公开(公告)号：US08598013B2

公开(公告)日：2013-12-03

申请号：US12247470

申请日：2008-10-08

申请人： Shunpei Yamazaki ,  Hideto Ohnuma ,  Yoichi Iikubo ,  Yoshiaki Yamamoto ,  Kenichiro Makino

发明人： Shunpei Yamazaki ,  Hideto Ohnuma ,  Yoichi Iikubo ,  Yoshiaki Yamamoto ,  Kenichiro Makino

IPC分类号： H01L21/30 ,  H01L21/46

CPC分类号： H01L27/1266 ,  H01L21/76254 ,  H01L27/1214 ,  H01L29/66772

摘要： To provide a method for manufacturing an SOI substrate provided with a semiconductor layer which can be used practically even when a substrate having a low heat-resistant temperature, such as a glass substrate or the like is used. The semiconductor layer is transferred to a supporting substrate by the steps of irradiating a semiconductor wafer with ions from one surface to form a damaged layer; forming an insulating layer over one surface of the semiconductor wafer; attaching one surface of the supporting substrate to the insulating layer formed over the semiconductor wafer and performing heat treatment to bond the supporting substrate to the semiconductor wafer; and performing separation at the damaged layer into the semiconductor wafer and the supporting substrate. The damaged layer remaining partially over the semiconductor layer is removed by wet etching and a surface of the semiconductor layer is irradiated with a laser beam.

摘要翻译： 为了提供一种制造具有半导体层的SOI衬底的方法，即使使用诸如玻璃衬底等的耐热温度低的衬底也可以实际使用。 通过以下步骤将半导体层转移到支撑衬底：从一个表面照射半导体晶片以形成损伤层; 在所述半导体晶片的一个表面上形成绝缘层; 将所述支撑基板的一个表面附接到形成在所述半导体晶片上的绝缘层，并进行热处理以将所述支撑基板接合到所述半导体晶片; 并且在所述损伤层处进行到所述半导体晶片和所述支撑基板的分离。 通过湿蚀刻除去半导体层上部分残留的损伤层，并用激光束照射半导体层的表面。

公开(公告)号：US08188402B2

公开(公告)日：2012-05-29

申请号：US12153646

申请日：2008-05-22

申请人： Koichiro Tanaka ,  Yoshiaki Yamamoto ,  Takatsugu Omata

发明人： Koichiro Tanaka ,  Yoshiaki Yamamoto ,  Takatsugu Omata

IPC分类号： B23K26/02

CPC分类号： H01L21/02683 ,  B23K26/0853 ,  B23K2101/40 ,  H01L21/02686 ,  H01L21/2026 ,  H01L27/1285

摘要： The invention relates to a laser treatment apparatus including a laser oscillator, an interlock provided in the laser oscillator, a movable table which moves with a certain movement period, a timer, an interlock provided in the timer, a sensor which can detect movement of the movable table, and a computer, in which the timer starts measuring time when the sensor senses passage of the movable table, and when the movable table does not pass the sensor even after the movement period, conduction between contacts of the interlock provided in the timer is blocked to operate the interlock in the laser oscillator, thereby stopping laser output. The invention also relates to a laser treatment method using the laser treatment apparatus.

摘要翻译： 本发明涉及一种激光治疗装置，包括激光振荡器，设置在激光振荡器中的联锁装置，以一定运动周期移动的可移动工作台，定时器，定时器中设置的互锁装置，能够检测 活动台和计算机，其中定时器开始测量时间，当传感器感测到可移动台的通过时，并且当移动台甚至在移动时段之后也不通过传感器时，设置在定时器中的互锁装置的触点之间的传导 被阻止在激光振荡器中操作互锁，从而停止激光输出。 本发明还涉及使用激光治疗装置的激光治疗方法。

公开(公告)号：US07807567B2

公开(公告)日：2010-10-05

申请号：US11703701

申请日：2007-02-08

申请人： Masaya Kawano ,  Yoshiaki Yamamoto ,  Takamasa Ito

发明人： Masaya Kawano ,  Yoshiaki Yamamoto ,  Takamasa Ito

IPC分类号： H01L21/4763

CPC分类号： H01L23/5226 ,  H01L21/76804 ,  H01L21/76808 ,  H01L21/76877 ,  H01L23/53238 ,  H01L23/5329 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

摘要： The semiconductor device of the present invention includes a first interconnection, a via-plug that is connected to the first interconnection, and a second interconnection that is formed as a single unit with the via-plug. The cross-sectional shape of the via-plug is such that the plug sidewall angle, which indicates the angle of the via-plug sidewall with respect to the surface of the first interconnection, is a positive angle; and moreover, at least two points exist between the base and the top of the via-plug on at least one sidewall of the two sidewalls of the cross-sectional shape of the via-plug at which the plug sidewall angle attains a maximum value. Since shapes that would give rise to the occurrence of concentrations of stress are not formed in the via-plug sidewalls, metal is more effectively embedded in the via-hole, and the incidence of voids is prevented.

