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    LED light source probe card technology for testing CMOS image scan devices
    111.
    发明授权
    LED light source probe card technology for testing CMOS image scan devices 有权

    公开(公告)号：US10352870B2

    公开(公告)日：2019-07-16

    申请号：US15835380

    申请日：2017-12-07

    Applicant: FormFactor, Inc.

    Inventor： Nobuhiro Kawamata ,  Toshihiro Kasai ,  Hiromitsu Sasanami ,  Shigeki Mori

    IPC: G01N21/88 ,  G01J1/42 ,  G02B27/09 ,  G01R31/28 ,  H04N1/028 ,  G01J1/08 ,  G01J1/32 ,  G01J1/04

    Abstract: Improved wafer-scale testing of optoelectronic devices, such as CMOS image scan devices, is provided. A probe card includes an LED light source corresponding to each device under test in the wafer. The LED light sources provide light from a phosphor illuminated by the LED. A pinhole and lens arrangement is used to collimate the light provided to the devices under test. Uniformity of illumination can be provided by closed loop control of the LED light sources using internal optical signals as feedback signals, in combination with calibration data relating the optical signal values to emitted optical intensity. Uniformity of illumination can be further improved by providing a neutral density filter for each LED light source to improve uniformity from one source to another and/or to improve uniformity of the radiation pattern from each LED light source.

    MEMS Probe Card Assembly having Decoupled Electrical and Mechanical Probe connections
    112.
    发明申请
    MEMS Probe Card Assembly having Decoupled Electrical and Mechanical Probe connections 审中-公开

    公开(公告)号：US20190128924A1

    公开(公告)日：2019-05-02

    申请号：US16175341

    申请日：2018-10-30

    Applicant: FormFactor, Inc.

    Inventor： Mukesh Selvaraj ,  January Kister

    IPC: G01R1/073 ,  G01R3/00 ,  G01R1/067

    Abstract: Probes are connected to the space transformer via multiple carrier plates. Electrical contacts from the probes to the space transformer are by way of spring tail features on the probes that connect to the space transformer and not to the carrier plates. In other words, the carrier plates are purely mechanical in function. This configuration can significantly reduce probe array fabrication time relative to sequential placement of individual probes on the space transformer. Multiple probe carrier plates can be populated with probes in parallel, and the final sequential assembly of carrier plates onto the space transformer has a greatly reduced operation count. Deviations of the space transformer from flatness can be compensated for.

    Direct Metalized Guide Plate
    113.
    发明申请
    Direct Metalized Guide Plate 审中-公开

    公开(公告)号：US20190120876A1

    公开(公告)日：2019-04-25

    申请号：US16164326

    申请日：2018-10-18

    Applicant: FormFactor, Inc.

    Inventor： Jason William Cosman ,  Benjamin N. Eldridge ,  Eric Hill ,  John Ebner ,  Edin Sijercic

    IPC: G01R1/073 ,  H03H7/38 ,  G01R3/00

    Abstract: Improved electrically conductive guide plates for vertical probe arrays are provided by patterning a thin metal layer disposed on an insulating substrate. Holes passing through the guide plate for guiding probes can be electrically connected or isolated from each other in any pattern according to the deposition of the metal. Such structures can include several distinct ground and/or voltage planes. Furthermore, passive electrical components can be included in the guide plate, by patterning of the deposited metal and/or by integration of passive electrical components with the deposited metal traces.

    Vertical probe array having a tiled membrane space transformer
    114.
    发明申请
    Vertical probe array having a tiled membrane space transformer 审中-公开

    公开(公告)号：US20190064220A1

    公开(公告)日：2019-02-28

    申请号：US16116317

    申请日：2018-08-29

    Applicant: FormFactor, Inc.

    Inventor： Benjamin N. Eldridge ,  Masanori Watanabe ,  Scott Kuhnert ,  Jeffrey Coussens

    IPC: G01R1/073

    Abstract: Vertical probe heads having a space transformer laterally tiled into several sections are provided. This change relative to conventional approaches improves manufacturing yield. These probe heads can include metal ground planes, and in embodiments where the ground planes are provided as separate metal plates parallel to the guide plates, the metal plates can also be laterally tiled into several sections. Such tiling of metal plates improves manufacturing yield and alleviates thermal mismatch issues. Probes are not mechanically connected to the space transformer, which facilitates replacement of individual probes of an array.

    Probe Card Assembly For Testing Electronic Devices
    117.
    发明申请
    Probe Card Assembly For Testing Electronic Devices 有权
    用于测试电子设备的探针卡组件

    公开(公告)号：US20140327461A1

    公开(公告)日：2014-11-06

    申请号：US14270235

    申请日：2014-05-05

    Applicant: FormFactor, Inc.

    Inventor： Li Fan ,  Darcy K. Kelly-Greene ,  Edward J. Milovic ,  Gensaku Nagai ,  Mukesh K. Selvaraj ,  Jim Zhang

    IPC: G01R1/067 ,  G01R1/073

    CPC classification number: G01R1/06716 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/07342 ,  G01R1/07371 ,  G01R1/36 ,  G01R35/00

    Abstract: A probe card assembly can comprise a guide plate comprising probe guides for holding probes in predetermined positions. The probe card assembly can also comprise a wiring structure attached to the guide plate so that connection tips of the probes are positioned against and attached to contacts on the wiring structure. The attachment of the guide plate to the wiring structure can allow the wiring structure to expand or contract at a greater rate than the guide plate. The probes can include compliant elements that fail upon high electrical current and thermal stresses located away from the contact tips.

    Abstract translation: 探针卡组件可以包括导板，其包括用于将探针保持在预定位置的探针引导件。 探针卡组件还可以包括附接到引导板的布线结构，使得探针的连接尖端定位成抵靠并附接到布线结构上的触点。 引导板到布线结构的附接可以使布线结构以比引导板更大的速率膨胀或收缩。 探针可以包括顺应元件，其在远离接触尖端的高电流和热应力下失效。

    VERTICAL PROBES FOR MULTI-PITCH FULL GRID CONTACT ARRAY
    119.
    发明申请
    VERTICAL PROBES FOR MULTI-PITCH FULL GRID CONTACT ARRAY 审中-公开
    用于多点全网格接触阵列的垂直探测器

    公开(公告)号：US20140043054A1

    公开(公告)日：2014-02-13

    申请号：US13963567

    申请日：2013-08-09

    Applicant: FormFactor, Inc.

    Inventor： January Kister

    IPC: G01R1/067

    CPC classification number: G01R1/06711 ,  G01R1/0675 ,  G01R3/00 ,  G06Q30/0623

    Abstract: A testing method (and the probes used) comprising providing one or more probes each comprising: a body portion which is substantially straight; an extended portion extending from the body portion and comprising at least two separate probe portions; and a tip portion at the opposite end of the extended portion; and contacting an object to be tested with the one or more probes.

    Abstract translation: 一种测试方法（以及使用的探针），包括提供一个或多个探针，每个探针包括：主体部分，其基本上是直的; 延伸部分，其从主体部分延伸并且包括至少两个单独的探针部分; 以及在所述延伸部分的相对端处的末端部分; 以及使待测对象与所述一个或多个探针接触。

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