公开(公告)号：US08038361B2

公开(公告)日：2011-10-18

申请号：US13008150

申请日：2011-01-18

Applicant: Hung Yu Cheng ,  Ho Ping Cheng

Inventor： Hung Yu Cheng ,  Ho Ping Cheng

IPC: B42F3/02

CPC classification number: B42F13/26

Abstract: A ring binder mechanism has a housing and hinge plates supported for pivoting movement by the housing. The mechanism has rings, each including a first ring member mounted on a first hinge plate and a second ring member. The first ring member is movable relative to the second ring member between open and closed positions. The mechanism has a travel bar and a locking element that are free of fixed connection to the hinge plates and movable in translation relative to the housing and hinge plates. The travel bar blocks pivoting motion of the hinge plates when the ring members are closed. An elongate link connects a pivotable actuating lever to the travel bar such that pivoting motion of the actuating lever produces translational movement of the travel bar. The elongate link is oriented so it extends longitudinally relative to the housing.

Abstract translation: 环形活页夹机构具有壳体和支撑铰链板，用于通过壳体枢转运动。 机构具有环，每个环包括安装在第一铰链板上的第一环件和第二环件。 第一环构件在打开位置和关闭位置之间相对于第二环构件可移动。 该机构具有行程杆和锁定元件，其没有与铰链板的固定连接并且相对于壳体和铰链板可平移地移动。 当环构件关闭时，行进杆阻止铰链板的枢转运动。 细长的连接件将可枢转的致动杆连接到行进杆，使得致动杆的枢转运动产生行进杆的平移运动。 细长连杆被定向成使其相对于壳体纵向延伸。

公开(公告)号：US20110208071A1

公开(公告)日：2011-08-25

申请号：US13034011

申请日：2011-02-24

Applicant: Liang-Hung Lu ,  Wei-Cheng Tian ,  Shao-Yi Chien ,  Jiun-Lang Huang ,  Po-Ling Kuo ,  Ping-Cheng Yeh

Inventor： Liang-Hung Lu ,  Wei-Cheng Tian ,  Shao-Yi Chien ,  Jiun-Lang Huang ,  Po-Ling Kuo ,  Ping-Cheng Yeh

IPC: A61B5/02

CPC classification number: A61B5/0285 ,  A61B5/02125 ,  A61B5/6822 ,  A61B2562/0247 ,  A61B2562/028 ,  A61B2562/046

Abstract: A non-invasive array-based hemodynamic monitoring system on chip is disclosed. The non-invasive array-based hemodynamic monitoring system on chip comprises a CMOS MEMS pressure sensor array, a readout circuit, and a signal control system. The CMOS MEMS pressure sensor array is configured to sense a pulse wave of a blood vessel. The readout circuit is coupled with each of the CMOS compatible MEMS pressure sensors and is configured to read the pulse wave and transformed the pulse wave into a voltage signal. The signal control system is coupled with each of the readout circuit, and is configured to estimate a wave velocity according to the voltage signal.

Abstract translation: 公开了一种基于非侵入式阵列的血液动力学监测系统。 基于非侵入式阵列的血液动力学监测系统包括CMOS MEMS压力传感器阵列，读出电路和信号控制系统。 CMOS MEMS压力传感器阵列被配置为感测血管的脉搏波。 读出电路与每个CMOS兼容的MEMS压力传感器耦合，并且被配置为读取脉搏波并将脉冲波变换成电压信号。 信号控制系统与每个读出电路耦合，并且被配置为根据电压信号估计波速。

公开(公告)号：US07825862B2

公开(公告)日：2010-11-02

申请号：US11898525

申请日：2007-09-13

Applicant: Yu-Chiang Cheng ,  Ping-Cheng Chang ,  Cheng-Zing Chou

Inventor： Yu-Chiang Cheng ,  Ping-Cheng Chang ,  Cheng-Zing Chou

IPC: H01Q1/24

CPC classification number: H01Q1/2258

Abstract: An antenna device with a surface antenna pattern is formed either on an internal surface or on the external surface of a casing of an electronic device by film coating technology. The surface antenna pattern is either directly connected to a signal feeding line or connected to a signal feeding line through a signal guiding passage. In an embodiment, a recess is pre-formed on the external surface of the casing and then a surface antenna pattern is coated to the recess. The antenna device may further comprise an antenna coupling element arranged at the internal surface of the casing, in opposite to the surface antenna pattern. The antenna coupling element is inductively coupled with the surface antenna pattern for transceiving the signals to the electronic device.

