HYBRID SMART VERIFY FOR QLC/TLC DIE
    103.
    发明公开

    公开(公告)号:US20240071524A1

    公开(公告)日:2024-02-29

    申请号:US17895412

    申请日:2022-08-25

    CPC classification number: G11C16/3459 G11C16/102 G11C16/14 G11C16/3404

    Abstract: Technology is disclosed herein for smart verify in a memory system that has a four bit per cell program mode (or X4 mode) and also a three bit per cell program mode (or X3 mode). The X3 mode uses a three-bit gray code that is based on a four-bit gray code of the X4 mode. The memory system skips verify of states in the X3 mode, while using a considerable portion of the programming logic from the X4 mode. In one X3 mode the memory system skips B-state verify while the number of memory cells having a Vt above an A-state verify voltage is below a threshold. In one X3 mode the memory system determines whether to skip verify for a first set of data states based on a first test and determines whether to skip verify for a second set of data states based on a second test.

    MIXED BITLINE LOCKOUT FOR QLC/TLC DIE
    104.
    发明公开

    公开(公告)号:US20240071482A1

    公开(公告)日:2024-02-29

    申请号:US17895304

    申请日:2022-08-25

    Abstract: Technology is disclosed herein for mixed lockout verify. In a first programming phase, prior to a pre-determined data state completing verification, a no-lockout program verify is performed. After the pre-determined data state has completed verification, a lockout program verify is performed. The no-lockout verify may include charging all bit lines associated with the group to a sensing voltage to perform. The lockout verify may include selectively charging to the sensing voltage only bit lines associated with memory cells in the group to be verified. Bit lines associated with memory cells in the group that are not to be verified may be grounded to perform the lockout verify. The lockout verify saves considerable current and/or power. However, performing the lockout verify during the first programming phase may slow performance due to a need to scan the content in a remote set of data latches.

    DYNAMIC WORD LINE RECONFIGURATION FOR NAND STRUCTURE

    公开(公告)号:US20240055051A1

    公开(公告)日:2024-02-15

    申请号:US17888063

    申请日:2022-08-15

    CPC classification number: G11C16/08 G11C16/0483 G11C16/10 G11C16/16

    Abstract: Technology is disclosed herein reconfiguring word lines as either data word lines or dummy word lines. In a sub-block mode reconfigurable word lines are used as dummy word lines that provide electrical isolation between data word lines in a block. The block may be divided into an upper tier, a middle tier, and a lower tier, with the reconfigurable word lines within the middle tier. In a full-block mode the reconfigurable group of the word lines are used as data word lines. Because the reconfigurable word lines are used as data word lines in the full-block mode storage capacity is greater in the full-block mode than in the sub-block mode. Moreover, because the sub-blocks are smaller in size but greater in number than the full-blocks, the memory system may be provisioned with fewer blocks and still meet user storage requirements in both the full-block mode and the sub-block mode.

    REFRESH FREQUENCY-DEPENDENT SYSTEM-LEVEL TRIMMING OF VERIFY LEVEL OFFSETS FOR NON-VOLATILE MEMORY

    公开(公告)号:US20230410922A1

    公开(公告)日:2023-12-21

    申请号:US17841343

    申请日:2022-06-15

    Abstract: A memory apparatus and method of operation are provided. The apparatus includes memory cells each connected to word lines. The memory cells are disposed in strings and configured to retain a threshold voltage corresponding to data states. A control means is configured to apply verification pulses of program verify voltages each associated with one of the data states to selected ones of the word lines to determine whether the memory cells connected thereto have the threshold voltage above each of the program verify voltages targeted for each of the memory cells during a program-verify portion of a program operation. The control means is also configured to trim the program verify voltages for each of the data states for a grouping of the memory cells based on quantities of the memory cells having the threshold voltage crossing over between the data states in crossovers in a verify level trimming process.

    DIE BY DIE TRIMMING OF DRAIN-SIDE SELECT GATE THRESHOLD VOLTAGE TO REDUCE CUMULATIVE READ DISTURB

    公开(公告)号:US20230410912A1

    公开(公告)日:2023-12-21

    申请号:US17841160

    申请日:2022-06-15

    CPC classification number: G11C16/10 G11C16/0483 G11C16/26

    Abstract: A memory apparatus and method of operation are provided. The apparatus includes drain-side select gate transistors for coupling to a drain-side of each of a plurality of memory holes of memory cells and configured to retain a transistor threshold voltage. The memory apparatus also includes a control means coupled to the drain-side select gate transistor of each of the plurality of memory holes. The control means is configured to select the transistor threshold voltage of the drain-side select gate transistors as a stable transistor threshold voltage for a grouping of the memory cells to minimize shifting of the transistor threshold voltage following a plurality of read operations of the memory cells. The control means is also configured to program the transistor threshold voltage of the drain-side select gate transistor of the plurality of memory holes associated with the grouping of the memory cells to the stable transistor threshold voltage.

    READ TECHNIQUES TO REDUCE READ ERRORS IN A MEMORY DEVICE

    公开(公告)号:US20230402105A1

    公开(公告)日:2023-12-14

    申请号:US17837744

    申请日:2022-06-10

    Abstract: The memory device includes a memory block with a plurality of memory cells, which are programmed to multiple bits per memory cell, arranged in a plurality of word lines. Control circuitry is provided and is configured to read the memory cells of a selected word line. The control circuitry separates the memory cells of the selected word line into a first group of memory cells, which are located on a side of the word line are near a voltage driver, and a second group of memory cells, which are located on an opposite side of the word line from the voltage driver. The control circuitry reads the memory cells of the first group using a first read mode and reads the memory cells of the second group using a second read mode that is different than the first read mode to reduce a fail bit count during read.

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