公开(公告)号：US20090140405A1

公开(公告)日：2009-06-04

申请号：US12210490

申请日：2008-09-15

申请人： Tetsumasa Maruo ,  Masanori Minamio ,  Kiyokazu Itoi

发明人： Tetsumasa Maruo ,  Masanori Minamio ,  Kiyokazu Itoi

IPC分类号： H01L23/02

CPC分类号： H01L23/10 ,  H01L23/055 ,  H01L24/45 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device includes: a semiconductor element; a package body having the semiconductor element bonded inside thereof and electrically connected to the semiconductor element; a lid-like member covering the semiconductor element, and bonded to the package body to form a hollow structure; and a bonding member for bonding the package body and the lid-like member to each other. The bonding member is a resin adhesive containing an epoxy resin, a polymerization initiator, and a filling material, and a content of the filling material in the bonding member is 30 wt % to 60 wt %.

摘要翻译： 半导体器件包括：半导体元件; 封装体，其内部具有半导体元件，并与半导体元件电连接; 覆盖半导体元件的盖状构件，并且结合到封装主体以形成中空结构; 以及用于将封装体和盖状构件彼此接合的接合构件。 接合部件是含有环氧树脂，聚合引发剂和填充材料的树脂粘合剂，接合部件中的填充材料的含量为30重量％〜60重量％。

公开(公告)号：US20070206455A1

公开(公告)日：2007-09-06

申请号：US11708472

申请日：2007-02-21

申请人： Masanori Minamio ,  Yutaka Harada ,  Kiyokazu Itoi ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Yutaka Harada ,  Kiyokazu Itoi ,  Toshiyuki Fukuda

IPC分类号： G11B7/00

CPC分类号： H01L27/14618 ,  H01L24/97 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  Y10T29/49117 ,  H01L2224/85 ,  H01L2924/00014

摘要： An optical device includes a substrate, an optical element, a translucent component, a plurality of first terminals and a sealant. The sealant is located lower than the top surface of the translucent component. The top surface of the translucent component is exposed out of the sealant, while the side surface of the translucent component is covered with the sealant.

摘要翻译： 光学装置包括基板，光学元件，半透明部件，多个第一端子和密封剂。 密封剂位于比半透明组件的顶表面更低的位置。 半透明部件的顶面从密封剂露出，而半透明部件的侧表面被密封剂覆盖。

公开(公告)号：US07834926B2

公开(公告)日：2010-11-16

申请号：US11540753

申请日：2006-10-02

申请人： Masanori Minamio ,  Tomoko Komatsu ,  Kiyokazu Itoi ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Tomoko Komatsu ,  Kiyokazu Itoi ,  Toshiyuki Fukuda

IPC分类号： H04N5/225 ,  G02B26/00 ,  G02F1/00 ,  H01L21/00

CPC分类号： H01L27/14623 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14683 ,  H01L27/14685 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/16235 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor image sensing element has a semiconductor element including an image sensing area, a peripheral circuit region, a plurality of electrode portions provided in the peripheral circuit region, and a plurality of micro-lenses provided on the image sensing area and an optical member having a configuration covering at least the image sensing area and bonded over the micro-lenses via a transparent bonding member. The side surface region of the optical member is formed with a light shielding film for preventing the irradiation of the image sensing area with a reflected light beam or a scattered light beam from the side surface region.

摘要翻译： 半导体图像感测元件具有包括图像感测区域，外围电路区域，设置在外围电路区域中的多个电极部分和设置在图像感测区域上的多个微透镜的半导体元件和具有 至少覆盖图像感测区域并通过透明结合部件粘合在微透镜上的构造。 光学构件的侧表面区域形成有用于防止来自侧表面区域的反射光束或散射光束照射摄像区域的遮光膜。

公开(公告)号：US20080001240A1

公开(公告)日：2008-01-03

申请号：US11710571

申请日：2007-02-26

申请人： Masanori Minamio ,  Tetsumasa Maruo ,  Kiyokazu Itoi ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Tetsumasa Maruo ,  Kiyokazu Itoi ,  Toshiyuki Fukuda

IPC分类号： H01L31/0203 ,  H01L21/00

CPC分类号： H01L27/14618 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L27/14683 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4807 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48453 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/48997 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/16315 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48455 ,  H01L2924/20752

摘要： A solid state image pickup device 1 includes a substrate 10 on which a solid state image pickup element 14 is mounted and a transparent component 11. A polymerization initiator for bonding the substrate 10 and the transparent component 11 is onium salt having a halogen-containing aromatic compound as an anion.