Abstract translation: 具有表面天线图案的天线装置通过薄膜涂覆技术形成在电子装置的壳体的内表面或外表面上。 表面天线图案或者直接连接到信号馈送线或者通过信号引导通道连接到信号馈送线。 在一个实施例中，在壳体的外表面上预先形成凹部，然后将表面天线图案涂覆到凹部。 天线装置还可以包括天线耦合元件，其布置在壳体的内表面处，与表面天线图案相对。 天线耦合元件与表面天线方向感应耦合，用于将信号收发到电子设备。

公开(公告)号：US20100258934A1

公开(公告)日：2010-10-14

申请号：US12550645

申请日：2009-08-31

Applicant: PAO-HUEI CHANG CHIEN ,  Ping-Cheng Hu ,  Po-Shing Chiang ,  Wei-Lun Cheng

Inventor： PAO-HUEI CHANG CHIEN ,  Ping-Cheng Hu ,  Po-Shing Chiang ,  Wei-Lun Cheng

IPC: H01L23/49 ,  H01L21/50 ,  H01L23/28

CPC classification number: H01L21/4832 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49582 ,  H01L24/28 ,  H01L24/48 ,  H01L24/92 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48257 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01021 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: The advanced quad flat non-leaded package structure includes a carrier having a die pad and a plurality of leads, at least a chip, a plurality of wires, and a molding compound. The rough surface of the carrier enhances the adhesion between the carrier and the surrounding molding compound.

Abstract translation: 先进的四边形扁平非铅封装结构包括具有管芯焊盘和多个引线，至少芯片，多根电线和模塑料的载体。 载体的粗糙表面增强了载体和周围模塑料之间的粘合性。

公开(公告)号：US20100243430A1

公开(公告)日：2010-09-30

申请号：US12460947

申请日：2009-07-27

Applicant: Biing-Hwa Yan ,  Chih-Ping Cheng ,  Kun-Ling Wu ,  Yu-Shan Hsu

Inventor： Biing-Hwa Yan ,  Chih-Ping Cheng ,  Kun-Ling Wu ,  Yu-Shan Hsu

IPC: C25F3/02

CPC classification number: B23H7/38 ,  B23H3/00 ,  B23H5/06

Abstract: In an apparatus and method for magnetic field assisted electrochemical discharge machining (ECDM), the magneto hydrodynamic (MHD) effect is utilized to improve the thickness of bubble film and the electrolyte circulation so as to enhance the machining accuracy and efficiency. Since charged ions in a magnetic field are induced by Lorenz force to move, and the electrolysis bubbles generated in the ECDM process are suffused with electrification ions on their surfaces, the electrolysis bubbles can be forced to move in the direction of the magnetic field without the need of mechanical disturbance. The present invention can be widely applied in the micro-machining of non-conductive brittle materials of different dimensions and shapes, comprising the forming of microchannels and microholes on a biochip, and in the micro-opto-electro-mechanical system (MOEMS) and various kinds of micro-machining fields. The machined surface is smooth and does not require a second time machining.

Abstract translation: 在用于磁场辅助电化学放电加工（ECDM）的设备和方法中，利用磁流体动力学（MHD）效应来提高气泡膜和电解质循环的厚度，从而提高加工精度和效率。 由于磁场中的带电离子是由洛伦茨力驱动的，所以在ECDM工艺中产生的电解气泡在其表面上充满了带电离子，电解气泡可以被迫沿磁场方向移动， 需要机械扰动。 本发明可广泛应用于不同尺寸和形状的非导电脆性材料的微加工，包括在生物芯片上形成微通道和微孔，以及在微光电机械系统（MOEMS）和 各种微加工领域。 加工表面光滑，不需要第二次加工。

公开(公告)号：US20100166490A1

公开(公告)日：2010-07-01

申请号：US12346551

申请日：2008-12-30

Applicant: Ho Ping CHENG ,  Ming Hua HUANG

Inventor： Ho Ping CHENG ,  Ming Hua HUANG

IPC: B42F13/20 ,  B23P11/00

CPC classification number: B42F13/26 ,  Y10T29/49826

Abstract: A ring binder mechanism includes an elongate housing and a ring support supported by the housing for movement relative to the housing. The ring support has an upper surface and a lower surface. A plurality of rings is provided for holding loose-leaf pages. Each ring includes a first ring member and a second ring member. The first ring member is mounted on the ring support for movement with the ring support relative to the housing between a closed position and an opened position. An actuator is mounted on the housing for pivotal movement relative to the housing for moving the rings from their closed position to their opened position. The actuator has a snap-lock connection with the housing.

