Ink storing device
    101.
    发明授权
    Ink storing device 失效
    墨水储存装置

    公开(公告)号:US4855762A

    公开(公告)日:1989-08-08

    申请号:US52202

    申请日:1987-05-19

    申请人: Tetsuo Suzuki

    发明人: Tetsuo Suzuki

    IPC分类号: B41J2/175 B41J2/21

    CPC分类号: B41J2/17513

    摘要: An ink storing device comprises a first storing portion storing one type of ink therein and a second storing portion having the interior thereof divided into a plurality of spaces and storing a plurality of types of inks therein.

    摘要翻译: 一种墨水储存装置,包括一个储存一种墨水的第一储存部分和一个其内部被分成多个空间并在其中储存多种油墨的第二储存部分。

    Methacrylic resin molding material and method for production thereof
    102.
    发明授权
    Methacrylic resin molding material and method for production thereof 失效
    甲基丙烯酸树脂成型材料及其制造方法

    公开(公告)号:US4791184A

    公开(公告)日:1988-12-13

    申请号:US67932

    申请日:1987-06-29

    CPC分类号: C08F265/06

    摘要: A methacrylic resin molding material, comprising a partially cross-linked polymer gel obtained by partially polymerizing a mixture comprising (A) a resin raw material selected from the group consisting of monomeric alkyl methacrylates, .alpha., .beta.-ethylenically unsaturated monomer mixtures formed preponderantly of alkyl methacrylates and a syrup containing at least one of said monomers and at least one of the polymers thereof and (B) 4 to 150 parts by weight of a cross-linking agent based on 100 parts by weight of said resin raw material in the presence of a polymerization initiator, whereby a cross-linked polymer is formed with the aid of said cross-linking agent and said polymerization initiator to the extent that increase of the polymer formed thereby reaches 4 to 62% by weight over the polymer content of said mixture with the total polymer content kept from exceeding the upper limit of 62% by weight said molding material being recovered from the polymerization system as a non-sticky, easy-handled gel-like material which has shape-retaining properties, but which, on the application of shear stress, at normal room temperature or at an elevated temperature, is enabled to flow, and preserved for use in the manufacture of shaped articles.

    摘要翻译: 一种甲基丙烯酸树脂成型材料,其包含通过部分聚合混合物而获得的部分交联的聚合物凝胶,所述混合物包含(A)选自由甲基丙烯酸烷基酯单体,甲基丙烯酸烷基酯,α,β-烯属不饱和单体混合物组成的组中的树脂原料, 甲基丙烯酸酯和含有至少一种所述单体和至少一种聚合物的糖浆,和(B)基于100重量份的所述树脂原料在4重量份的交联剂存在下, 聚合引发剂,由此在所述交联剂和所述聚合引发剂的帮助下形成交联聚合物,使得由此形成的聚合物的增加达到所述混合物的聚合物含量的4至62重量% 总聚合物含量保持超过62重量%的上限,所述模塑材料作为非稳定性从聚合体系中回收 具有形状保持性能的易于处理的凝胶状材料,但是在施加剪切应力时,在正常室温或高温下能够流动并保存以用于制造成形 文章。

    Ink jet recording apparatus
    103.
    发明授权
    Ink jet recording apparatus 失效
    喷墨记录装置

    公开(公告)号:US4551735A

    公开(公告)日:1985-11-05

    申请号:US612698

    申请日:1984-05-21

    IPC分类号: B41J2/165 G01D15/18

    CPC分类号: B41J2/16511

    摘要: An ink jet recording apparatus has recording means for discharging ink in response to a recording signal, cap means for covering the ink discharging portion of the recording means, attracting means for attracting the recording means covered by the cap means, and means for inhibiting the cap means from being released from a condition in which it covers the recording means, for a predetermined time after the attracting means has been operated.