摘要翻译： 固态图像拾取装置1包括其上安装有固态图像拾取元件14的基板10和透明部件11。 用于接合基板10和透明部件11的聚合引发剂是具有含卤素的芳族化合物作为阴离子的鎓盐。

公开(公告)号：US07294907B2

公开(公告)日：2007-11-13

申请号：US10876839

申请日：2004-06-25

申请人： Masanori Minamio ,  Kouichi Yamauchi ,  Kenichi Nishiyama ,  Kiyokazu Itoi

发明人： Masanori Minamio ,  Kouichi Yamauchi ,  Kenichi Nishiyama ,  Kiyokazu Itoi

IPC分类号： H01L29/40

CPC分类号： H01L27/14618 ,  H01L24/97 ,  H01L31/02002 ,  H01L31/0203 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/07802 ,  H01L2924/15151 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A solid-state imaging device includes a housing having a resin-molded base and ribs; metal lead pieces embedded in the housing, the metal lead pieces each having an inner terminal portion facing an inner space of the housing, an outer terminal portion exposed at a bottom surface of the housing, and a lateral electrode portion exposed at an outer lateral surface of the housing; an imaging element fixed on the base in the inner space; connecting members connecting electrodes of the imaging element respectively to the inner terminal portions; and a transparent plate fixed to an upper surface of the ribs. The die pad having a through hole is embedded in a center portion of the base so that the die pad's upper and lower surfaces are exposed, and the imaging element is fixed on the die pad. A ventilation hole to the inner space of the housing that is formed in one piece with a resin can be formed easily with a simple configuration.

摘要翻译： 固态成像装置包括具有树脂模制基座和肋条的外壳; 嵌入壳体中的金属引线片，金属引线片各自具有面向壳体的内部空间的内部端子部分，暴露在壳体的底部表面的外部端子部分和暴露在外侧表面的侧面电极部分 的住房; 固定在所述内部空间中的基座上的成像元件; 连接构件将摄像元件的电极分别连接到内端子部分; 以及固定到肋的上表面的透明板。 具有通孔的管芯焊盘嵌入基座的中心部分，使得裸片焊盘的上表面和下表面露出，并将成像元件固定在芯片焊盘上。 能够以简单的结构容易地形成到与树脂一体形成的壳体的内部空间的通气孔。

公开(公告)号：US20110083322A1

公开(公告)日：2011-04-14

申请号：US12970407

申请日：2010-12-16

申请人： Masanori MINAMIO ,  Yutaka Harada ,  Kiyokazu Itoi ,  Toshiyuki Fukuda

发明人： Masanori MINAMIO ,  Yutaka Harada ,  Kiyokazu Itoi ,  Toshiyuki Fukuda

IPC分类号： H01R43/00

CPC分类号： H01L27/14618 ,  H01L24/97 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  Y10T29/49117 ,  H01L2224/85 ,  H01L2924/00014

摘要： An optical device includes a substrate, an optical element, a translucent component, a plurality of first terminals and a sealant. The sealant is located lower than the top surface of the translucent component. The top surface of the translucent component is exposed out of the sealant, while the side surface of the translucent component is covered with the sealant.

摘要翻译： 光学装置包括基板，光学元件，半透明部件，多个第一端子和密封剂。 密封剂位于比半透明组件的顶表面更低的位置。 半透明部件的顶面从密封剂露出，而半透明部件的侧表面被密封剂覆盖。

公开(公告)号：US07265340B2

公开(公告)日：2007-09-04

申请号：US11137549

申请日：2005-05-26

申请人： Masanori Minamio ,  Kiyokazu Itoi

发明人： Masanori Minamio ,  Kiyokazu Itoi

IPC分类号： H01L23/08

CPC分类号： H01S5/02208 ,  H01L2224/48091 ,  H01S5/0224 ,  H01L2924/00014

摘要： An optical device comprises a copper plate having an opening; a flexible board placed below the copper plate; a light receiving element substrate placed below the copper plate and mounted on a wiring pattern of the flexible board via bumps; a light emitting element and a light receiving element both provided at the principal surface of the light receiving element substrate; and a supporting frame supporting the flexile board in a downwardly posture. The supporting frame fixes the flexible board and the copper plate. Therefore, a thin optical device can be realized without employing a resin mold structure.

摘要翻译： 光学装置包括具有开口的铜板; 放置在铜板下面的柔性板; 光接收元件基板，设置在铜板的下方，通过凸块安装在柔性基板的布线图案上; 在所述受光元件基板的主面设置有发光元件和受光元件， 以及以向下姿势支撑柔性板的支撑框架。 支撑框架固定了柔性板和铜板。 因此，可以在不使用树脂模具结构的情况下实现薄的光学装置。

公开(公告)号：US20070109439A1

公开(公告)日：2007-05-17

申请号：US11540753

申请日：2006-10-02

申请人： Masanori Minamio ,  Tomoko Komatsu ,  Kiyokazu Itoi ,  Toshiyuki Fukuda

发明人： Masanori Minamio ,  Tomoko Komatsu ,  Kiyokazu Itoi ,  Toshiyuki Fukuda

IPC分类号： H04N5/225

CPC分类号： H01L27/14623 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L27/14683 ,  H01L27/14685 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/16235 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor image sensing element has a semiconductor element including an image sensing area, a peripheral circuit region, a plurality of electrode portions provided in the peripheral circuit region, and a plurality of micro-lenses provided on the image sensing area and an optical member having a configuration covering at least the image sensing area and bonded over the micro-lenses via a transparent bonding member. The side surface region of the optical member is formed with a light shielding film for preventing the irradiation of the image sensing area with a reflected light beam or a scattered light beam from the side surface region.

