公开(公告)号：US20190222915A1

公开(公告)日：2019-07-18

申请号：US16362393

申请日：2019-03-22

Applicant: Apple Inc.

Inventor： Kristopher P. Laurent ,  David H. Narajowski ,  Michael E. Leclerc ,  Brett W. Degner ,  Christopher J. Stringer ,  Daniele de Iuliis ,  Markus Diebel ,  Sung-Ho Tan

IPC: H04R1/10

CPC classification number: H04R1/1008

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that reduce the size of headphones and allow for small form-factor storage configurations are discussed. User convenience features that include synchronizing earpiece stem positions and automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US20190103701A1

公开(公告)日：2019-04-04

申请号：US15720165

申请日：2017-09-29

Applicant: Apple Inc.

Inventor： Brett W. Degner ,  Bradley J. Hamel ,  Christopher J. Stringer ,  Christiaan A. Ligtenberg ,  David H. Narajowski ,  Kristopher P. Laurent ,  Mahmoud R. Amini ,  Michael E. Leclerc

IPC: H01R13/62 ,  H01R13/24 ,  H01R13/03

CPC classification number: H01R13/6205 ,  H01F7/0263 ,  H01R11/30 ,  H01R13/03 ,  H01R13/2407 ,  H01R35/04 ,  H01R39/643

Abstract: Connector inserts and connector receptacles that have a small form factor, readily mate when brought into proximity to each other, and disconnect when subjected to a non-axial force.

公开(公告)号：US09946315B2

公开(公告)日：2018-04-17

申请号：US15637981

申请日：2017-06-29

Applicant: Apple Inc.

Inventor： Brett W. Degner ,  Caitlin Elizabeth Kalinowski ,  Richard D. Kosoglow ,  Joshua D. Banko ,  David H. Narajowski ,  Jonathan L. Berk ,  Michael E. Leclerc ,  Michael D. McBroom ,  Asif Iqbal ,  Paul S. Michelsen ,  Mark K. Sin ,  Paul A. Baker ,  Harold L. Sontag ,  Wai Ching Yuen ,  Matthew P. Casebolt ,  Kevin S. Fetterman ,  Alexander C. Calkins ,  Daniel L. McBroom

IPC: G06F1/20 ,  H05K7/20 ,  G06F1/18

CPC classification number: G06F1/181 ,  G02B6/0001 ,  G02B6/0008 ,  G02B6/001 ,  G06F1/182 ,  G06F1/183 ,  G06F1/185 ,  G06F1/188 ,  G06F1/20 ,  G06F1/206 ,  G06F3/00 ,  G08B5/36 ,  G08B21/18 ,  H01L23/4093 ,  H05K1/0203 ,  H05K5/03 ,  H05K7/20009 ,  H05K7/20145 ,  H05K7/20154 ,  H05K7/20163 ,  H05K7/20172 ,  H05K7/20209 ,  H05K7/2039 ,  H05K7/2049

Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).

公开(公告)号：US09853402B2

公开(公告)日：2017-12-26

申请号：US15151288

申请日：2016-05-10

Applicant: Apple Inc.

Inventor： Anton Talalayev ,  David H. Narajowski ,  Christiaan A. Ligtenberg ,  Mahmoud R. Amini ,  William F. Leggett ,  Mikael M. Silvanto ,  Christopher J. Stringer ,  George Tziviskos ,  Edward Cooper ,  Ron Alan Hopkinson ,  Ari Parsons Miller

IPC: H01R13/648 ,  H01R24/60 ,  H01R13/6583 ,  H01R12/70

CPC classification number: H01R24/60 ,  H01R12/7082 ,  H01R12/716 ,  H01R13/6582 ,  H01R13/6583 ,  H01R13/6594 ,  H01R13/6658 ,  H01R24/62 ,  H01R25/006

Abstract: An interconnect device can be aligned in a first plane and can include a printed circuit board having a tongue portion and a pin portion. The pin portion can include a plurality of pins extending away from the printed circuit board. The interconnect device can be configured to electrically couple with a main logic board aligned in a second plane. In particular, the plurality of pins can be inserted into corresponding electrical contact locations within the main logic board to form a biplanar connection. The biplanar connection can be made in way that minimizes signal loss for high speed data transfers.

公开(公告)号：US09787032B1

公开(公告)日：2017-10-10

申请号：US15294590

申请日：2016-10-14

Applicant: Apple Inc.

