公开(公告)号：US08477822B2

公开(公告)日：2013-07-02

申请号：US13223496

申请日：2011-09-01

申请人： Rongshong Miao

发明人： Rongshong Miao

IPC分类号： H01S5/00

CPC分类号： H01S5/02446 ,  G02B6/4214 ,  G02B6/4263 ,  G02B6/4271 ,  G02B6/4286 ,  H01S5/0078 ,  H01S5/02212 ,  H01S5/02248 ,  H01S5/02284 ,  H01S5/02292 ,  H01S5/02415 ,  H01S5/02438 ,  H01S5/0687 ,  H04B10/503 ,  H04B10/572

摘要： An apparatus comprising a header comprising a platform for attaching opto-electronic components, an optical element, a laser diode (LD) configured to emit an optical signal that passes through the optical element, and a cap affixed to the header such that the cap is coaxially aligned with the header, wherein the cap and header encase the optical element and the LD.

摘要翻译： 一种包括头部的装置，包括用于附接光电子部件的平台，光学元件，被配置为发射通过光学元件的光信号的激光二极管（LD）以及固定到所述头部的帽，使得所述帽是 与头部同轴对准，其中帽和头部包住光学元件和LD。

公开(公告)号：US08469609B2

公开(公告)日：2013-06-25

申请号：US13211709

申请日：2011-08-17

申请人： Kuniyuki Ishii ,  Hiromi Kurashima

发明人： Kuniyuki Ishii ,  Hiromi Kurashima

IPC分类号： G02B6/36

CPC分类号： G02B6/4201 ,  G02B6/4204 ,  G02B6/421 ,  G02B6/4269 ,  G02B6/4271 ,  G02B6/4281 ,  G02B6/4283

摘要： A heat transferring mechanism of an optical transceiver is disclosed. The optical transceiver includes a metal cover, a OSA that generate heat, and a heat conductor. The OSA has the heat transferring surface extending to a direction intersecting, or substantially in perpendicular, to the longitudinal direction of the optical transceiver. The heat conductor, which is formed only by cutting and bending of metal plate, includes a contact plate and the transfer plate in thermally contact to a heat transferring surface of the OSA and an inner surface of the metal cover to form an effective heat transferring path from the OSA to the cover.

摘要翻译： 公开了一种光收发器的传热机构。 光收发器包括金属盖，产生热量的OSA和热导体。 OSA具有延伸到与光收发器的纵向相交或基本垂直的方向的传热表面。 仅通过金属板的切割和弯曲形成的导热体包括与OSA的传热表面和金属盖的内表面热接触的接触板和传递板，以形成有效的传热路径 从OSA到封面。

公开(公告)号：US08277132B2

公开(公告)日：2012-10-02

申请号：US12607730

申请日：2009-10-28

申请人： Jong-jin Lee ,  Hyun-seo Kang ,  Jai-sang Koh

发明人： Jong-jin Lee ,  Hyun-seo Kang ,  Jai-sang Koh

IPC分类号： G02B6/36

CPC分类号： G02B6/4246 ,  G02B6/4206 ,  G02B6/4271

摘要： A bidirectional optical transceiver module with a temperature control function is provided. The bidirectional optical transceiver module includes a package configured to have a flat bottom surface and include two windows used for optical transmission and reception; a ferrule configured to be coupled to one side of the package and allow an optical fiber to be inserted therein; an optical receiver module configured to be coupled to another side of the package in a direction perpendicular to that of the ferrule coupled to the package; a sub-optical transmitter module configured to be built in the package and include a light-emitting element and a collimating lens used to collimate light from the light-emitting element; an optical filter configured to be built in the package, transmit light from the light-emitting element to the optical fiber and reflect light received through the optical fiber to the optical receiver module; and a temperature regulator configured to be built in the package and control the sub-optical transmitter module to a preset temperature. Accordingly, it is possible to reduce the manufacturing cost of the package, effectively discharge heat, and be more endurable to external impact or vibration.