摘要翻译： 半导体图像感测元件具有包括图像感测区域，外围电路区域，设置在外围电路区域中的多个电极部分和设置在图像感测区域上的多个微透镜的半导体元件和具有 至少覆盖图像感测区域并通过透明结合部件粘合在微透镜上的构造。 光学构件的侧表面区域形成有用于防止来自侧表面区域的反射光束或散射光束照射摄像区域的遮光膜。

公开(公告)号：US20050274882A1

公开(公告)日：2005-12-15

申请号：US11137549

申请日：2005-05-26

申请人： Masanori Minamio ,  Kiyokazu Itoi

发明人： Masanori Minamio ,  Kiyokazu Itoi

IPC分类号： H01L27/14 ,  H01J5/02 ,  H01L23/12 ,  H01L23/28 ,  H01L31/02 ,  H01S5/022

CPC分类号： H01S5/02208 ,  H01L2224/48091 ,  H01S5/0224 ,  H01L2924/00014

摘要： An optical device comprises a copper plate having an opening; a flexible board placed below the copper plate; a light receiving element substrate placed below the copper plate and mounted on a wiring pattern of the flexible board via bumps; a light emitting element and a light receiving element both provided at the principal surface of the light receiving element substrate; and a supporting frame supporting the flexile board in a downwardly posture. The supporting frame fixes the flexible board and the copper plate. Therefore, a thin optical device can be realized without employing a resin mold structure.

摘要翻译： 光学装置包括具有开口的铜板; 放置在铜板下面的柔性板; 光接收元件基板，设置在铜板的下方，通过凸块安装在柔性基板的布线图案上; 在所述受光元件基板的主面设置有发光元件和受光元件， 以及以向下姿势支撑柔性板的支撑框架。 支撑框架固定了柔性板和铜板。 因此，可以在不使用树脂模具结构的情况下实现薄的光学装置。

公开(公告)号：US20050001219A1

公开(公告)日：2005-01-06

申请号：US10876839

申请日：2004-06-25

申请人： Masanori Minamio ,  Kouichi Yamauchi ,  Kenichi Nishiyama ,  Kiyokazu Itoi

发明人： Masanori Minamio ,  Kouichi Yamauchi ,  Kenichi Nishiyama ,  Kiyokazu Itoi

IPC分类号： H01L27/14 ,  H01L23/02 ,  H01L23/08 ,  H01L31/02 ,  H01L31/0203 ,  H04N5/335 ,  H04N5/372 ,  H01L27/15

CPC分类号： H01L27/14618 ,  H01L24/97 ,  H01L31/02002 ,  H01L31/0203 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/07802 ,  H01L2924/15151 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A solid-state imaging device includes a housing having a resin-molded base and ribs; metal lead pieces embedded in the housing, the metal lead pieces each having an inner terminal portion facing an inner space of the housing, an outer terminal portion exposed at a bottom surface of the housing, and a lateral electrode portion exposed at an outer lateral surface of the housing; an imaging element fixed on the base in the inner space; connecting members connecting electrodes of the imaging element respectively to the inner terminal portions; and a transparent plate fixed to an upper surface of the ribs. The die pad having a through hole is embedded in a center portion of the base so that the die pad's upper and lower surfaces are exposed, and the imaging element is fixed on the die pad. A ventilation hole to the inner space of the housing that is formed in one piece with a resin can be formed easily with a simple configuration.

摘要翻译： 固态成像装置包括具有树脂模制基座和肋条的外壳; 嵌入壳体中的金属引线片，金属引线片各自具有面向壳体的内部空间的内部端子部分，暴露在壳体的底部表面的外部端子部分和暴露在外侧表面的侧面电极部分 的住房; 固定在所述内部空间中的基座上的成像元件; 连接构件将摄像元件的电极分别连接到内端子部分; 以及固定到肋的上表面的透明板。 具有通孔的管芯焊盘嵌入基座的中心部分，使得裸片焊盘的上表面和下表面露出，并将成像元件固定在芯片焊盘上。 能够以简单的结构容易地形成到与树脂一体形成的壳体的内部空间的通气孔。