IN-SITU EVALUATION OF CURING OF INK COMPOSITIONS VIA FLUORESCENCE SPECTROSCOPY AND RELATED METHODS

    公开(公告)号:US20190033137A1

    公开(公告)日:2019-01-31

    申请号:US15662644

    申请日:2017-07-28

    申请人: Xerox Corporation

    摘要: A method for evaluating curing in an ink composition comprises depositing an ink composition on the surface of an object via a direct-to-object inkjet printing system to form a film thereon, the ink composition comprising a photoinitiator capable of initiating a free radical polymerization process in the ink composition upon the absorption of light to cure the deposited film and a fluorophore capable of emitting viscosity-dependent fluorescence upon the absorption of light; exposing, in-situ, the deposited film to light generated by a first source of light under conditions which initiate the free radical polymerization process to cure the deposited film; exposing the cured film to light generated by a second source of light under conditions which induce fluorescence emission by the fluorophore in the cured film; measuring the fluorescence emission; and determining a degree of cure in the cured film from the measured fluorescence emission and predetermined calibration data.

    Emitter module for an LED illumination device

    公开(公告)号:US10161786B2

    公开(公告)日:2018-12-25

    申请号:US14314482

    申请日:2014-06-25

    申请人: Lutron Ketra, LLC

    摘要: An illumination device comprises one or more emitter modules having improved thermal and electrical characteristics. According to one embodiment, each emitter module comprises a plurality of light emitting diodes (LEDs) configured for producing illumination for the illumination device, one or more photodetectors configured for detecting the illumination produced by the plurality of LEDs, a substrate upon which the plurality of LEDs and the one or more photodetectors are mounted, wherein the substrate is configured to provide a relatively high thermal impedance in the lateral direction, and a relatively low thermal impedance in the vertical direction, and a primary optics structure coupled to the substrate for encapsulating the plurality of LEDs and the one or more photodetectors within the primary optics structure.