摘要翻译： 提供了具有温度控制功能的双向光收发模块。 双向光收发器模块包括被配置为具有平坦的底表面并且包括用于光学传输和接收的两个窗口的封装; 套圈，被配置为耦合到所述封装的一侧并允许光纤插入其中; 光接收器模块，被配置为在垂直于耦合到封装的套圈的方向上耦合到封装的另一侧; 子光发射机模块，被配置为内置在所述封装中并且包括发光元件和用于准直来自所述发光元件的光的准直透镜; 配置成内置在封装中的滤光器，将来自发光元件的光透射到光纤，并将通过光纤接收的光反射到光接收器模块; 以及温度调节器，其被配置为内置在所述封装中并将所述子光发射器模块控制到预设温度。 因此，可以降低包装的制造成本，有效地排出热量，并且能够更耐外部冲击或振动。

公开(公告)号：US20120128290A1

公开(公告)日：2012-05-24

申请号：US13154859

申请日：2011-06-07

申请人： Young-Tak HAN ,  Jang Uk Shin ,  Sang-Pil Han ,  Sang Ho Park ,  Yongsoon Baek

发明人： Young-Tak HAN ,  Jang Uk Shin ,  Sang-Pil Han ,  Sang Ho Park ,  Yongsoon Baek

IPC分类号： G02B6/12

CPC分类号： G02B6/4279 ,  G02B6/12002 ,  G02B6/12004 ,  G02B6/325 ,  G02B6/42 ,  G02B6/4201 ,  G02B6/4206 ,  G02B6/4208 ,  G02B6/4257 ,  G02B6/4265 ,  G02B6/4271 ,  G02B6/428 ,  G02B6/4281 ,  G02B2006/12092 ,  G02B2006/12135

摘要： Provided is an optical module. The optical module includes: an optical bench having a first trench of a first depth and a second trench of a second depth that is lower than the first depth; a lens in the first trench of the optical bench; at least one semiconductor chip in the second trench of the optical bench; and a flexible printed circuit board covering an upper surface of the optical bench except for the first and second trenches, wherein the optical bench is a metal optical bench or a silicon optical bench.

摘要翻译： 提供了一种光学模块。 光学模块包括：光学台，其具有第一深度的第一沟槽和第二深度的第二沟槽，其低于第一深度; 在光学工作台的第一沟槽中的透镜; 在所述光学平台的所述第二沟槽中的至少一个半导体芯片; 以及覆盖除了第一和第二沟槽之外的光学台的上表面的柔性印刷电路板，其中所述光学台是金属光学台或硅光学台。

公开(公告)号：US20110217798A1

公开(公告)日：2011-09-08

申请号：US13112584

申请日：2011-05-20

申请人： Mitsunori KANEMOTO ,  Tarou KANEKO

发明人： Mitsunori KANEMOTO ,  Tarou KANEKO

IPC分类号： H01L21/50

CPC分类号： H04B10/40 ,  G02B6/4201 ,  G02B6/4204 ,  G02B6/424 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4257 ,  G02B6/4271 ,  H01S5/005 ,  H01S5/0064 ,  H01S5/02248 ,  H01S5/02272 ,  H01S5/02284 ,  H01S5/02415 ,  H01S5/50

摘要： [Problems] To accommodate a plurality of optical semiconductor elements in one package with their optical axes aligned highly precisely.[Means for Solving the Problems] An optical transmission module includes an optical transmission unit, a carrier to become a base, a semiconductor optical amplification element mounted on the carrier through a first sub-carrier, first and second lenses fixed on the carrier through first and second lens holders, an element supporting member and an optical isolator fixed on the carrier, a third lens holder supported by the element supporting member, a third lens and a small carrier individually fixed in the third lens holder, and a semiconductor laser element mounted on the small carrier through a second sub-carrier.

摘要翻译： [问题]为了容纳多个光学半导体元件在一个封装中，其光轴高精度地对准。 解决问题的手段光传输模块包括光传输单元，成为基座的载体，通过第一副载体安装在载体上的半导体光放大元件，第一和第二透镜，其通过第一 和第二透镜保持器，固定在载体上的元件支撑构件和光隔离器，由元件支撑构件支撑的第三透镜保持器，第三透镜​​和单独固定在第三透镜保持器中的小载体，以及安装 在小载体上通过第二副载波。

公开(公告)号：US20110085767A1

公开(公告)日：2011-04-14

申请号：US12577037

申请日：2009-10-09

申请人： Rongsheng Miao

发明人： Rongsheng Miao

IPC分类号： G02B6/42 ,  H01S3/04 ,  G02B6/36

CPC分类号： G02B6/4201 ,  G02B6/4263 ,  G02B6/4267 ,  G02B6/4271 ,  G02B6/4279 ,  G02B6/4285 ,  G02B6/4286

摘要： An optoelectronic device includes a header having a plurality of pins extending therethrough, a thermo-electric cooling device mounted adjacent to a side of the header and an optoelectronic assembly mounted on the thermo-electric cooling device. The optoelectronic assembly includes a light emitting device operable to emit an optical signal in response to an electric signal received by at least one of the plurality of pins, and a lens assembly operable to receive at least some of the light emitted by the light emitting device, the lens assembly having a lens. A cap substantially encloses the thermo-electric cooling device and the optoelectronic assembly. The cap has a window operable to transmit light emitted by the optoelectronic assembly. The lens is the only optical component in the lens assembly.

