公开(公告)号：US10673111B2

公开(公告)日：2020-06-02

申请号：US15965390

申请日：2018-04-27

Applicant: Huawei Technologies Co., Ltd.

Inventor： Bingzheng Yang ,  Huizhen Qian ,  Xun Luo

IPC: H01P1/201 ,  H01P3/00 ,  H01P1/203 ,  H01P7/08 ,  H01P5/08 ,  H01P5/02 ,  H01L23/66

Abstract: A filter is provided, and the filter includes two mutually coupled slow-wave resonators. Each resonator includes a coplanar waveguide (CPW) transmission line, a tapered CPW transmission line, and a ground stub, and can generate a slow-wave feature to push a high-order harmonic wave of a baseband signal to a high frequency, so as to implement a wide stopband feature. In addition, a slow-wave effect is used to properly design a size of a filter, to reduce an entire area of the filter and reduce costs. Moreover, two resonators are coupled, to enhance passband performance of the filter, increase bandwidth, increase in-passband flatness, and reduce an insertion loss.

公开(公告)号：US10516378B2

公开(公告)日：2019-12-24

申请号：US16373025

申请日：2019-04-02

Applicant: Associated Universities, Inc.

Inventor： Matthew A. Morgan

IPC: H03H7/06 ,  H03H7/38 ,  H01F38/14 ,  H01P1/201 ,  H01P1/207 ,  H03H7/42 ,  H03H7/46

Abstract: Reflectionless low-pass, high-pass, band-pass, band-stop, all-pass, all-stop, and multi-band filters, as well as a method for designing such filters is disclosed, along with a method of enhancing the performance of such filters through the use of unmatched sub-networks to realize an optimal frequency response, such as the Chebyshev equal-ripple response. These filters preferably function by absorbing the stop-band portion of the spectrum rather than reflecting it back to the source, which has significant advantages in many different applications. The unmatched sub-networks preferably offer additional degrees of freedom by which element values can be assigned to realize improved cutoff sharpness, stop-band rejection, or other measures of performance.

公开(公告)号：US10411670B2

公开(公告)日：2019-09-10

申请号：US15633865

申请日：2017-06-27

Applicant: Western Digital Technologies, Inc.

Inventor： Xinzhi Xing ,  Albert Wallash ,  John Contreras

IPC: H03H1/00 ,  H03H7/42 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H01P1/201 ,  H01P3/02

Abstract: Disclosed herein are printed circuit boards with at least one signal trace situated over or under a reference plane. The reference plane includes a broadband common-mode filter that comprises looping and parallel structures etched into the reference plane. The looping structure includes an even number of side arms, and the parallel structure comprises an even number of interior arms, wherein each of the side arms extends toward the parallel structure, and each of the interior arms extends toward the looping structure. The at least one signal trace is substantially parallel to the side arms and to the interior arms, and is situated between a first half of the even number of side arms and a second half of the even number of side arms and between a first half of the even number of interior arms and a second half of the even number of interior arms.

公开(公告)号：US09968004B2

公开(公告)日：2018-05-08

申请号：US15271635

申请日：2016-09-21

Applicant: LAIRD TECHNOLOGIES, INC.

Inventor： Mohammadali Khorrami ,  Paul Francis Dixon

IPC: H05K7/20 ,  H05K1/02 ,  H01P1/201 ,  H05K9/00 ,  H01L23/34 ,  H01P3/12

CPC classification number: H05K7/2039 ,  H01L23/34 ,  H01L23/3737 ,  H01P1/201 ,  H01P3/12 ,  H05K1/0203 ,  H05K1/0216 ,  H05K9/0032 ,  H05K9/0081 ,  H05K2201/10371

Abstract: According to various aspects, exemplary embodiments are disclosed of thermal interface materials including electrically-conductive material, shields including thermal interface materials, and related methods. In an exemplary embodiment, a thermal interface material generally includes a top surface, a bottom surface, and one or more outer side surfaces extending between the top and bottom surfaces. Electrically-conductive material is along and/or adjacent the one or more outer side surfaces. The thermal interface material may be configured to be operable as a waveguide through which energy below a cutoff frequency cannot flow. The electrically-conductive material may be parallel with a direction of heat flow from a heat source to a heat removal/dissipation structure when the bottom surface is positioned against or adjacent the heat source and the top surface is positioned adjacent or against the heat removal/dissipation structure.