    摘要翻译: 喷墨记录装置具有用于响应于记录信号排放墨的记录装置,用于覆盖记录装置的墨排出部分的盖装置,用于吸引由盖装置覆盖的记录装置的吸引装置,以及用于禁止盖 在吸引装置被操作之后的预定时间内,从其覆盖记录装置的状态释放的装置。

    Multilayered wiring substrate
    106.
    发明授权
    Multilayered wiring substrate 失效
    多层布线基板

    公开(公告)号:US08581388B2

    公开(公告)日:2013-11-12

    申请号:US12976427

    申请日:2010-12-22

    IPC分类号: H01L23/053 H01L21/4763

    摘要: A multilayered wiring substrate, comprising: a plurality of first main surface side connecting terminals arranged in a first main surface of a stack structure; and a plurality of second main surface side connecting terminals being arranged in a second main surface of the stack structure; wherein a plurality of conductor layers are alternately formed in a plurality of stacked resin insulation layers and are operably connected to each other through via conductors tapered such that diameters thereof are widened toward the first or the second main surface, wherein a plurality of openings are formed in an exposed outermost resin insulation layer in the second main surface, and terminal outer surfaces of the second main surface side connecting terminals arranged to match with the plurality of the openings are positioned inwardly from an outer main surface of the exposed outermost resin insulation layer, and edges of terminal inner surfaces are rounded.

    摘要翻译: 一种多层布线基板,包括:布置在堆叠结构的第一主表面中的多个第一主表面侧连接端子; 并且多个第二主表面侧连接端子布置在所述堆叠结构的第二主表面中; 其中多个导体层交替地形成在多个堆叠的树脂绝缘层中,并且通过锥形的通孔导体可操作地连接,使得其直径朝向第一或第二主表面加宽,其中形成多个开口 在第二主表面中暴露的最外层树脂绝缘层中,并且布置成与多个开口相匹配的第二主表面侧连接端子的端子外表面从暴露的最外层树脂绝缘层的外主表面位于内侧, 并且端子内表面的边缘是圆形的。

    Conveying jig, method of manufacturing conveying jig, and method of heat-treating metal rings using conveying jig
    107.
    发明授权
    Conveying jig, method of manufacturing conveying jig, and method of heat-treating metal rings using conveying jig 失效
    输送夹具,输送夹具的制造方法以及使用输送夹具热处理金属环的方法

    公开(公告)号:US08544305B2

    公开(公告)日:2013-10-01

    申请号:US13140379

    申请日:2009-10-22

    IPC分类号: C21D9/40 C21D1/00 B21D26/02

    摘要: Provided are a conveying jig, a method of manufacturing the conveying jig, and a method of heat-treating metal rings using the conveying jig. The conveying jig is provided with a base and ten holding shafts raised from the base. Ridges and grooves are alternatively provided in the side wall of each holding shaft. The metal rings are held in position by being engaged in the grooves in the holding shafts. The space enclosed within the holding shafts is communicated with the atmosphere, and this allows, when the metal rings held by the conveying jig are subjected to heat treatment in a heat treatment furnace, an atmospheric gas to circulate in the space enclosed within the holding shafts.

    摘要翻译: 提供了输送夹具,制造输送夹具的方法以及使用输送夹具对金属环进行热处理的方法。 输送夹具设有一个基座和十个从底座上升的保持轴。 在每个保持轴的侧壁中可选地设置有脊和槽。 金属环通过接合在保持轴中的槽中而保持就位。 封闭在保持轴内的空间与大气连通,这样当由输送夹具保持的金属环在热处理炉中进行热处理时,能够在封闭在保持轴内的空间内循环大气 。

    Multilayer wiring substrate and method of manufacturing the same
    108.
    发明授权
    Multilayer wiring substrate and method of manufacturing the same 失效
    多层布线基板及其制造方法

