公开(公告)号：US11594506B2

公开(公告)日：2023-02-28

申请号：US17030181

申请日：2020-09-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Pei-Jen Lo ,  Shun-Tsat Tu ,  Cheng-En Weng

IPC: H01L23/00

Abstract: A semiconductor package is provided. The semiconductor package includes a first conductive layer, a plurality of first conductive pads, a plurality of second conductive pads, and a first dielectric layer. The first conductive pads are electrically connected to the first conductive layer. The second conductive pads are electrically disconnected from the first conductive layer.

公开(公告)号：US20230048279A1

公开(公告)日：2023-02-16

申请号：US17401019

申请日：2021-08-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Wei CHEN

IPC: G01S7/4863 ,  H01L25/065 ,  G01S7/484

Abstract: An optical element is provided. The optical device includes a carrier, a first receiver, and a second receiver. The first receiver is disposed on the carrier and configured to receive a first light. The second receiver is disposed on the carrier and configured to receive a second light. The first light and the second light have different frequency bands.

公开(公告)号：US11581273B2

公开(公告)日：2023-02-14

申请号：US16727723

申请日：2019-12-26

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Meng-Wei Hsieh

IPC: H01L23/66 ,  H01L23/522 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01Q1/38

Abstract: A semiconductor device package includes a first circuit layer and an emitting device. The first circuit layer has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The emitting device is disposed on the second surface of the first circuit layer. The emitting device has a first surface facing the second surface of the first circuit layer, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The emitting device has a conductive pattern disposed on the second surface of the emitting device. The lateral surface of the emitting device and the lateral surface of the first circuit layer are discontinuous.

公开(公告)号：US11581123B2

公开(公告)日：2023-02-14

申请号：US16937498

申请日：2020-07-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Syu-Tang Liu ,  Huang-Hsien Chang ,  Yunghsun Chen

IPC: H01F27/28 ,  H01F27/24 ,  H01F27/32 ,  H01F27/40 ,  H05K3/30 ,  H05K3/46 ,  H01F41/04 ,  H05K1/18

Abstract: An inductor unit includes a conductive structure, a first magnetic element and an insulating layer. The conductive structure has a bottom conductive layer, a top conductive layer, and a first side conductive layer extending from the bottom conductive layer to the top conductive layer. The first magnetic element is disposed on the bottom conductive layer of the conductive structure. The insulating layer is disposed on the bottom conductive layer of the conductive structure, wherein the insulating layer covers and surrounds the first magnetic element. The circuit structure including the inductor unit and the methods for manufacturing the same are also provided.

公开(公告)号：US20230045587A1

公开(公告)日：2023-02-09

申请号：US17396596

申请日：2021-08-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jenchun CHEN ,  Chang-Fu LU

IPC: H01Q21/08 ,  H01Q9/04

Abstract: An antenna device and a method for manufacturing the same are provided. The antenna device includes a carrier and an antenna element. The carrier includes a plurality of pads and has a surface exposing the pads. The antenna element is disposed above the pads. A lateral surface of one of the pads is farther from a central axis of the antenna element substantially perpendicular to the surface than from a lateral surface of the antenna element.

公开(公告)号：US20230042800A1

公开(公告)日：2023-02-09

申请号：US17396604

申请日：2021-08-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： You-Lung YEN ,  Bernd Karl APPELT

IPC: H01L23/433 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00

Abstract: An electronic package is provided in the present disclosure. The electronic package comprises: a heat spreading component; a first electronic component disposed on the heat spreading component; and a second electronic component disposed on the first electronic component, wherein the second electronic component comprises an interconnection structure passing through the second electronic component and electrically connecting the first electronic component. In this way, through the use of the interconnection structure, the heat dissipation of the electronic components in the package can be improved. Also, through the use of the encapsulant, the stacked electronic components can be protected by the encapsulant so as to avoid being damaged.

公开(公告)号：US11575995B2

公开(公告)日：2023-02-07

申请号：US17244885

申请日：2021-04-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin Yeh

IPC: H04R19/00 ,  H04R19/02 ,  B81B7/00 ,  B81C1/00 ,  H04R1/02 ,  H04R31/00 ,  H04R7/04

Abstract: A semiconductor package device and a method of manufacturing a semiconductor package device are provided. The semiconductor package device includes a substrate, a first electronic component, and an encapsulation layer. The substrate has a first surface, a second surface opposite to the first surface, and a first opening extending from the first surface to the second surface. The first electronic component is disposed on the first surface of the substrate. The encapsulation layer is formed on the second surface of the substrate. The encapsulation layer includes a chamber connected to the first opening, and a width of the first opening is smaller than a width of the chamber.

公开(公告)号：US20230023398A1

公开(公告)日：2023-01-26

申请号：US17383270

申请日：2021-07-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jenchun CHEN ,  Shyue-Long LOUH

IPC: H01Q1/44 ,  H01Q1/52

Abstract: An antenna device and a method for manufacturing the same are provided. The antenna device includes a carrier, an antenna portion, a first portion and a second portion. The antenna portion is located on the carrier. The first portion is located on the carrier. The second portion is located on the carrier and is configured for blocking a material from entering the antenna area, wherein the material covers a lateral surface of the carrier.

公开(公告)号：US20230019715A1

公开(公告)日：2023-01-19

申请号：US17377168

申请日：2021-07-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Chih LEE ,  Chih Lung LIN

IPC: A61B5/00 ,  A61B5/318 ,  A61B5/389 ,  A61B5/398

Abstract: The present disclosure provides a detection module including a carrier configured to be adjustable to at least partially conform to a shape of a wearable object. The detection module further includes a sensing element in contact with the carrier and at least partially exposed from the carrier.

公开(公告)号：US20230006114A1

公开(公告)日：2023-01-05

申请号：US17367052

申请日：2021-07-02

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Hsuan WU ,  Chang-Yu LIN ,  Yu-Sheng HUANG

IPC: H01L33/62 ,  H01L31/0224 ,  H01L23/488 ,  H01L33/58 ,  H01L31/0232 ,  G02B6/12

Abstract: An optoelectronic package structure and a method of manufacturing an optoelectronic package structure are provided. The optoelectronic package structure includes a photonic component. The photonic component has an electrical connection region, a blocking region and a region for accommodating a device. The blocking region is located between the electrical connection region and the region for accommodating a device.