摘要翻译： 光电子器件包括具有延伸穿过其中的多个引脚的接头，安装在集管侧面附近的热电冷却装置和安装在热电冷却装置上的光电组件。 光电组件包括可响应于由多个引脚中的至少一个引脚接收的电信号而发射光信号的发光器件，以及可操作以接收由发光器件发射的至少一些光的透镜组件 透镜组件具有透镜。 帽基本上包围热电冷却装置和光电组件。 盖具有可操作以透射光电组件发射的光的窗口。 透镜是透镜组件中唯一的光学部件。

公开(公告)号：US20110079893A1

公开(公告)日：2011-04-07

申请号：US12944040

申请日：2010-11-11

申请人： David W. Sherrer ,  Larry J. Rasnake ,  John J. Fisher

发明人： David W. Sherrer ,  Larry J. Rasnake ,  John J. Fisher

IPC分类号： H01L23/12 ,  H01L21/768 ,  H01L23/48 ,  H01L23/34 ,  B29C65/02

CPC分类号： G02B6/4248 ,  G01B11/16 ,  G01B11/26 ,  G02B6/3692 ,  G02B6/4201 ,  G02B6/4204 ,  G02B6/4206 ,  G02B6/421 ,  G02B6/4214 ,  G02B6/423 ,  G02B6/4239 ,  G02B6/4243 ,  G02B6/4244 ,  G02B6/4257 ,  G02B6/4271 ,  G02B6/4292 ,  H01L23/481 ,  H01L2924/0002 ,  H01S5/0014 ,  H01S5/022 ,  H01S5/02208 ,  H01S5/02216 ,  H01S5/0222 ,  H01S5/02252 ,  H01S5/02272 ,  H01S5/02284 ,  H01S5/02288 ,  H01S5/02415 ,  H01S5/02469 ,  H01S5/0683 ,  H01L2924/00012 ,  H01L2924/00

摘要： Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the second surface to the layer, the via hole having a first perimeter at the first surface; (d) forming an aperture in the layer, wherein the aperture has a second perimeter within the first perimeter; and (e) providing a conductive structure for sealing the via structure. Also provided are sealed via structures, methods of detecting leakage in a sealed device package, sealed device packages, device packages having cooling structures, and methods of bonding a first component to a second component.

摘要翻译： 提供形成密封通孔结构的方法。 一种方法包括：（a）提供具有第一表面和与第一表面相对的第二表面的半导体衬底; （b）在所述基板的第一表面上形成层; （c）从所述第二表面到所述层蚀刻穿过所述基板的通孔，所述通孔在所述第一表面具有第一周边; （d）在所述层中形成孔，其中所述孔在所述第一周边内具有第二周边; 和（e）提供用于密封通孔结构的导电结构。 还提供了密封通孔结构，检测密封器件封装中的泄漏的方法，密封器件封装，具有冷却结构的器件封装以及将第一元件接合到第二元件的方法。

公开(公告)号：US07772608B2

公开(公告)日：2010-08-10

申请号：US11878561

申请日：2007-07-25

申请人： Wen-Ping Yu

发明人： Wen-Ping Yu

IPC分类号： H01L33/00

CPC分类号： H01L31/0203 ,  G02B6/4201 ,  G02B6/4204 ,  G02B6/4271 ,  H01L25/167 ,  H01L31/02325 ,  H01L31/12 ,  H01L2924/0002 ,  H01S5/02288 ,  H01S5/06804 ,  H01S5/0683 ,  H01S5/4025 ,  H01L2924/00

摘要： A photoelectric element package with temperature compensation includes a substrate, and a first light-emitting element, a second light-emitting element, a photosensitive element, and a drive element disposed on the substrate, all of which are disposed in an internal space formed by a first casing joined with a second casing. Alternatively, the second light-emitting element and the photosensitive element are disposed in an internal space of a third casing. By adding the second light-emitting element, the photosensitive element can sense the light emitting intensity accurately in the absence of other interferences, so as to feed back the current operating state of the light-emitting element. A temperature compensation function is achieved by a laser driver, so as to reduce the influence of temperature on the light-emitting element, such that the light-emitting element emits light in an accurate intensity.