摘要翻译： 本发明的半导体器件包括第一互连，连接到第一互连的通孔，以及与通孔连接形成为单个单元的第二互连。 通孔塞的横截面形状使得指示通孔塞侧壁相对于第一互连件的表面的角度的插塞侧壁角度为正角度; 此外，在插塞侧壁角达到最大值的过孔塞的横截面形状的两个侧壁的至少一个侧壁上，在通孔塞的基部和顶部之间至少存在两个点。 由于在通孔塞侧壁中不会形成会产生应力集中的形状，所以金属更有效地嵌入到通路孔中，能够防止空隙的发生。

公开(公告)号：US07767859B2

公开(公告)日：2010-08-03

申请号：US11836224

申请日：2007-08-09

申请人： Kazuhiko Amakawa ,  Yoshiaki Yamamoto

发明人： Kazuhiko Amakawa ,  Yoshiaki Yamamoto

IPC分类号： C07C209/48

CPC分类号： B01J23/74 ,  B01J23/868 ,  B01J37/0009 ,  B01J37/03 ,  B01J37/14 ,  B01J37/16 ,  B01J37/18 ,  C07C209/48 ,  Y10S502/52 ,  C07C211/27

摘要： A method of producing a primary amine by the hydrogenation of a nitrile in the presence of a hydrogenation catalyst. The hydrogenation catalyst contains at least one metal selected from the group consisting of nickel, cobalt and iron. Before use in the hydrogenation of nitrile, the hydrogenation catalyst is pretreated with at least one treating agent selected from the group consisting of hydrocarbons, alcohols, ethers, esters and carbon monoxide at 150 to 500° C.

摘要翻译： 通过在氢化催化剂存在下氢化腈制备伯胺的方法。 氢化催化剂含有选自镍，钴和铁中的至少一种金属。 在使用腈加氢之前，在150-500℃下用至少一种选自烃，醇，醚，酯和一氧化碳的处理剂预处理氢化催化剂。

公开(公告)号：US07695985B2

公开(公告)日：2010-04-13

申请号：US10582616

申请日：2005-12-21

申请人： Koichiro Tanaka ,  Yoshiaki Yamamoto

发明人： Koichiro Tanaka ,  Yoshiaki Yamamoto

IPC分类号： H01L21/66

CPC分类号： H01L21/02675 ,  G03F7/70383 ,  H01L21/2026 ,  H01L21/268 ,  H01L27/1266 ,  H01L27/1285 ,  Y10T29/41

摘要： When annealing of a semiconductor film is conducted using a plurality of lasers, each of the distances between laser irradiation regions is different. When a lithography step is conducted in accordance with a marker which is formed over a substrate in advance after the step, light-exposure is not correctly conducted to a portion crystallized by laser. By using a laser irradiation region obtained on a laser irradiation step as a marker, light-exposure is conducted by making a light-exposure position of a stepper coincide with a large grain size region in the laser irradiation region. A large grain size region and a poorly crystalline region are detected by utilizing a thing that scattering intensity of light is different between the large grain size region and the poorly crystalline region, thereby determining a light-exposure position.

