公开(公告)号：US20070190764A1

公开(公告)日：2007-08-16

申请号：US11706186

申请日：2007-02-15

申请人： Hoe-Ku Jung ,  Myung-Sam Kang ,  Ji-Eun Kim ,  Jung-Hyun Park

发明人： Hoe-Ku Jung ,  Myung-Sam Kang ,  Ji-Eun Kim ,  Jung-Hyun Park

IPC分类号： H01L21/20

CPC分类号： H01L21/481 ,  H01L23/13 ,  H01L24/73 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1058 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H05K1/183 ,  H05K3/205 ,  H05K3/4658 ,  H05K3/4697 ,  H05K2203/0568 ,  H05K2203/0571 ,  H05K2203/308 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An aspect of the present invention features a method for manufacturing a substrate having a cavity. The method can comprises: (a) forming an upper layer circuit on an upper seed layer; (b) laminating a dry film on a portion of the-upper seed layer where a cavity is to be formed; (c) fabricating an upper outer layer by forming an insulation layer on top of the upper seed layer and on top and sides of the upper layer circuit; (d) stacking the upper outer layer on one side of a core layer where an internal circuit is formed; (e) removing the upper seed layer; and (f) forming the cavity by removing the dry film. The method for manufacturing a substrate with a cavity according to the present invention can reduce the total thickness of the substrate while the thickness of an insulation layer remains the same, by forming the insulation layer on sides of an external circuit.

摘要翻译： 本发明的一个方面的特征在于一种用于制造具有腔的衬底的方法。 该方法可以包括：（a）在上种子层上形成上层电路; （b）在要形成空腔的上部种子层的一部分上层叠干膜; （c）通过在上部种子层的顶部和上层电路的顶部和侧面上形成绝缘层来制造上部外层; （d）在形成有内部电路的芯层的一侧堆叠上外层; （e）去除上部种子层; 和（f）通过去除干膜形成空腔。 根据本发明的用于制造具有腔的衬底的方法可以通过在外部电路的侧面上形成绝缘层来减小衬底的总厚度，同时绝缘层的厚度保持相同。

公开(公告)号：US20070151943A1

公开(公告)日：2007-07-05

申请号：US11711673

申请日：2007-02-28

申请人： Won-youl Choi ,  Byeong-cheon Koh ,  Kyung-won Na ,  Sang-on Choi ,  Myung-sam Kang ,  Keon-yang Park

发明人： Won-youl Choi ,  Byeong-cheon Koh ,  Kyung-won Na ,  Sang-on Choi ,  Myung-sam Kang ,  Keon-yang Park

IPC分类号： H01B13/00 ,  B44C1/22

CPC分类号： G01R33/05 ,  G01R33/04 ,  Y10T29/4906

摘要： A fluxgate sensor is integrated in a printed circuit board. The fluxgate sensor has two bar-type (or rectangular-ring shaped) soft magnetic cores to form a closed magnetic path on a printed circuit board and an excitation coil in the form of a metal film is wound around the two bar-type soft magnetic cores either in a united structure that winds the two bar-type soft magnetic cores altogether, or in a separated structure that winds the two bar-type soft magnetic cores respectively, both in a pattern of number ‘8’. A pick-up coil is mounted on the excitation coil, either winding the two bars altogether, or respectively, in a solenoid pattern. The fluxgate sensor integrated in the printed circuit board can be mass-produced at a cheap manufacturing cost. The fluxgate sensor also can be made compact-sized, and at the same time, is capable of forming a closed-magnetic path. As a result, flux leakage is minimized, and the fluxgate sensor has a high sensitivity as it detects the magnetic field through a variable driving.

