Abstract:
This application relates to an apparatus and method for automated inspection of formed metal containers. More specifically, it pertains to the use of machine vision systems to identify and correlate manufacturing defects occurring in formed food and beverage containers to specific manufacturing paths or sources of origin (eg., body makers) used in the container forming process. The disclosed invention is enabled by the placement of a machine-readable code on specific portions of the can body during the forming process and the use of illumination exposure techniques.
Abstract:
An apparatus for imaging an array of a plurality of features associated with a sample tile. The apparatus can comprise a stage that supports the sample tile in an illumination region, and an illumination source having a plurality of LEDs adapted to emit light. At least a portion of the light can illuminate the illumination region. Additionally, the apparatus can comprise an image collecting device adapted to selectively collect images of either a first signal when the illumination source is illuminating the illumination region, or a second signal absent illumination of the illumination region. The first signal can have wavelengths effectively different from the wavelengths of the portion of the light emitted by the LEDs that illuminates the illumination region.
Abstract:
An apparatus for imaging an array of a plurality of features associated with a sample tile. The apparatus includes a stage that supports the sample tile in an illumination region, and an illumination source having a plurality of LEDs adapted to emit light. At least a portion of the light illuminates the illumination region. Additionally, the apparatus includes an image collecting device adapted to selectively collect images of either a first signal when the illumination source is illuminating the illumination region, or a second signal absent illumination of the illumination region. The first signal has wavelengths effectively different from the wavelengths of the portion of the light emitted by the LEDs that illuminates the illumination region.
Abstract:
An illuminator includes: a first cylindrical member with a mirror-like inner surface formed to facilitate light reflection; a flat plate member having an aperture in its center; LEDs with trimmed distal ends and arranged in a circle along the periphery of the aperture; LEDs with trimmed distal ends and arranged in a circle along a circumferential direction of the first cylindrical member so as to be located on a lengthwise middle part of the inner surface of the cylindrical member; a second cylindrical member having an engagement portion engaged with the cylindrical member, LEDs with trimmed distal ends and arranged in a circle along a circumferential direction of the engagement portion; and a ring-shaped semitransparent diffusion plate. The illuminators illuminate a to-be-mounted component with light having a directivity.
Abstract:
A pattern detection method and apparatus thereof for inspecting with high resolution a micro fine defect of a pattern on an inspected object and a semiconductor substrate manufacturing method and system for manufacturing semiconductor substrates such as semiconductor wafers with a high yield. A micro fine pattern on the inspected object is inspected by irradiating an annular-looped illumination through an objective lens onto a wafer mounted on a stage, the wafer having micro fine patterns thereon. The illumination light may be circularly or elliptically polarized and controlled according to an image detected on the pupil of the objective lens and image signals are obtained by detecting a reflected light from the wafer. The image signals are compared with reference image signals and a part of the pattern showing inconsistency is detected as a defect so that simultaneously, a micro fine defect or defects on the micro fine pattern are detected with high resolution. Further, process conditions of a manufacturing line are controlled by analyzing a cause of defect and a factor of defect which occurs on the pattern.
Abstract:
The disclosure relates to an imaging system which is designed for two-dimensional, spatially resolved measurement of radiometric and/or photometric measured variables, for example the color coordinates of light emitted by a test object. An image sensor is provided for receiving a first part of the light and for generating a two-dimensional digital image of the light emission of the test object. A measuring unit receives a second part of the light and detects radiometric and/or photometric measured variables for different measuring spots or measuring angles. A computing unit transforms the image values of at least a few image points of the generated image, the transformation taking into account the measured variables detected for the measuring spots or measuring angles. The disclosure provides a system which is improved in relation to the prior art. For example, determining the color coordinates when measuring displays with spatially inhomogeneous spectral emission is more precise than in the prior art. The disclosure comprises an imaging spectrometer which is able to determine the measured variables separately for each measuring spot or measuring angle. Alternatively, two or more measuring units can be provided, a measuring unit being associated with each measuring spot or measuring angle. The disclosure also relates to a method for two-dimensional, spatially resolved measurement of radiometric and/or photometric measured variables, for example the color coordinates of light, which uses such an imaging system.
Abstract:
A configuration of the present disclosure specifies a signal point of a specific component and a background point, based on time series two-dimensional spectroscopic image data of a gas; calculates a correlation coefficient between a time series detection signal at the signal point and a time series detection signal at the background point; and generates a time series detection signal of the specific component, based on a corrected time series detection signal obtained by subtracting a product of the correlation coefficient and the time series detection signal at the background point from the time series detection signal at the signal point.
Abstract:
The disclosure describes systems, methods, and apparatuses for monitoring fluorescent peaks using a fluorometer, where the fluorometer comprises an instrument assembly, a circuit assembly, a casing, and a window set into the casing, wherein at least a portion of the instrument assembly is submerged within a liquid and above an analyte workspace; a buoy assembly; one or more emission sources electrically coupled to the circuit assembly, the emission sources configured to emit light in one or more frequencies or wavelength bands; a prism arranged in contact with the window, the prism configured to direct emissions from the emission sources towards the analyte workspace, the prism including at least one angled surface; at least one photosensor positioned above the window and configured to detect fluorescence emissions of analytes in the analyte workspace; and a filter array positioned between the window and the photosensor.
Abstract:
A defect inspection system may include an information-obtaining module and a defect inspection module. The information obtaining module may be arranged over a transferring apparatus to continuously photograph a surface of a substrate transferred by the transferring apparatus. The defect inspection module may generate an image signal based on information of the substrate provided from the information-obtaining module. The defect inspection module may compare the image signal with a reference to detect a defect of the substrate.
Abstract:
An optical measurement system measurement system for examining a sample. The measurement system comprises an internally reflective element, a stage, an optical assembly, a chassis, and a sensor. The internally reflective element has a contact surface. The stage is positioned below the internally reflective element. The stage and the internally reflective element are configured to apply a force to the sample. The optical assembly comprises a light source and a light detector. The optical assembly is configured to scan the sample by directing source light from the light source towards the contact surface and detecting source light optically interacting with the contact surface by the light detector. The chassis is configured to support the optical assembly and the internally reflective element. The sensor is mounted to the chassis and configured to detect the force applied to the sample by the internally reflective element and the stage.