Abstract translation: 环形装订机构包括细长壳体和由壳体支撑的环支撑件，用于相对于壳体移动。 环形支撑件具有上表面和下表面。 提供多个环以保持活页页面。 每个环包括第一环构件和第二环构件。 第一环构件安装在环支撑件上，使得环支撑件相对于壳体在关闭位置和打开位置之间移动。 致动器安装在壳体上以相对于壳体枢转运动，用于将环从其关闭位置移动到其打开位置。 执行器与外壳具有卡扣锁定连接。

公开(公告)号：US20090230524A1

公开(公告)日：2009-09-17

申请号：US12192742

申请日：2008-08-15

Applicant: Pao-Huei Chang Chien ,  Ping-Cheng Hu ,  Chien-Wen Chen

Inventor： Pao-Huei Chang Chien ,  Ping-Cheng Hu ,  Chien-Wen Chen

IPC: H01L23/495 ,  H01L21/60

CPC classification number: H01L21/4832 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package and related methods are described. In one embodiment the semiconductor package includes a die pad, a plurality of leads, a semiconductor chip, and a package body. The die pad includes a first part that includes a lower surface and a first peripheral edge region comprising a ground region. The die pad further includes a second part that is spaced apart from the first part and that includes a lower surface and a second peripheral edge region comprising a power region. The plurality of leads is disposed around the die pad. The semiconductor chip is disposed on the die pad and is electrically coupled to the ground region, the power region, and the plurality of leads. The package body is formed over the semiconductor chip and the plurality of leads.

Abstract translation: 描述半导体封装和相关方法。 在一个实施例中，半导体封装包括管芯焊盘，多个引线，半导体芯片和封装体。 管芯焊盘包括包括下表面的第一部分和包括接地区域的第一外围边缘区域。 芯片焊盘还包括与第一部分间隔开并且包括下表面的第二部分和包括功率区域的第二外围边缘区域。 多个引线设置在管芯焊盘周围。 半导体芯片设置在芯片焊盘上并且电耦合到接地区域，功率区域和多个引线。 封装体形成在半导体芯片和多个引线上。

公开(公告)号：US20090230523A1

公开(公告)日：2009-09-17

申请号：US12192702

申请日：2008-08-15

Applicant: Pao-Huei Chang Chien ,  Ping-Cheng Hu ,  Chien-Wen Chen ,  Hsu-Yang Lee

Inventor： Pao-Huei Chang Chien ,  Ping-Cheng Hu ,  Chien-Wen Chen ,  Hsu-Yang Lee

IPC: H01L23/495 ,  H01L21/60

CPC classification number: H01L21/4832 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package and related methods are described. In one embodiment, the package includes a die pad, a plurality of leads, a chip, and a package body. The die pad includes: (1) a peripheral edge region defining, a cavity with a cavity bottom including a central portion; (2) an upper sloped portion; and (3) a lower sloped portion. Each lead includes an upper sloped portion and a lower sloped portion. The chip is disposed on the central portion of the cavity bottom and is coupled to the leads. The package body is formed over the chip and the leads, substantially fills the cavity, and substantially covers the upper sloped portions of the die pad and the leads. The lower sloped portions of the die pad and the leads at least partially extend outwardly from a lower surface of the package body.

