包括：由绝缘材料制成的底座，具有平面形状的框架形状，其内部形成有孔; 多个布线设置在基座的一个表面上，并沿着孔径从基座的外周延伸; 以及安装在基座表面上的成像元件，其上设置有布线，使得成像元件的光接收区域面向孔。 多个布线中的每一个的开口侧的端部形成内部端子部，多个布线的外周侧的端部形成外部端子部，布线的内部端子部分被连接 与成像元件的电极电连接。 所述布线由薄金属板引线构成，所述基座由嵌入所述薄金属板引线的树脂模制构件构成，并且所述薄金属板引线的侧边缘的至少一部分嵌入所述 基础。 通过薄金属板引线增强基座的刚性，从而减小基部的卷曲和翘曲。

公开(公告)号：US20050168845A1

公开(公告)日：2005-08-04

申请号：US10962594

申请日：2004-10-13

申请人： Masanori Minamio ,  Hikaru Sano ,  Kenji Furumoto

发明人： Masanori Minamio ,  Hikaru Sano ,  Kenji Furumoto

IPC分类号： G02B5/32 ,  H01L23/02 ,  H01L27/14 ,  H01L27/146 ,  H01L31/02 ,  H01L31/0203 ,  H04N5/335 ,  H04N5/372 ,  G02B7/02

CPC分类号： H01L27/14618 ,  H01L31/0203 ,  H01L2224/16

摘要： An optical device includes a base of ring shape, and a light emitting/receiving element and a transparent plate both attached to the base. A side face of the opening of the base is formed to have a taper serving as a draft for a molding resin. A side surface of the transparent plate is formed to have a taper widened upwardly and corresponding to the draft. These side face and surface engage each other with an adhesive layer interposed therebetween. A hologram may be mounted instead of the transparent plate.

摘要翻译： 光学装置包括环形基座，以及连接到基座的发光/接收元件和透明板。 基座的开口的侧面形成为具有用于模塑树脂的牵伸的锥形。 透明板的侧表面形成为具有向上加宽并对应于牵伸的锥形。 这些侧面和表面之间夹有粘合剂层彼此接合。 可以安装全息图而不是透明板。

公开(公告)号：US20050167855A1

公开(公告)日：2005-08-04

申请号：US11090011

申请日：2005-03-28

申请人： Masanori Minamio ,  Toru Nomura

发明人： Masanori Minamio ,  Toru Nomura

IPC分类号： H01L23/28 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L21/44

CPC分类号： H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A resin-encapsulation semiconductor device of this invention includes a die pad for mounting a semiconductor element; a plurality of supporting leads; a semiconductor element; a plurality of leads disposed to have tips thereof opposing the die pad; metal wires; and an encapsulation resin for encapsulating the die pad excluding a bottom thereof, the leads excluding bottoms and outside edges thereof, connecting regions with the metal wires, the supporting leads and the semiconductor element. The outside edges of the leads are disposed on substantially the same plane as the side face of the encapsulation resin, and the tip of each lead has a thin portion where the thickness is reduced in an upper face thereof.

摘要翻译： 本发明的树脂封装半导体器件包括用于安装半导体元件的管芯焊盘; 多个支撑引线; 半导体元件 多个引线，其设置成具有与所述管芯焊盘相对的尖端; 金属线; 以及用于封装除了底部之外的芯片焊盘的封装树脂，不包括底部和外部边缘的引线，与金属线，支撑引线和半导体元件的连接区域。 引线的外缘设置在与封装树脂的侧面基本相同的平面上，并且每个引线的尖端具有其上部厚度减小的薄部分。

公开(公告)号：US20050151242A1

公开(公告)日：2005-07-14

申请号：US11029785

申请日：2005-01-05

申请人： Haruto Nagata ,  Masanori Minamio ,  Hiroshi Horiki

发明人： Haruto Nagata ,  Masanori Minamio ,  Hiroshi Horiki

IPC分类号： H01L23/50 ,  H01L23/10 ,  H01L23/12 ,  H01L23/28 ,  H01L23/31 ,  H01L23/34 ,  H01L23/433 ,  H01L23/495

CPC分类号： H01L23/49503 ,  H01L23/3107 ,  H01L23/4334 ,  H01L24/48 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor chip is mounted on an upper surface of the heat sink plate that is provided with a plurality of heat releasing terminals on a lower surface of the heat releasing. A plurality of electric signal terminals are regularly disposed in a lattice-like manner around the heat sink plate. Lower end surfaces of the electric signal terminals and the heat releasing terminals are exposed from and sealed with a sealing resin. The heat sink plate is formed as an integrated body including a protruding portion that protrudes from a central portion of an upper surface and supports the semiconductor chip, a plurality of supporting portions that are positioned around a rear surface of the protruding portion so as to support the protruding portion and that are exposed at a rear surface of the sealing resin, the plurality of heat releasing terminals, and a thin-walled portion that is recessed from lower end surfaces of the supporting portions and the heat releasing terminals. Lower surfaces of the protruding portion and the thin-walled portion are covered with the sealing resin. The plurality of supporting portions are disposed so that they are continuous with the protruding portion and symmetrical to each other around the protruding portion. A degree of freedom is improved in board wiring below the heat sink plate in a land grid array type package.

摘要翻译： 半导体芯片安装在散热板的上表面上，在散热板的下表面上设置有多个散热端子。 多个电信号端子以格子状规则地布置在散热板周围。 电信号端子和散热端子的下端面由密封树脂露出并密封。 散热板形成为一体，该突出部具有从上表面的中央部突出并支撑半导体芯片的突出部，多个支撑部，其位于突出部的后表面周围，以支撑 突出部分暴露在密封树脂的后表面，多个散热端子以及从支撑部分和散热端子的下端表面凹入的薄壁部分。 突出部分和薄壁部分的下表面被密封树脂​​覆盖。 多个支撑部分被布置成使得它们与突出部分连续并且围绕突出部分彼此对称。 在平台栅格阵列型封装中的散热板下面的板布线中的自由度得到改善。