摘要:
Semiconductor devices include a first gate pattern on a first active area of a semiconductor substrate. The first gate pattern has a top width that is substantially the same as or less than a bottom width of the first gate pattern. A second gate pattern is provided on a second active area of the semiconductor substrate. The second gate pattern has a top width that is wider than a bottom width of the second gate pattern. Semiconductor device are fabricated by forming a first gate pattern on a first gate insulation layer formed on a first active region of a semiconductor substrate. A mask insulation layer is formed on the semiconductor substrate that includes the first gate pattern. First and second gate openings respectively exposing second and third active regions of the semiconductor substrate are formed by patterning the mask insulation layer. Second and third gate insulation layers respectively are formed on second and third active regions exposed in the first and second gate openings. Second and third gate patterns are formed in the first and second gate openings respectively and the mask insulation layer is removed.
摘要:
Example embodiments relate to a semiconductor device and a method of fabricating the same. The device may include a semiconductor substrate including a peripheral region and a cell array region, wherein the substrate in the cell array region may be recessed lower than the peripheral region, a plurality of cell transistor layers stacked in the cell array region, and a plurality of peripheral circuit transistors formed in the peripheral region. The cell transistor layers may be formed in the cell array region at a lower level than the peripheral region.
摘要:
An interconnection structure is provided by foiling a first damascene interconnect structure that directly connects a first active area in a substrate, a first conductive line on the substrate and/or a first electrode on the substrate with a second active area in the substrate, a second conductive line on the substrate and/or a second electrode on the substrate. A second damascene interconnect structure may directly connect the first active area, the first conductive line and/or the first electrode to the second active area, the second conductive line and/or the second electrode. The first active area, the first conductive line and/or the first electrode connected to the second active area, the second conductive line and/or the second electrode by the first damascene interconnect structure may be different from the first active area, the first conductive line and/or the first electrode and the second active area, the second conductive line and/or the second electrode connected by the second damascene interconnect structure.
摘要:
A semiconductor memory device is disclosed. The device is comprised of a plurality of word lines; a plurality of bit lines arranged in perpendicular to the word lines. In addition, a plurality of supply voltage lines extend in the same direction as the bit lines. Also, a plurality of first ground voltage lines are arranged in the same direction as the bit lines. Further, a plurality of second ground voltage lines are arranged in the same direction as the word lines. A plurality of memory cells are each connected between one of the word lines and one of the bit lines. Here, the ground voltage lines are arranged in a matrix shape to reduce the resistance of the ground voltage line and secure the margin between the supply voltage level and the ground voltage level of the data latched by the memory cells to thereby prevent an operational failure of the device.
摘要:
A method of forming a crystalline thin film from an amorphous semiconductor thin film such as amorphous silicon, by providing a generally planar nucleation inducing member, such as a crystalline silicon wafer, having a number of micro-scale surface contact points and with a hardness equal to or greater than the hardness of the amorphous semiconductor thin film, contacting under pressure the surface contact points of the nucleation inducing member with the exposed surface of the amorphous thin film to form an assembly, annealing the assembly at between 300 to 700 degrees C. for 1 to 24 hours to crystallize the amorphous thin film, and removing the nucleation inducing member.
摘要:
A semiconductor device and method for arranging and manufacturing the same are disclosed. The semiconductor device includes a plurality of inverters including at least one first pull-up transistor and first pull-down transistor and inverting and outputting an input signal, respectively; and a plurality of NAND gates including at least two second pull-up transistor and second pull-down transistor and generating an output signal having a high level if at least one of at least two input signals has a low level, respectively, wherein the at least one first pull-up transistor and first pull-down transistor and the at least two second pull-up transistor and second pull-down transistor are stacked and arranged on at least two layers.
摘要:
A semiconductor device and method for arranging and manufacturing the same are disclosed. The semiconductor device includes a plurality of inverters including at least one first pull-up transistor and first pull-down transistor and inverting and outputting an input signal, respectively; and a plurality of NAND gates including at least two second pull-up transistor and second pull-down transistor and generating an output signal having a high level if at least one of at least two input signals has a low level, respectively, wherein the at least one first pull-up transistor and first pull-down transistor and the at least two second pull-up transistor and second pull-down transistor are stacked and arranged on at least two layers.
摘要:
A transistor includes a substrate and a device isolation layer that is formed on the substrate to define an active region. A gate pattern crosses over the active region. A gate insulation layer is interposed between the gate pattern and the active region. Source and drain regions are formed in the active region adjacent to respective sides of the gate pattern. A channel region is disposed in the active region between the source and drain regions. The channel region includes a recessed portion.
摘要:
A transistor includes a substrate and a device isolation layer that is formed on the substrate to define an active region. A gate pattern crosses over the active region. A gate insulation layer is interposed between the gate pattern and the active region. Source and drain regions are formed in the active region adjacent to respective sides of the gate pattern. A channel region is disposed in the active region between the source and drain regions. The channel region includes a recessed portion.
摘要:
Semiconductor devices and methods of fabricating semiconductor devices that include a substrate and a device isolation layer in the substrate that defines an active region of the substrate are provided. The device isolation layer has a vertically protruding portion having a sidewall that extends vertically beyond a surface of the substrate. An epitaxial layer is provided on the surface of the substrate in the active region and extends onto the device isolation layer. The epitaxial layer is spaced apart from the sidewall of the vertically protruding portion of the device isolation layer. A gate pattern is provided on the epitaxial layer and source/drain regions are provided in the epitaxial layer at opposite sides of the gate pattern.