摘要翻译： 磁通门传感器集成在印刷电路板中。 磁通门传感器具有两个棒状（或矩形环形）软磁芯，以在印刷电路板上形成封闭的磁路，并且金属膜形式的励磁线圈缠绕在两个棒式软磁体 核心是以两个棒式软磁芯一起卷绕的联合结构，或者分别以两个条形软磁芯分别缠绕在两个条型软磁芯中，两者都是以“8”的形式。 拾波线圈安装在励磁线圈上，或者以螺线管图案分别缠绕两个杆。 集成在印刷电路板中的磁通门传感器可以以便宜的制造成本批量生产。 磁通门传感器也可以制造成紧凑的尺寸，并且同时能够形成闭合磁路径。 结果，漏磁通被最小化，并且磁通门传感器通过可变驱动来检测磁场时具有高灵敏度。

公开(公告)号：US07212001B2

公开(公告)日：2007-05-01

申请号：US10228965

申请日：2002-08-28

申请人： Won-youl Choi ,  Byeong-cheon Koh ,  Kyung-won Na ,  Sang-on Choi ,  Myung-sam Kang ,  Keon-yang Park

发明人： Won-youl Choi ,  Byeong-cheon Koh ,  Kyung-won Na ,  Sang-on Choi ,  Myung-sam Kang ,  Keon-yang Park

IPC分类号： G01R33/04

CPC分类号： G01R33/05 ,  G01R33/04 ,  Y10T29/4906

摘要： A fluxgate sensor is integrated in a printed circuit board. The fluxgate sensor has two bar-type(or rectangular-ring shaped) soft magnetic cores to form a closed magnetic path on a printed circuit board and an excitation coil in the form of a metal film is wound around the two bar-type soft magnetic cores either in a united structure that winds the two bar-type soft magnetic cores altogether, or in a separated structure that winds the two bar-type soft magnetic cores respectively, both in a pattern of number ‘8’. A pick-up coil is mounted on the excitation coil, either winding the two bars altogether, or respectively, in a solenoid pattern. The fluxgate sensor integrated in the printed circuit board can be mass-produced at a cheap manufacturing cost. The fluxgate sensor also can be made compact-sized, and at the same time, is capable of forming a closed-magnetic path. As a result, flux leakage is minimized, and the fluxgate sensor has a high sensitivity as it detects the magnetic field through a variable driving.

摘要翻译： 磁通门传感器集成在印刷电路板中。 磁通门传感器具有两个棒状（或矩形环形）软磁芯，以在印刷电路板上形成封闭的磁路，并且金属膜形式的励磁线圈缠绕在两个棒式软磁体 核心是以两个棒式软磁芯一起卷绕的联合结构，或者分别以两个条形软磁芯分别缠绕在两个条型软磁芯中，两者都是以“8”的形式。 拾波线圈安装在励磁线圈上，或者以螺线管图案分别缠绕两个杆。 集成在印刷电路板中的磁通门传感器可以以便宜的制造成本批量生产。 磁通门传感器也可以制造成紧凑的尺寸，并且同时能够形成闭合磁路径。 结果，漏磁通被最小化，并且磁通门传感器通过可变驱动来检测磁场时具有高灵敏度。

公开(公告)号：US06998840B2

公开(公告)日：2006-02-14

申请号：US10228948

申请日：2002-08-28

申请人： Won-youl Choi ,  Keon-yang Park ,  Byeong-cheon Koh ,  Myung-sam Kang ,  Kyung-won Na ,  Sang-on Choi

发明人： Won-youl Choi ,  Keon-yang Park ,  Byeong-cheon Koh ,  Myung-sam Kang ,  Kyung-won Na ,  Sang-on Choi

IPC分类号： G01R33/04

CPC分类号： G01R33/05 ,  G01R15/185 ,  G01R33/04 ,  Y10T29/49073 ,  Y10T29/49075

摘要： A fluxgate sensor integrated in a printed circuit board. The fluxgate sensor has soft magnetic cores having a lower core and an upper core mounted on the lower core, for forming a closed magnetic path on a printed circuit board, an excitation coil formed as a metal film, alternately winding the upper and the lower soft magnetic cores substantially in a number ‘8’ pattern, and a pick-up coil formed as a metal film, having a structure of winding the upper and the lower soft magnetic cores substantially in a solenoid pattern, the pick-up coil being placed on the same plane as an external contour of the excitation coil.