Inventor： Anton Talalayev ,  George Tziviskos ,  Kevin M. Robinson ,  Daniel A. Bergvall ,  Edward J. Cooper ,  Brett W. Degner ,  David H. Narajowski ,  Ari Miller ,  Houtan R. Farahani

IPC: H01R4/64 ,  H01R13/648 ,  H01R24/60 ,  H01R13/629 ,  H01R107/00

CPC classification number: H01R24/60 ,  H01R13/6275 ,  H01R13/6582 ,  H01R2107/00

Abstract: Ground springs for connector receptacles. The ground springs may protect circuitry in an electronic device from stray voltages when a connector insert is inserted into a connector receptacle housed in the electronic device. One example may have a contacting portion located such that when a connector insert is mated with the connector receptacle, the contacting portion of the ground spring electrically connects to a shield of the connector insert before a ground contact of the connector insert electrically connects to a signal contact on a tongue of the connector receptacle.

公开(公告)号：US09207729B2

公开(公告)日：2015-12-08

申请号：US14297580

申请日：2014-06-05

Applicant: Apple Inc.

Inventor： Brett W. Degner ,  Caitlin Elizabeth Kalinowski ,  Richard D. Kosoglow ,  Joshua D. Banko ,  David H. Narajowski ,  Jonathan L. Berk ,  Michael E. Leclerc ,  Michael D. McBroom ,  Asif Iqbal ,  Paul S. Michelsen ,  Mark K. Sin ,  Paul A. Baker ,  Harold L. Sontag ,  Wai Ching Yuen ,  Matthew P. Casebolt ,  Kevin S. Fetterman ,  Alexander C. Calkins ,  Daniel L. McBroom

IPC: G06F1/20 ,  H05K7/20 ,  G06F1/18 ,  G08B5/36 ,  G08B21/18 ,  H05K5/03 ,  F21V8/00 ,  G06F3/00 ,  H05K1/02 ,  G06F1/00 ,  H05K5/00

CPC classification number: G06F1/181 ,  G02B6/0001 ,  G02B6/0008 ,  G02B6/001 ,  G06F1/182 ,  G06F1/183 ,  G06F1/185 ,  G06F1/188 ,  G06F1/20 ,  G06F1/206 ,  G06F3/00 ,  G08B5/36 ,  G08B21/18 ,  H01L23/4093 ,  H05K1/0203 ,  H05K5/03 ,  H05K7/20009 ,  H05K7/20145 ,  H05K7/20154 ,  H05K7/20163 ,  H05K7/20172 ,  H05K7/20209 ,  H05K7/2039 ,  H05K7/2049

Abstract: An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).

Abstract translation: 描述了一种用于圆柱形紧凑计算系统的内部部件和外部接口装置，其包括至少具有三角形形状的结构散热器，该散热器设置在由圆柱形壳体限定的圆柱形容积内。 具有大致三角形状的计算引擎被描述为具有包括图形处理单元（GPU）板，中央处理单元（CPU）板，输入/输出（I / O）接口板，互连板和 电源单元（PSU）。

公开(公告)号：US20150349619A1

公开(公告)日：2015-12-03

申请号：US14728505

申请日：2015-06-02

Applicant: Apple Inc.

Inventor： Brett W. Degner ,  Bradley J. Hamel ,  David H. Narajowski ,  Jonah A. Harley ,  Michael E. Leclerc ,  Patrick Kessler ,  Samuel Bruce Weiss ,  Storrs T. Hoen

IPC: H02K41/035 ,  H02K7/08 ,  G08B6/00

CPC classification number: H02K33/00 ,  G08B6/00 ,  H02K7/08 ,  H02K33/02 ,  H02K35/00 ,  H02K35/02 ,  H02K41/0356 ,  H04M19/047

Abstract: Embodiments described herein may take the form of an electromagnetic actuator that produces a haptic output during operation. Generally, an electromagnetic coil is wrapped around a central magnet array. A shaft passes through the central magnet array, such that the central array may move along the shaft when the proper force is applied. When a current passes through the electromagnetic coil, the coil generates a magnetic field. The coil is stationary with respect to a housing of the actuator, while the central magnet array may move along the shaft within the housing. Thus, excitation of the coil exerts a force on the central magnet array, which moves in response to that force. The direction of the current through the coil determines the direction of the magnetic field and thus the motion of the central magnet array.