摘要翻译： 具有温度补偿的光电元件封装包括基板和设置在基板上的第一发光元件，第二发光元件，感光元件和驱动元件，所有这些都设置在由 与第二壳体连接的第一壳体。 或者，第二发光元件和感光元件设置在第三壳体的内部空间中。 通过添加第二发光元件，感光元件可以在没有其它干扰的情况下精确地感测发光强度，从而反馈发光元件的当前工作状态。 通过激光驱动器实现温度补偿功能，以减少温度对发光元件的影响，使得发光元件以准确的强度发光。

公开(公告)号：US07534053B2

公开(公告)日：2009-05-19

申请号：US10852504

申请日：2004-05-24

申请人： Rickie C. Lake

发明人： Rickie C. Lake

IPC分类号： G02B6/36

CPC分类号： G02B6/4201 ,  G02B6/4226 ,  G02B6/4238 ,  G02B6/4248 ,  G02B6/4271

摘要： Optoelectronic housings and methods of assembling optoelectronic packages are disclosed. An example of such an optoelectronic package includes an optoelectronic module having a substrate, a first optical fiber extending in a first direction from the substrate, and a second optical fiber extending from the substrate in a second direction opposite the first direction. It also includes a body defining a chamber dimensioned to receive the optoelectronic module, and an optical fiber feedthrough fixed to a first side of the body for receiving the first optical fiber. A bore is defined in a second side of the body opposite the first side of the body. The bore is positioned to receive the second optical fiber. A second optical fiber feedthrough is threaded onto the second optical fiber and slid into the bore after the second optical fiber is positioned in the bore. The second feedthrough is then secured to the body.

摘要翻译： 公开了光电壳体和组装光电封装的方法。 这种光电子封装的一个例子包括具有衬底的光电子模块，从衬底沿第一方向延伸的第一光纤，以及在与第一方向相反的第二方向上从衬底延伸的第二光纤。 它还包括一个限定容纳光电子模块的腔体的主体，以及固定到主体的第一侧以接收第一光纤的光纤馈通。 在身体的与身体的第一侧相对的第二侧限定孔。 孔被定位成接收第二光纤。 在第二光纤定位在孔中之后，第二光纤馈通被拧到第二光纤上并滑入孔中。 然后将第二馈通固定到身体。

公开(公告)号：US07416353B2

公开(公告)日：2008-08-26

申请号：US11242148

申请日：2005-10-04

申请人： Satoshi Yoshikawa ,  Hidemi Sone ,  Hiromi Kurashima

发明人： Satoshi Yoshikawa ,  Hidemi Sone ,  Hiromi Kurashima

IPC分类号： G02B6/36 ,  G02B6/12

CPC分类号： G02B6/4201 ,  G02B6/4246 ,  G02B6/4261 ,  G02B6/4271 ,  G02B6/4277 ,  G02B6/4292

摘要： The optical transceiver of the present invention is one type of the pluggable transceiver that is inserted into/extracted from the cage in the host system. The transceiver includes the OSA (Optical Sub-Assembly) unit, which shows the optical function, and the body unit installing the electronic circuit. The OSA unit includes the receptacle member, the tab plate and transmitting/receiving sub-assemblies. The body unit includes the base installing the circuit board, the heat conducting plate to conduct heat generated by the IC on the substrate to the rear end of the transceiver, the supplementary substrate, the supporting plate, and the cover for putting these components therein. In the present transceiver, the heat is effectively conducted to the rear end thereof the heat conducting plate, besides, the tab plate, the heat conducting plate, and the supporting plate are made only by cutting, bending and tapping without any welding and gluing. Therefore, the present invention may provide an optical pluggable transceiver with superior heat dissipating function by cost saved configuration.

摘要翻译： 本发明的光收发器是插入到主机系统中的笼中的一种可插拔收发器。 收发器包括显示光学功能的OSA（光学子组件）单元和安装电子电路的机身单元。 OSA单元包括插座构件，接片板和发送/接收子组件。 主体单元包括安装电路板的基座，导热板，用于将基板上的IC产生的热量传导到收发器的后端，辅助基板，支撑板和用于将这些部件放置在其中的盖子。 在本收发器中，除了片状板，导热板和支撑板之外，导热板的后端有效地传导热量，而不用任何焊接和胶合进行切割，弯曲和攻丝。 因此，本发明可以通过成本节省的配置来提供具有优异的散热功能的光学可插拔收发器。