摘要翻译： 当使用多个激光器进行半导体膜的退火时，激光照射区域之间的距离各不相同。 当根据在步骤之后预先在衬底上形成的标记进行光刻步骤时，曝光不能正确地传导到通过激光结晶的部分。 通过使用在激光照射步骤中获得的激光照射区域作为标记，通过使激光照射区域中的步进曝光位置与大粒径区域一致来进行曝光。 通过利用在大晶粒尺寸区域和不良结晶区域之间的散射光强度不同的物质来检测大晶粒尺寸区域和不良结晶区域，从而确定曝光位置。

公开(公告)号：US07608527B2

公开(公告)日：2009-10-27

申请号：US11017900

申请日：2004-12-22

申请人： Koichiro Tanaka ,  Yoshiaki Yamamoto

发明人： Koichiro Tanaka ,  Yoshiaki Yamamoto

IPC分类号： H01L21/20 ,  H01L21/36

CPC分类号： H01L21/02686 ,  B23K26/0622 ,  B23K26/0732 ,  B23K26/0736 ,  C30B1/00 ,  C30B13/24 ,  C30B29/06 ,  H01L21/02532 ,  H01L21/2026 ,  H01L27/1285 ,  H01L29/66757

摘要： Even when the laser irradiation is performed under the same condition with the energy distribution of the beam spot shaped as appropriate, the energy given to the irradiated surface is not yet homogeneous. When a semiconductor film is crystallized to form a crystalline semiconductor film using such inhomogeneous irradiation energy, the crystallinity becomes inhomogeneous in this film, and the characteristic of semiconductor elements manufactured using this film varies. In the present invention, an irradiated object formed over a substrate is irradiated with a laser beam having the pulse width that is an order of picosecond (10−12 second) or less.

摘要翻译： 即使当在相同条件下进行激光照射，并且适当地形成束斑的能量分布时，给予照射表面的能量还不均匀。 当使用这种不均匀的照射能量使半导体膜结晶以形成晶体半导体膜时，该膜中的结晶度变得不均匀，并且使用该膜制造的半导体元件的特性变化。 在本发明中，用脉冲宽度为微秒级（10-12秒）以下的激光照射在基板上形成的照射物体。

公开(公告)号：US07551655B2

公开(公告)日：2009-06-23

申请号：US10997868

申请日：2004-11-29

申请人： Koichiro Tanaka ,  Yoshiaki Yamamoto

发明人： Koichiro Tanaka ,  Yoshiaki Yamamoto

IPC分类号： H01S3/10

CPC分类号： H01L21/02686 ,  B23K26/0622 ,  B23K26/064 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/0665 ,  B23K26/0853 ,  H01L21/02691 ,  H01L21/2026

摘要： The object of the present invention is to provide a laser irradiation apparatus being able to enlarge the beam spot to a large degree compared with that of the CW laser, to suppress the thermal damage to the glass substrate, and to form an aggregation of crystal grains including a single crystal extending long in a scanning direction by growing the crystal continuously in the scanning direction. The laser irradiation of the present invention comprises a pulsed laser oscillator, a non-linear optical element for converting the wavelength of the laser light emitted from the pulsed laser oscillator, and an optical system for condensing the laser light whose wavelength is converted on a semiconductor film, wherein the pulsed laser oscillator has a repetition rate in the range of 10 MHz to 100 GHz.

摘要翻译： 本发明的目的是提供一种能够与CW激光相比大幅度地扩大光束点的激光照射装置，以抑制对玻璃基板的热损伤，并且形成晶粒的聚集体 包括通过在扫描方向上连续地生长晶体而沿扫描方向长延伸的单晶。 本发明的激光照射包括脉冲激光振荡器，用于转换从脉冲激光振荡器发射的激光的波长的非线性光学元件，以及用于会聚在半导体上波长被转换的激光的光学系统 膜，其中所述脉冲激光振荡器具有在10MHz至100GHz范围内的重复频率。

公开(公告)号：US20080223838A1

公开(公告)日：2008-09-18

申请号：US12153646

申请日：2008-05-22

申请人： Koichiro Tanaka ,  Yoshiaki Yamamoto ,  Takatsugu Omata

发明人： Koichiro Tanaka ,  Yoshiaki Yamamoto ,  Takatsugu Omata

IPC分类号： B23K26/08 ,  B23K26/00

CPC分类号： H01L21/02683 ,  B23K26/0853 ,  B23K2101/40 ,  H01L21/02686 ,  H01L21/2026 ,  H01L27/1285

摘要： The invention relates to a laser treatment apparatus including a laser oscillator, an interlock provided in the laser oscillator, a movable table which moves with a certain movement period, a timer, an interlock provided in the timer, a sensor which can detect movement of the movable table, and a computer, in which the timer starts measuring time when the sensor senses passage of the movable table, and when the movable table does not pass the sensor even after the movement period, conduction between contacts of the interlock provided in the timer is blocked to operate the interlock in the laser oscillator, thereby stopping laser output. The invention also relates to a laser treatment method using the laser treatment apparatus.