公开(公告)号：US09761921B2

公开(公告)日：2017-09-12

申请号：US14962855

申请日：2015-12-08

Applicant: HUAWEI TECHNOLOGIES CANADA CO., LTD.

Inventor： Raafat R. Mansour ,  Kevin Yang ,  Vahid Miraftab

IPC: H01P1/38 ,  H01P1/201

CPC classification number: H01P1/201 ,  H01P1/20 ,  H01P1/38

Abstract: The tunable bandpass filter is used for filtering an electromagnetic signal, has a system passband between a first and a second tunable cutoff frequencies, and has a first subfilter and a second subfilter connected to one another in series between an input port and an output port and being complementary to one another in the tunable bandpass filter. At least one of the first subfilter and the second subfilter being connected to operate in reflection.

公开(公告)号：US09735456B2

公开(公告)日：2017-08-15

申请号：US14783617

申请日：2014-04-14

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Yasufumi Kawai ,  Shuichi Nagai ,  Daisuke Ueda

IPC: H01P5/02 ,  H01P1/201 ,  H01L23/66 ,  H01L25/065 ,  H01P7/10 ,  H01P1/203 ,  H01P7/00 ,  H02J17/00 ,  H01P5/18 ,  H01L23/498

CPC classification number: H01P1/201 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/66 ,  H01L25/0655 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01P1/20345 ,  H01P1/20381 ,  H01P5/187 ,  H01P7/10 ,  H02J17/00 ,  H02J50/12 ,  H02J50/70 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A high-frequency transmission device includes first and second resonators as ring-shaped wires each having an opening part at a part thereof, first and second input/output terminals each electrically connected to both resonators, a first ground shield formed on a plane different from planes on which both resonators are arranged, a second ground shield formed on a plane different from the planes on which both resonators and the first ground shield are arranged, and first and second ground wires each formed to surround peripheries of both resonators. The ground shields and the ground wires are respectively connected to each other. A dielectric wire is present between both ground wires, and the ground wires are not electrically connected to each other.

公开(公告)号：US09666923B2

公开(公告)日：2017-05-30

申请号：US14669699

申请日：2015-03-26

Applicant: THOMSON LICENSING

Inventor： Ali Louzir ,  Chetan Joshi ,  Jean-Luc Robert

IPC: H01P3/08 ,  H01P1/201

CPC classification number: H01P1/2016

Abstract: The present invention relates to a filtering circuit comprising at least two slot line resonators arranged side by side and realized on a dielectric substrate having a first face equipped with a conductive layer and a second parallel face, each of said at least two resonators comprising a slot line etched in the conductive layer and folded according to a spiral pattern counting a plurality of turns, with a shape factor such that the slot line has parts noticeably parallel or concentric. According to embodiments of the invention, at least one turn of the spiral pattern of each of the resonators comprises at least one discontinuity, the discontinuities of said at least two slot line resonators being arranged in such a manner as to increase the electromagnetic coupling between said at least two slot line resonators.

公开(公告)号：US20170094831A1

公开(公告)日：2017-03-30

申请号：US15271635

申请日：2016-09-21

Applicant: LAIRD TECHNOLOGIES, INC.

Inventor： Mohammadali Khorrami ,  Paul Francis Dixon

IPC: H05K7/20 ,  H05K1/02 ,  H05K9/00 ,  H01P1/201

CPC classification number: H05K7/2039 ,  H01L23/34 ,  H01L23/3737 ,  H01P1/201 ,  H01P3/12 ,  H05K1/0203 ,  H05K1/0216 ,  H05K9/0032 ,  H05K9/0081 ,  H05K2201/10371

Abstract: According to various aspects, exemplary embodiments are disclosed of thermal interface materials including electrically-conductive material, shields including thermal interface materials, and related methods. In an exemplary embodiment, a thermal interface material generally includes a top surface, a bottom surface, and one or more outer side surfaces extending between the top and bottom surfaces. Electrically-conductive material is along and/or adjacent the one or more outer side surfaces. The thermal interface material may be configured to be operable as a waveguide through which energy below a cutoff frequency cannot flow. The electrically-conductive material may be parallel with a direction of heat flow from a heat source to a heat removal/dissipation structure when the bottom surface is positioned against or adjacent the heat source and the top surface is positioned adjacent or against the heat removal/dissipation structure.

