Alignment-overlay mark and method using the same

    公开(公告)号:US12265335B2

    公开(公告)日:2025-04-01

    申请号:US17933968

    申请日:2022-09-21

    Abstract: According to one or more embodiments of the disclosure, an alignment-overlay mark is provided. The alignment-overlay mark includes a pair of first marks and a plurality of second marks. The first marks extend in a first direction and are arranged in parallel to each other in a second direction. The second direction is perpendicular to the first direction. The second marks are between the first marks, extend in the second direction and are arranged in parallel to each other in the first direction.

    LOW RESISTANCE VIA CONTACTS IN A MEMORY DEVICE

    公开(公告)号:US20250107459A1

    公开(公告)日:2025-03-27

    申请号:US18972316

    申请日:2024-12-06

    Inventor: Giulio Albini

    Abstract: Methods, systems, and devices for low resistance via contacts in a memory device are described. A via may be formed so as to protrude from a surrounding material. A barrier material may be formed above an array area and also above the via. After a first layer of an access line material is formed above the barrier material, a planarization process may be applied until the top of the via is exposed. The planarization process may remove the access line material and the barrier material from above the via, but the access line material and the barrier material may remain above the array area. The first layer of the access line material may protect the unremoved barrier material during the planarization process. A second layer of the access line material may be formed above the first layer of the access line material and in direct contact with the via.

    MICROELECTRONIC DEVICES WITH ACTIVE SOURCE/DRAIN CONTACTS IN TRENCH IN SYMMETRICAL DUAL-BLOCK STRUCTURE, AND RELATED METHODS

    公开(公告)号:US20250107204A1

    公开(公告)日:2025-03-27

    申请号:US18974584

    申请日:2024-12-09

    Abstract: Microelectronic devices include a tiered stack having vertically alternating insulative and conductive structures. A first series of stadiums is defined in the tiered stack within a first block of a dual-block structure. A second series of stadiums is defined in the tiered stack within a second block of the dual-block structure. The first and second series of stadiums are substantially symmetrically structured about a trench at a center of the dual-block structure. The trench extends a width of the first and second series of stadiums. The stadiums of the first and second series of stadiums have opposing staircase structures comprising steps at ends of the conductive structures of the tiered stack. Conductive source/drain contact structures are in the stack and extend substantially vertically from a source/drain region at a floor of the trench. Additional microelectronic devices are also disclosed, as are methods of fabrication and electronic systems.

    DUAL-READ DATA INTEGRITY SCAN IN A MEMORY SUB-SYSTEM

    公开(公告)号:US20250104789A1

    公开(公告)日:2025-03-27

    申请号:US18774799

    申请日:2024-07-16

    Abstract: A processing device in a memory sub-system performs a first data integrity scan on a block of a memory device to determine a first combined reliability statistic of memory cells in the block associated with a first program level and a second program level, and performs, using a predetermined read level offset corresponding to one of the first program level or the second program level, a second data integrity scan on the block of the memory device to determine a second combined reliability statistic of the memory cells in the block associated with the first program level and the second program level. The processing device determines a difference between the first combined reliability statistic and the second combined reliability statistic and, responsive to the difference between the first combined reliability statistic and the second combined reliability statistic satisfying a threshold criterion, performs a corrective action on the block of the memory device.

    PERSISTENT HEALTH MONITORING FOR VOLATILE MEMORY SYSTEMS

    公开(公告)号:US20250103416A1

    公开(公告)日:2025-03-27

    申请号:US18909706

    申请日:2024-10-08

    Abstract: Methods, systems, and devices for persistent health monitoring for volatile memory devices are described. A memory device may determine that an operating condition associated with an array of memory cells on the device, such as a temperature, current, voltage, or other metric of health status is outside of a range associated with a risk of device degradation. The memory device may monitor a duration over which the operating condition is outside of the range, and may determine whether the duration satisfies a threshold. In some cases, the memory device may store an indication of when (e.g., each time) the duration satisfied the threshold. The memory device may store the one or more indications in one or more non-volatile storage elements, such as fuses, which may enable the memory device to maintain a persistent indication of a cumulative duration over which the memory device is operated with operating conditions outside of the range.

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