Abstract:
A process for separating a glass-silicon-glass layer package wherein the glass-silicon-glass layer package is produced at a minimum process cost and is constructed from a plurality of acceleration sensors constructed with micro-mechanical structure techniques. At the same time, dirt is to be prevented from entering the acceleration sensors and the connection contacts are to be freed automatically. Separation is effected substantially by crosswise cutting and subsequent breaking. In order to prevent an "opening" of the acceleration sensors when cutting in one direction, i.e. transversely relative to the flexural resonators, and to achieve a defined breaking, one glass disk is cut until a predetermined breaking point is reached and the other glass disk is severed in a parallel plane. An intermediate layer which surrounds the connection in a U-shaped manner, serves as a blocking layer arranged between the two dividing planes and impedes a bonding of the glass disk and the silicon disk.
Abstract:
A sensor (10) is disclosed for measuring the acceleration and angular rotation rate of a moving body and is micromachined from a silicon substrate (16). First and second accelerometers (32a and b) are micromachined from the silicon substrate (16), each having a force sensing axis (38) and producing an output signal of the acceleration of the moving body along its force sensing axis (38). The first and second accelerometers (32a and b) are mounted within the substrate (16) to be moved along a vibration axis (41). The first and second accelerometers (32a and b) are vibrated or dithered to increase the Coriolis component of the output signals from the first and second accelerometers (32a and b). A sinusoidal drive signal of a predetermined frequency is applied to a conductive path (92) disposed on each of the accelerometers. Further, magnetic flux is directed to cross each of the conductive paths (92), whereby the interaction of the magnetic flux and of the drive signal passing therethrough causes the desired dithering motion. A link (72) is formed within the silicon substrate (16) and connected to each of the accelerometers (32a and b), whereby motion imparted to one results in a like, but opposite motion applied to the other accelerometer (32). Further, a unitary magnet (20) and its associated flux path assembly direct and focus the magnetic flux through the first and second accelerometers (32a and b) formed within the silicon substrate (16).
Abstract:
Accelerometer having a frame, a proofmass, one or more force sensitive transducers, and a strut interconnecting the transducers with the proofmass and the frame so that forces are applied to the transducers in accordance with movement of the proofmass along the sensitive axis. The transducers and the strut have similar thermal expansion properties and are arranged in such manner that they can expand together with changes in temperature independently of the frame and the proofmass without imposing any significant strain on the transducers. In certain disclosed embodiments, the transducers are formed as a unitary planar structure from a single piece of crystalline quartz material, and the strut is formed of the same material.
Abstract:
This invention relates to a semiconductor sensor for detecting external physical forces, such as acceleration, contact pressures, air pressures, mechanical vibrations, etc. The semiconductor sensor according to this invention is characterized by the use of compound semiconductors of high piezoelectricity, such as GaAs, etc. Conventionally sensors of the cantilever type, diaphragm type, etc. are made of silicon. These prior art sensors have low detection sensitivity, and their characteristics tend to deteriorate. The sensor according to this invention is made of GaAs, which has high piezoelectricity and can retain good characteristics of the semiconductor even at high temperatures and includes a field-effect transistor formed on the GaAs for sensing a stress. The FET is driven by a constant current or a constant voltage so as to detect a change of an electrical characteristic (e.g., threshold characteristic) due to a stress. The structure of the sensor according to this invention enables the sizes of the sensors not only to be diminished but also to reduce the fabrication costs. When a stress is applied to the FET, the transconductance changes, and the temperature changes, consequently the I-V characteristic changes. An a.c. signal biased by a direct current is supplied to the gate of the FET, and a drain current is detected in an a.c. component and a d.c. component so as to detect a temperature concurrently with a detection of a stress.
Abstract:
A measurement sensor is disclosed having a frame, a support which is resiliently flexible under the influence of a physical parameter and is fixed to the frame, a mass connected to the support, a housing which is formed by the frame and surrounds the mass to dampen movement of the mass and its support, a detection device for supplying a signal representative of the physical parameter in response to flection of the support. The sensor includes an assembly for precisely positioning the mass in the housing. The sensor has applications in the measurement of a physical parameter such as, for example, acceleration.
Abstract:
A detector for detecting a physical quantity as a quantity of electricity has a detection portion, a portion for stimulating the detection portion and a signal processing portion, wherein a calibrating signal is supplied from the signal processing portion to the detection portion via the stimulating portion so as to measure a specific response of the detection portion whereby a self-calibration and a correction of the characteristics are performed in accordance with the amount of the change in the response.
Abstract:
A drive system for providing different excitation voltages to the separate beams of a multiple beam vibrating transducer is disclosed. In one embodiment of the invention an amplified voltage at the resonant frequency of a master beam is amplified and applied to a secondary beam, to force the secondary beam to vibrate at the resonant frequency and amplitude of the master beam to force the transducer to resonate at the frequency of the master beam. Since the transducer vibrates at the resonant frequency of one of the beams, the transducer energy losses to the adjacent mounting structure are reduced. This results in a higher transducer quality factor so that frequency shifts in the resonant frequency can be readily measured as changes in the parameter that the transducer is intended to monitor.
Abstract:
A multibeam structure measures displacement of one or more response elements to detect multiple components of applied force. The flexible beams are each coupled to a response element which may be displaced by a force arising from linear acceleration, angular acceleration, fluid flow, electric/magnetic/gravitational fields, and other sources. The displacement of the response element is detected with a variety of sensing methods including capacitive and piezoresistive sensing.
Abstract:
An accelerometer having a movable electrode which is moved according to acceleration with respect to a fixed electrode disposed in opposition to the movable electrode. An output device generates an output voltage which is proportional to the acceleration by measuring a gap between the movable electrode and the fixed electrode. A pulse width modulator generates pulses, wherein a pulse width of the pulses is modulated according to the output voltage, and a feedback device feeds back an electrostatic force which is proportional to the pulse width of the pulses from the pulse modulator between the movable electrode and the fixed electrode. As the acceleration in the acceleration sensor is linearly detected, the acceleration sensor is easily adjusted.
Abstract:
A push-pull force transducer comprising a unitary body formed from a crystalline substrate. The body comprises first and second mounting elements for mounting the force transducer to first and second structures, and first and second force sensing elements connected to the mounting elements. Each force sensing element has first and second ends, a line extending from the second to the first end defining a force sensing axis for the force sensing elements. The force sensing elements are oriented with their force sensing axes parallel to and aligned with one another. The first force sensing element has its first end connected to the second mounting element and its second end connected to the first mounting element. The second force sensing element has its first end connected to the first mounting element and its second end connected to the second mounting element. Also described are embodiments utilizing strain relief flexures and an embodiment featuring a leveraged design.