公开(公告)号：US20160359215A1

公开(公告)日：2016-12-08

申请号：US15168938

申请日：2016-05-31

Applicant: TOKO, INC.

Inventor： Yukikazu YATABE

IPC: H01P1/213 ,  H01P1/201 ,  H01P1/20 ,  H01P7/10

CPC classification number: H01P1/2002 ,  H01P1/201 ,  H01P1/2088 ,  H01P1/213 ,  H01P7/10

Abstract: Dielectric waveguide comprising a plurality of resonator groups disposed on a substrate, wherein each of the resonator groups comprises one or more integrally-formed resonators, each obtained by coating a dielectric body with a conductor film, wherein each resonator group in at least a set of resonator groups of the plurality of resonator groups comprises waveguide-side slot exposing the dielectric body in a bottom surface thereof, wherein the substrate comprises a cavity surrounded by conductor patterns formed in the upper and lower surfaces, and by a via hole connecting the conductor patterns in the upper and lower surfaces, wherein the cavity comprises a set of substrate-side slots exposing the core material, the set of substrate-side slots being provided at a position to which waveguide-side slots of the set of resonator groups are opposed, and wherein resonator groups in the set of resonator groups are coupled together via the cavity.

Abstract translation: 介质波导，包括设置在基板上的多个谐振器组，其中每个谐振器组包括一个或多个整体形成的谐振器，每个共振器通过用导体膜涂覆电介质体而获得，其中每个谐振器组在至少一组 多个谐振器组的谐振器组包括在其底表面中暴露电介质体的波导侧槽，其中，所述衬底包括由形成在上表面和下表面中的导体图案包围的空腔，以及连接导体图案的通孔 在所述上表面和下表面中，所述空腔包括暴露所述芯材料的一组基板侧槽，所述一组基板侧槽设置在所述一组谐振器组的波导侧槽相对的位置处， 并且其中该组谐振器组中的谐振器组经由空腔耦合在一起。

公开(公告)号：US09515362B2

公开(公告)日：2016-12-06

申请号：US13774363

申请日：2013-02-22

Applicant: CommScope Italy S.r.l.

Inventor： Stefano Tamiazzo ,  Giuseppe Resnati

IPC: H01P1/205 ,  H01P7/04 ,  H01P1/203 ,  H01P1/201 ,  H01P11/00 ,  H01P1/208 ,  H03H7/12 ,  H03H7/01

CPC classification number: H01P1/20309 ,  H01P1/201 ,  H01P1/205 ,  H01P1/2086 ,  H01P7/04 ,  H01P11/00 ,  H01P11/007 ,  H03H7/0123 ,  H03H7/12 ,  H03H7/1791 ,  H03H2250/00 ,  Y10T29/49826

Abstract: A bandpass filter has a combline structure having a plurality of cascaded nodes. A plurality of nodes in the filter are connected both to resonant elements (a.k.a. resonators) and non-resonant elements (including elements having inductances and/or capacitances that do not resonate in a predetermined frequency band of interest). The resonant frequencies of the resonant elements may be adjusted, in order to adjust the location of the center frequency and/or the width of the passband of the filter. The characteristics of the resonant and non-resonant elements are selected such that the poles of the filter, when plotted on the complex plane, move substantially along the imaginary axis when the resonant frequencies are adjusted, without substantial movement along the real axis. The resulting bandpass filter has substantially constant losses and substantially constant absolute selectivity over a relatively wide range of bandwidths.

Abstract translation: 带通滤波器具有具有多个级联节点的梳状结构。 滤波器中的多个节点既连接到谐振元件（例如谐振器）和非共振元件（包括在感兴趣的预定频带中不谐振的电感和/或电容的元件）。 可以调节谐振元件的谐振频率，以便调节滤波器的中心频率的位置和/或通带的宽度。 选择共振和非共振元件的特性，使得当绘制在复平面上时，滤波器的极点在谐振频率被调整时基本沿着虚轴移动，而不沿实际实质运动。 所得到的带通滤波器在相对宽的带宽范围内具有基本恒定的损耗和基本上恒定的绝对选择性。