公开(公告)号：US20070151963A1

公开(公告)日：2007-07-05

申请号：US11639416

申请日：2006-12-15

申请人： Koichiro Tanaka ,  Yoshiaki Yamamoto

发明人： Koichiro Tanaka ,  Yoshiaki Yamamoto

IPC分类号： B23K26/04 ,  H01L21/20

CPC分类号： H01L27/1266 ,  B23K26/06 ,  B23K26/0624 ,  B23K26/064 ,  B23K26/0643 ,  B23K26/0652 ,  B23K26/0665 ,  B23K26/0823 ,  B23K26/0838 ,  B23K26/0869 ,  B23K26/0892 ,  B23K26/1438 ,  B23K26/38 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  H01L21/02675 ,  H01L21/2026 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/42384 ,  H01L29/4908

摘要： A laser irradiation apparatus is provided with a laser oscillator, an articulated beam propagator in which a plurality of pipes are connected to each other in an articulated portion, and a course change means of a laser beam in the articulated portion. At least one pipe of the plurality of pipes includes a transfer lens for suppressing stagger of a laser beam in a traveling direction, in each pipe. The articulated portion produces degree of freedom in disposition of a laser oscillator, and the transfer lens enables suppression of change in beam profile.

摘要翻译： 激光照射装置设置有激光振荡器，铰接光束传播器，其中多个管道在铰接部分中彼此连接，并且铰接部分中的激光束的行程改变装置。 多个管道中的至少一个管道包括用于在每个管道中抑制在行进方向上交错的激光束的转移透镜。 关节部分在激光振荡器的配置中产生自由度，并且转印透镜能够抑制光束轮廓的变化。

公开(公告)号：US07229921B2

公开(公告)日：2007-06-12

申请号：US10281306

申请日：2002-10-28

申请人： Nobuo Hironaga ,  Toshiyuki Takewaki ,  Hiroyuki Kunishima ,  Yoshiaki Yamamoto

发明人： Nobuo Hironaga ,  Toshiyuki Takewaki ,  Hiroyuki Kunishima ,  Yoshiaki Yamamoto

IPC分类号： H01L21/44 ,  H01L21/4763

CPC分类号： H01L21/02068 ,  H01L21/02074 ,  H01L21/2855 ,  H01L21/32136 ,  H01L21/76802 ,  H01L21/76807 ,  H01L21/76838 ,  H01L21/76877 ,  H01L21/76889 ,  H01L23/5226 ,  H01L23/53238 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

摘要： In a method of manufacturing a semiconductor device, a first wiring line composed of a copper containing metal film is formed on or above a semiconductor substrate. A first interlayer insulating film is formed on a whole surface of the semiconductor substrate to cover the first wiring line. The first interlayer insulating film is selectively removed to form a connection hole reaching the first wiring line. A barrier metal film is formed to cover an inner surface of the connection hole and then a copper containing metal film is formed to fill the connection hole. The copper containing metal film formed outside the connection hole is removed. A second interlayer insulating film is formed on a whole surface of the semiconductor substrate to cover the copper containing metal film formed in the connection hole. The second interlayer insulating film is selectively removed to form a wiring line groove such that the copper containing metal film formed in the connection hole is exposed at a bottom. A barrier metal film is formed to cover an inside of the wiring line groove and then a copper containing metal film is formed to fill the wiring line groove. Then, the copper containing metal film outside the wiring line groove is removed to form a second wiring line.

摘要翻译： 在制造半导体器件的方法中，在半导体衬底上或上方形成由含铜金属膜构成的第一布线。 第一层间绝缘膜形成在半导体衬底的整个表面上以覆盖第一布线。 选择性地去除第一层间绝缘膜以形成到达第一布线的连接孔。 形成阻挡金属膜以覆盖连接孔的内表面，然后形成含铜金属膜以填充连接孔。 除去形成在连接孔外部的含铜金属膜。 在半导体基板的整个表面上形成第二层间绝缘膜，以覆盖形成在连接孔中的含铜金属膜。 选择性地去除第二层间绝缘膜以形成布线槽，使得形成在连接孔中的含铜金属膜在底部露出。 形成阻挡金属膜以覆盖布线槽的内部，然后形成含铜金属膜以填充布线槽。 然后，除去布线线槽外部的含铜金属膜，形成第二布线。