METHOD OF MANUFACTURING A STRUCTURE COMPRISING A SUBSTRATE AND A LAYER DEPOSITED ON ONE OF ITS FACES
    107.
    发明申请
    METHOD OF MANUFACTURING A STRUCTURE COMPRISING A SUBSTRATE AND A LAYER DEPOSITED ON ONE OF ITS FACES 审中-公开
    制造包含基材和在其上的一个层上沉积的层的结构的方法

    公开(公告)号:US20110192343A1

    公开(公告)日:2011-08-11

    申请号:US12672797

    申请日:2008-09-23

    IPC分类号: C30B23/02 B05D3/12

    摘要: A method for manufacturing an electronic, optic, optoelectronic or photovoltaic structure of a substrate having a thin layer on one face thereof, by forming an embrittled substrate having first and second faces and an embrittlement zone therebetween, the embrittlement zone defining the substrate and a remainder; depositing a thin layer of material on both the first and second faces of the embrittled substrate; and cleaving the embrittled substrate at the embrittlement zone to obtain the structure having the thin layer of deposited material on one face and one face that is exposed.

    摘要翻译: 一种制造基片的电子,光学,光电或光电结构的方法,该基片在其一面上具有薄层,通过形成具有第一和第二面的脆化基底和其间的脆化区,限定基底的脆化区和剩余部分 ; 在脆化的衬底的第一和第二表面上沉积薄层材料; 并在脆化区裂开脆化的基材,得到在一个面上具有沉积材料的薄层的结构和暴露的一个面。