    公开(公告)号:US08450622B2

    公开(公告)日:2013-05-28

    申请号:US13031735

    申请日:2011-02-22

    摘要: A multilayer wiring substrate includes first principal surface side connection terminals arranged on a first principal surface of a stacked configuration; wherein, the first principal surface side connection terminals include an IC chip connection terminal, and a passive element connection terminal; the IC chip connection terminal is located in an opening formed in a resin insulating layer of an uppermost outer layer; the passive element connection terminal is formed of an upper terminal part formed on the resin insulating layer, and a lower terminal part located in an opening formed at a portion of an inner side of the upper terminal part in the resin insulating layer; and, wherein an upper face of the upper terminal part is higher than a reference surface, and an upper face of the IC chip connection terminal and the lower terminal part are identical in height to or lower in height than the reference surface.

    摘要翻译: 多层布线基板包括布置在堆叠构造的第一主表面上的第一主表面侧连接端子; 其中,所述第一主面侧连接端子包括IC芯片连接端子和无源元件连接端子; IC芯片连接端子位于形成在最上层外层的树脂绝缘层中的开口中; 无源元件连接端子由形成在树脂绝缘层上的上端子部和位于树脂绝缘层中的上端子部的内侧的开口部的下端子部构成, 并且其中所述上端子部分的上表面高于参考表面,并且所述IC芯片连接端子和所述下端子部分的上表面的高度与所述基准表面的高度相同或更低。

    Methods and removers for removing anodized films
    109.
    发明授权
    Methods and removers for removing anodized films 有权
    去除阳极氧化膜的方法和去除剂

    公开(公告)号:US08337634B2

    公开(公告)日:2012-12-25

    申请号:US12708968

    申请日:2010-02-19

    IPC分类号: C23F1/02 C11D7/06

    CPC分类号: C23G1/22 C23G1/00 C23G1/12

    摘要: A remover contains an alkaline component, a bivalent zinc ion, a ferric ion, a chelating agent, and a nitrate ion. By using this remover, an anodized film can be selectively removed from an aluminum or aluminum-alloy member.

    摘要翻译: 去除剂含有碱性组分,二价锌离子,三价铁离子,螯合剂和硝酸根离子。 通过使用该去除剂,可以从铝或铝合金构件中选择性地除去阳极氧化膜。

    CHAMFERING APPARATUS FOR CHAMFERING GLASS SUBSTRATES
    110.
    发明申请
    CHAMFERING APPARATUS FOR CHAMFERING GLASS SUBSTRATES 有权
    用于切割玻璃基板的切割装置

    公开(公告)号:US20100317265A1

    公开(公告)日:2010-12-16

    申请号:US12861519

    申请日:2010-08-23

    IPC分类号: B24B9/10

    CPC分类号: G11B5/8404 B24B9/065

    摘要: A chamfering apparatus is used to chamfer a peripheral edge of a glass substrate. The chamfering apparatus includes a grindstone having a cylindrical hollow end portion; a grindstone driving unit that rotates the grindstone around an axis of the cylindrical hollow end portion; a substrate rotation-driving unit that rotates the glass substrate around either one of an axis of the outer periphery and an axis of the center circular hole; and a pressing unit that presses the grindstone to the glass substrate such that an annular end surface of the grindstone contacts with an edge of either one of the outer periphery and the inner periphery of the glass substrate while the cylindrical hollow end portion of the grindstone faces with one of the outer periphery and the inner periphery of the glass substrate.

    摘要翻译: 使用倒角装置来倒角玻璃基板的周缘。 该倒角装置包括:具有圆筒状的中空端部的砂轮; 磨石驱动单元,其使磨石围绕圆筒状中空端部的轴线旋转; 基板旋转驱动单元,其使玻璃基板围绕外周的轴线和中心圆孔的轴线旋转; 以及按压单元,其将磨石按压到玻璃基板,使得磨石的环形端面与玻璃基板的外周和内周的任一边缘的边缘接触,同时磨石的圆柱形中空端部面对 玻璃基板的外周和内周之一。