摘要翻译： 集成在印刷电路板中的磁通门传感器。 磁通门传感器具有软磁芯，其具有安装在下芯上的下芯和上芯，用于在印刷电路板上形成闭合磁路，形成为金属膜的励磁线圈，交替地卷绕上软和下软 基本上为“8”图案的磁芯和形成为金属膜的拾取线圈，其具有将上下软磁芯基本上卷绕在螺线管图案中的结构，拾取线圈被放置在 与激励线圈的外部轮廓相同的平面。

公开(公告)号：US06755229B2

公开(公告)日：2004-06-29

申请号：US09984282

申请日：2001-10-29

申请人： Myung-Sam Kang ,  Keon-Yang Park ,  Jang-Kyu Kang

发明人： Myung-Sam Kang ,  Keon-Yang Park ,  Jang-Kyu Kang

IPC分类号： B32B3500

CPC分类号： H01L21/50 ,  H01L23/36 ,  H01L23/49816 ,  H01L2924/0002 ,  Y10T156/1744 ,  H01L2924/00

摘要： Disclosed are a method for preparing a high performance BGA board and a jig applicable to the method. The method comprises pre-bonding an adhesive to a BGA board laminated structure or a heatsink by use of a jig; and main-bonding the BGA board laminated structure or the heatsink to which the adhesive is previously stuck in the pre-bonding step to the heatsink or the BGA board laminated structure, respectively, by use of a jig. A high performance BGA board can be prepared by use of an individual heatsink and a strip-type jig without a strip-type heatsink, and in which the Ni-plated side of the heatsink can be prevented from being contaminated.

摘要翻译： 公开了一种制备适用于该方法的高性能BGA板和夹具的方法。 该方法包括使用夹具将粘合剂预粘合到BGA板层叠结构或散热片上; 并且通过使用夹具将BGA板层压结构或粘合剂预先粘附在预粘合步骤中的散热器分别主要粘合到散热器或BGA板层叠结构。 可以通过使用单独的散热器和无带式散热器的带状夹具来制备高性能BGA板，并且可以防止散热器的镀镍侧被污染。

公开(公告)号：US06747450B2

公开(公告)日：2004-06-08

申请号：US10140294

申请日：2002-05-08

申请人： Myung-Sam Kang ,  Kyoung-Won Na ,  Sang-On Choi ,  Won-Youl Choi ,  Jeong-Hwan Lee ,  Keon-Yang Park

发明人： Myung-Sam Kang ,  Kyoung-Won Na ,  Sang-On Choi ,  Won-Youl Choi ,  Jeong-Hwan Lee ,  Keon-Yang Park

IPC分类号： G01R3304

CPC分类号： H05K1/165 ,  G01R33/05 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/086 ,  H05K2201/09536 ,  H05K2201/10416

摘要： A weak-magnetic field sensor using printed circuit board manufacturing technique and a method of manufacturing the same which detects earth magnetism to obtain positional information is disclosed. The sensor comprises a magnetic layer patterned in a certain shape; a first stacked board stacked on a lower surface of the magnetic layer and formed with a first driving pattern; a second stacked board stacked on an upper surface of the magnetic layer and formed with a second driving pattern, the first and second driving patterns being electrically connected to each other; a third lower stacked board stacked on a lower surface of the first stacked board and formed with a first pickup pattern; and a third upper stacked board stacked on an upper surface of the second stacked board and formed with a second pickup pattern, the third lower and upper stacked boards being electrically connected to each other.

摘要翻译： 公开了使用印刷电路板制造技术的弱磁场传感器及其制造方法，其检测地磁以获得位置信息。 传感器包括以特定形状图案化的磁性层; 堆叠在所述磁性层的下表面上并形成有第一驱动图案的第一堆叠板; 堆叠在所述磁性层的上表面上并形成有第二驱动图案的第二堆叠板，所述第一和第二驱动图案彼此电连接; 堆叠在第一堆叠板的下表面上并形成有第一拾取图案的第三下堆叠板; 以及堆叠在所述第二堆叠板的上表面上并形成有第二拾取图案的第三上堆叠板，所述第三下堆叠板和上堆叠板彼此电连接。