摘要:
Mechanically embossed resilient surface coverings having superior textural fidelity are prepared by mechanically embossing a polyurethane coated floorcovering before the polyurethane is cured. The mechanical embossing is conducted when the polyurethane is dry and the underlying plastic layer and the polyurethane are softened by heating. After the mechanical embossing step, the polyurethane is cured using ultraviolet (UV) light. The product can be cooled before or after UV curing. The invention is applicable to a variety of resilient surface covering products including floor and wall coverings which otherwise have a wearlayer which can be softened by heating. This includes surface coverings having the full range of decorative effects available in the art, including surface coverings which also have been, for example, chemically embossed, mechanically embossed, chemically and mechanically embossed or not embossed at all prior to application of the process of the invention.
摘要:
Described are methods for patterning a substrate by imprint lithography. An imprint lithography method includes placing a curable liquid on a substrate. A template may be contacted with the curable liquid. Surface forces at the interface of the curable liquid and the template cause the curable liquid to gather in an area defined by a lower surface of the template. Alternately, the curable liquid may fill one or more relatively shallow recesses in the template and the area under the template lower surface. Activating light is applied to the curable liquid to form a patterned layer on the substrate.
摘要:
Mechanically embossed resilient surface coverings having superior textural fidelity are prepared by mechanically embossing a polyurethane coated floorcovering before the polyurethane is cured. The mechanical embossing is conducted when the polyurethane is dry and the underlying plastic layer and the polyurethane are softened by heating. After the mechanical embossing step, the polyurethane is cured using ultraviolet (UV) light. The product can be cooled before or after UV curing. The invention is applicable to a variety of resilient surface covering products including floor and wall coverings which otherwise have a wearlayer which can be softened by heating. This includes surface coverings having the full range of decorative effects available in the art, including surface coverings which also have been, for example, chemically embossed, mechanically embossed, chemically and mechanically embossed or not embossed at all prior to application of the process of the invention.
摘要:
The addition of thin coatings (less than and approaching monomolecular coatings) of persistent release materials comprising preferred compounds of the formula: RELEASE-M(X)n-1-RELEASE-M(X)n-m-1Qm, or RELEASE-M(OR)n-1-, wherein RELEASE is a molecular chain of from 4 to 20 atoms in length, preferably from 6 to 16 atoms in length, which molecule has either polar or nonpolar properties; M is a metal atom, semiconductor atom, or semimetal atom; X is halogen or cyano, especially Cl, F, or Br, Q is hydrogen or alkyl group; m is the number of Q groups; R is hydrogen, alkyl or phenyl, preferably hydrogen or alkyl of 1 to 4 carbon atoms; and; n is the valence null1 of M, and n-m-1 is at least 1 provides good release properties. The coated substrates are particularly good for a lithographic method and apparatus for creating ultra-fine (sub-25 nm) patterns in a thin film coated on a substrate is provided, in which a mold having at least one protruding feature is pressed into a thin film carried on a substrate. The protruding feature in the mold creates a recess of the thin film. The mold is removed from the film. The thin film then is processed such that the thin film in the recess is removed exposing the underlying substrate. Thus, the patterns in the mold is replaced in the thin film, completing the lithography. The patterns in the thin film will be, in subsequent processes, reproduced in the substrate or in another material which is added onto the substrate.
摘要:
A method and apparatus for high density nanostructures is provided. The method and apparatus include Nano-compact optical disks, such as nano-compact disks (Nano-CDS). In one embodiment a 400 Gbit/in2 topographical bit density nano-CD with nearly three orders of magnitude higher than commercial CDS has been fabricated using nanoimprint lithography. The reading and wearing of such Nano-CDS have been studied using scanning proximal probe methods. Using a tapping mode, a Nano-CD was read 1000 times without any detectable degradation of the disk or the silicon probe tip. In accelerated wear tests with a contact mode, the damage threshold was found to be 19 &mgr;N. This indicates that in a tapping mode, both the Nano-CD and silicon probe tip should have a lifetime that is at least four orders of magnitude longer than that at the damage threshold.
摘要:
A method of fabricating a microstructure is provided. The method includes the step of providing a layer of a polyermizable material. A solid is brought into contact with the layer of polymerizable material so as to alter the shape of the upper surface of the layer. Thereafter, the layer of polymerizable material is polymerized such that the layer solidifies and the upper surface thereof assumes a desired three-dimensional configuration.
摘要:
The addition of thin coatings (less than and approaching monomolecular coatings) of persistent release materials comprising preferred compounds of the formula: RELEASE-M(X)n−1— RELEASE-M(X)n−m−1 Qm, or RELEASE-M(OR)n−1—, wherein RELEASE is a molecular chain of from 4 to 20 atoms in length, preferably from 6 to 16 atoms in length, which molecule has either polar or non-polar properties; M is a metal atom, semiconductor atom, or semimetal atom; X is halogen or cyano, especially Cl, F, or Br; Q is hydrogen or alkyl group; m is the number of Q groups; R is hydrogen, alkyl or phenyl, preferably hydrogen or alkyl of 1 to 4 carbon atoms; and; n is the valence −1 of M, and n−m−1 is at least 1 provides good release properties. The coated substrates are particularly good for a lithographic method and apparatus for creating ultra-fine (sub-25 nm) patterns in a thin film coated on a substrate is provided, in which a mold having at least one protruding feature is pressed into a thin film carried on a substrate. The protruding feature in the mold creates a recess of the thin film. The mold is removed from the film. The thin film then is processed such that the thin film in the recess is removed exposing the underlying substrate. Thus, the patterns in the mold is replaced in the thin film, completing the lithography. The patterns in the thin film will be, in subsequent processes, reproduced in the substrate or in another material which is added onto the substrate.
摘要:
A method and apparatus for making insignias with a raised design is capable of providing more aesthetic appearance to the insignias thus made. A base material consisting of a base sheet and a surface sheet overlaying the base sheet is prepared for making into an insignia. The base material is coating with a surface coating of decorative material. A bottom mold and an upper mold are used to press the base material to form raised design of patterns. The bottom and upper molds are coupled to a composite heating device including high-frequency induction and electric heating means for applying both high-frequency induction heat and electric heat to the base material while the upper molding is being pressed against the bottom mold. The upper mold is formed with a plurality of edge-defining blades for cutting an edge for the insignia, a plurality of pattern-defining blades for forming a pre-designed pattern on the insignia. During the pressing, the composite heat is concurrently applied to the upper and bottom mold so as to cut and melt away part of the surface sheet to form the pattern. The remnants cut away by the pattern-defining blades can be easily removed by brushes. The final product is an insignia with raised design of patterns with shining appearance.
摘要:
For a process of making a microstructured plastic mold from which structures can be formed galvanically, a compound layer, including an electrically conductive and an insulating layer portion, is provided and is heated and impressed into the insulating layer portion, a tool is provided which has microstructured bodies disposed thereon of a height corresponding at least to the thickness of the insulating layer portion and with rough from surfaces having points and ridges adapted to penetrate the electrically insulating layer thereby to expose the electrically insulating layer at the bottom of the cavities formed by microstructured bodies.
摘要:
An orthopaedic support includes a sheet of foam material that has been compression molded in specific areas. These areas have a thickness and density that is different from other areas of the support and serve to better fit the support to the body. The support may include compression molded grooves or cavities to accommodate straps, struts, gel-filled pads, inflatable bladders, pumps, and other accessories. The support may be compression molded into a shape that conforms to the general contour of the part of the human anatomy that it supports. The support may also include compression molded grooves that reduce bunching when the support is bent, and may include molded edges to minimize skin irritation during activity.