Abstract translation: 描述半导体封装和相关方法。 在一个实施例中，封装包括管芯焊盘，多个引线，芯片和封装体。 所述管芯焊盘包括：（1）外围边缘区域，其限定具有包括中心部分的空腔底部的空腔; （2）上倾斜部分; 和（3）下倾斜部分。 每个引线包括上倾斜部分和下倾斜部分。 芯片设置在空腔底部的中心部分并且连接到引线。 封装体形成在芯片和引线上，基本上填充空腔，并且基本上覆盖芯片焊盘和引线的上倾斜部分。 芯片焊盘和引线的下倾斜部分至少部分地从封装主体的下表面向外延伸。

公开(公告)号：US07567191B2

公开(公告)日：2009-07-28

申请号：US12132756

申请日：2008-06-04

Applicant: Chia-Yen Chang ,  Hsin-Ping Cheng

Inventor： Chia-Yen Chang ,  Hsin-Ping Cheng

IPC: H03M7/00

CPC classification number: H03M5/145 ,  G11B20/1426 ,  G11B2020/1457 ,  G11B2020/1859 ,  G11B2220/2504

Abstract: A method of designing a look-up table of a finite-state encoder, applied to a finite-state encoder, comprises steps of: determining a bit length of a legal output codeword derived from the finite-state encoder and a restrict condition; collecting a plurality of legal output codeword satisfied the restrict condition; determining a bit length of an input codeword derived to the finite-state encoder according to the amount of the plurality of the legal output codeword; determining the amount of states in the finite-state encoder according to the bit length of the input codeword and the bit length of the legal output codeword; dividing the plurality of legal output codeword to a plurality of subset according to the amount of the states in the finite-state encoder and a specific mathematic equation; determining the amount of the legal output codewords in the plurality of subset; and, completing the look-up table through determining a relationship among a present state, a previous state, and a corresponding subset, wherein the amount of the subsets used in the look-up table is greater than the amount of the states in the finite-state encoder and smaller than two times of the amount of the states in the finite-state encoder.

Abstract translation: 一种设计应用于有限状态编码器的有限状态编码器的查找表的方法，包括以下步骤：确定从有限状态编码器导出的合法输出码字的位长度和限制条件; 收集满足限制条件的多个合法输出码字; 根据多个合法输出码字的量确定导出到有限状态编码器的输入码字的比特长度; 根据输入码字的比特长度和合法输出码字的比特长度确定有限状态编码器中的状态量; 根据有限状态编码器中的状态量和特定数学方程将多个合法输出码字划分为多个子集; 确定所述多个子集中的合法输出码字的数量; 并且通过确定当前状态，先前状态和相应子集之间的关系来完成查找表，其中在查找表中使用的子集的量大于有限状态中的状态量 状态编码器，并且小于有限状态编码器状态量的两倍。

公开(公告)号：US07558264B1

公开(公告)日：2009-07-07

申请号：US10051093

申请日：2002-01-18

Applicant: Santosh C. Lolayekar ,  Yu-Ping Cheng ,  Anoop R. Hegde ,  Sunil K. Asthana

Inventor： Santosh C. Lolayekar ,  Yu-Ping Cheng ,  Anoop R. Hegde ,  Sunil K. Asthana

IPC: H04L12/28 ,  G06F15/173 ,  G06F9/00

CPC classification number: G06F11/2087 ,  G06F11/1448 ,  G06F11/1469 ,  G06F11/2071 ,  G06F2201/84

Abstract: A storage switch in accordance with an embodiment of the invention is a highly scalable switch that allows the creation of a SAN that is easy to deploy and that can be centrally managed. Moreover, such a storage switch also allows the deployment of a global infrastructure, allowing the resources of the SAN, such as storage devices, to essentially be positioned anywhere on the globe. Further, such a storage switch allows a multi-protocol SAN, e.g., one that includes both iSCSI or Fibre Channel, and processes data packets at “wire speed.” To further enable wire-speed processing, a switch in accordance with the invention has “intelligence” distributed to each of its linecards, through which it classifies packets into data and control packets, it performs virtualization functions, and it performs protocol translation functions. A switch in accordance with the invention further performs serverless storage services such as mirroring, snapshot, and replication.

Abstract translation: 根据本发明的实施例的存储交换机是高度可扩展的交换机，其允许创建易于部署并且可以集中管理的SAN。 此外，这样的存储交换机还允许部署全球基础设施，从而允许诸如存储设备的SAN的资源基本上位于全球任何地方。 此外，这种存储交换机允许多协议SAN，例如包括iSCSI或光纤通道的协议SAN，并且以“线速度”处理数据分组。 为了进一步实现线速处理，根据本发明的交换机具有分布到其每个线路卡的“智能”，通过该交换机将分组分组成数据和控制分组，它执行虚拟化功能，并且执行协议转换功能。 根据本发明的交换机还执行无服务器存储服务，例如镜像，快照和复制。