Abstract translation: 本文描述的实施例可以采取在操作期间产生触觉输出的电磁致动器的形式。 通常，电磁线圈缠绕在中心磁体阵列周围。 轴通过中心磁体阵列，使得当施加适当的力时，中心阵列可以沿着轴移动。 当电流通过电磁线圈时，线圈产生磁场。 线圈相对于致动器的壳体是静止的，而中心磁体阵列可以沿壳体内的轴移动。 因此，线圈的激励对中心磁体阵列施加力，响应于该力而移动。 通过线圈的电流的方向确定磁场的方向，从而确定中心磁体阵列的运动。

公开(公告)号：US09176548B2

公开(公告)日：2015-11-03

申请号：US14297572

申请日：2014-06-05

Applicant: Apple Inc.

Inventor： Brett W. Degner ,  David H. Narajowski ,  Eric R. Prather ,  Mark K. Sin ,  Paul A. Baker ,  Eugene A. Whang ,  Christopher J. Stringer ,  Frank F. Liang

IPC: G06F1/20 ,  H05K7/20 ,  G06F1/18 ,  G08B5/36 ,  G08B21/18 ,  H05K5/03 ,  F21V8/00 ,  G06F3/00

CPC classification number: G06F1/181 ,  G02B6/0001 ,  G02B6/0008 ,  G02B6/001 ,  G06F1/182 ,  G06F1/183 ,  G06F1/185 ,  G06F1/188 ,  G06F1/20 ,  G06F1/206 ,  G06F3/00 ,  G08B5/36 ,  G08B21/18 ,  H01L23/4093 ,  H05K1/0203 ,  H05K5/03 ,  H05K7/20009 ,  H05K7/20145 ,  H05K7/20154 ,  H05K7/20163 ,  H05K7/20172 ,  H05K7/20209 ,  H05K7/2039 ,  H05K7/2049

Abstract: A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.

Abstract translation: 描述了至少具有由外壳包围的中心芯片的桌面计算系统，所述外壳具有限定其中心芯所在的卷的形状。 壳体包括从第一开口轴向移位的第一开口和第二开口。 第一开口具有根据用作冷却内部部件的传热介质的气流量的尺寸和形状，第二开口由唇缘限定，该唇缘以一定的方式接合气流的一部分，使得至少一些 传递到来自内部部件的空气流的热量被传递到壳体。

公开(公告)号：US20140362523A1

公开(公告)日：2014-12-11

申请号：US14297582

申请日：2014-06-05

Applicant: Apple Inc.

Inventor： Brett W. Degner ,  Eric R. Prather ,  David H. Narajowski ,  Frank F. Liang ,  Jay S. Nigen ,  Jesse T. Dybenko ,  Connor R. Duke ,  Eugene A. Whang ,  Christopher J. Stringer ,  Joshua D. Banko ,  Caitlin Elizabeth Kalinowski ,  Jonathan L. Berk ,  Matthew P. Casebolt ,  Kevin S. Fetterman ,  Eric J. Weirshauser

IPC: G06F1/20

CPC classification number: G06F1/181 ,  G02B6/0001 ,  G02B6/0008 ,  G02B6/001 ,  G06F1/182 ,  G06F1/183 ,  G06F1/185 ,  G06F1/188 ,  G06F1/20 ,  G06F1/206 ,  G06F3/00 ,  G08B5/36 ,  G08B21/18 ,  H01L23/4093 ,  H05K1/0203 ,  H05K5/03 ,  H05K7/20009 ,  H05K7/20145 ,  H05K7/20154 ,  H05K7/20163 ,  H05K7/20172 ,  H05K7/20209 ,  H05K7/2039 ,  H05K7/2049

Abstract: The present application describes various embodiments regarding systems and methods for providing efficient heat rejection for a lightweight and durable compact computing system having a small form factor. The compact computing system can take the form of a desktop computer. The desktop computer can include a monolithic top case having an integrated support system formed therein, the integrated support system providing structural support that distributes applied loads through the top case preventing warping and bowing. A mixed flow fan is utilized to efficiently pull cooling air through the compact computing system.

Abstract translation: 本申请描述了关于用于为具有小外形尺寸的轻便且耐用的小型计算系统提供有效散热的系统和方法的各种实施例。 紧凑型计算系统可以采用台式计算机的形式。 台式计算机可以包括具有形成在其中的集成支撑系统的整体式顶壳，该集成支撑系统提供结构支撑，其通过顶壳分布施加的载荷，从而防止翘曲和弯曲。 利用混流风扇有效地将冷却空气拉过小型计算系统。