Display device including adhesive film with transparent support
    101.
    发明授权
    Display device including adhesive film with transparent support 失效
    显示装置包括具有透明支撑的粘合膜

    公开(公告)号:US07244476B2

    公开(公告)日:2007-07-17

    申请号:US10902828

    申请日:2004-08-02

    IPC分类号: G02F1/1333

    摘要: Adhesive layers are formed on the two opposing surfaces of a transparent support. At least one of the adhesive layers is made of a material of which the cured state may be changed. The adhesive layer is irradiated with light and a lens sheet is then pressed against the adhesive layer. The adhesive layer is cured. In this illustrative way, a laminate film of the lens sheet fixed to the transparent support via the adhesive layer may be obtained. The laminate film may be bonded to a polarizing plate on the viewer's side of a liquid crystal display element via the other adhesive layer.

    摘要翻译: 粘合层形成在透明支撑体的两个相对的表面上。 粘合剂层中的至少一个由可以改变固化状态的材料制成。 用光照射粘合剂层,然后将透镜片压在粘合剂层上。 粘合层固化。 以这种说明的方式,可以获得通过粘合剂层固定到透明支撑体的透镜片的层压膜。 层叠膜可以经由另一粘合层与液晶显示元件的观察者侧的偏振片接合。

    Method for manufacturing printed circuit boards
    102.
    发明授权
    Method for manufacturing printed circuit boards 失效
    制造印刷电路板的方法

    公开(公告)号:US07213335B2

    公开(公告)日:2007-05-08

    申请号:US10788392

    申请日:2004-03-01

    IPC分类号: H01K3/10

    摘要: The amount of time required to manufacture double-sided printed circuit boards that contain conductor bridges can be reduced. A method is provided which includes the steps of forming holes which pass through an insulating board and a first conductor layer formed on a first main side of the insulating board, bonding a second conductor layer to a second main side of the insulating board having the holes, forming a third conductor layer on the whole first main side of the insulating board after bonding the second conductor layer, masking preset holes with a plating resist, plating the first conductor and holes in the insulating board, patterning the first conductor layer to form a first conductor pattern, patterning said second conductor layer to form a second conductor pattern, and removing the plating resist and the third conductor layer from an area which is covered with the plating resist.

    摘要翻译: 可以减少制造包含导体桥的双面印刷电路板所需的时间。 提供了一种方法,其包括形成穿过绝缘板的孔和形成在绝缘板的第一主侧上的第一导体层的步骤,将第二导体层接合到具有孔的绝缘板的第二主侧 在所述第二导体层接合之后,在绝缘板的整个第一主侧上形成第三导体层,用电镀抗蚀剂掩蔽预定的孔,对所述绝缘板中的所述第一导体和所述孔进行电镀,对所述第一导体层进行图案化, 第一导体图案,图案化所述第二导体层以形成第二导体图案,以及从被电镀抗蚀剂覆盖的区域去除电镀抗蚀剂和第三导体层。