摘要:
A fluxgate sensor is integrated in a printed circuit board. The fluxgate sensor has two bar-type (or rectangular-ring shaped) soft magnetic cores to form a closed magnetic path on a printed circuit board and an excitation coil in the form of a metal film is wound around the two bar-type soft magnetic cores either in a united structure that winds the two bar-type soft magnetic cores altogether, or in a separated structure that winds the two bar-type soft magnetic cores respectively, both in a pattern of number ‘8’. A pick-up coil is mounted on the excitation coil, either winding the two bars altogether, or respectively, in a solenoid pattern. The fluxgate sensor integrated in the printed circuit board can be mass-produced at a cheap manufacturing cost. The fluxgate sensor also can be made compact-sized, and at the same time, is capable of forming a closed-magnetic path. As a result, flux leakage is minimized, and the fluxgate sensor has a high sensitivity as it detects the magnetic field through a variable driving.
摘要:
A fluxgate sensor is integrated in a printed circuit board. The fluxgate sensor has two bar-type (or rectangular-ring shaped) soft magnetic cores to form a closed magnetic path on a printed circuit board and an excitation coil in the form of a metal film is wound around the two bar-type soft magnetic cores either in a united structure that winds the two bar-type soft magnetic cores altogether, or in a separated structure that winds the two bar-type soft magnetic cores respectively, both in a pattern of number ‘8’. A pick-up coil is mounted on the excitation coil, either winding the two bars altogether, or respectively, in a solenoid pattern. The fluxgate sensor integrated in the printed circuit board can be mass-produced at a cheap manufacturing cost. The fluxgate sensor also can be made compact-sized, and at the same time, is capable of forming a closed-magnetic path. As a result, flux leakage is minimized, and the fluxgate sensor has a high sensitivity as it detects the magnetic field through a variable driving.
摘要:
A fluxgate sensor is integrated in a printed circuit board. The fluxgate sensor has two bar-type(or rectangular-ring shaped) soft magnetic cores to form a closed magnetic path on a printed circuit board and an excitation coil in the form of a metal film is wound around the two bar-type soft magnetic cores either in a united structure that winds the two bar-type soft magnetic cores altogether, or in a separated structure that winds the two bar-type soft magnetic cores respectively, both in a pattern of number ‘8’. A pick-up coil is mounted on the excitation coil, either winding the two bars altogether, or respectively, in a solenoid pattern. The fluxgate sensor integrated in the printed circuit board can be mass-produced at a cheap manufacturing cost. The fluxgate sensor also can be made compact-sized, and at the same time, is capable of forming a closed-magnetic path. As a result, flux leakage is minimized, and the fluxgate sensor has a high sensitivity as it detects the magnetic field through a variable driving.
摘要:
A fluxgate sensor integrated in a printed circuit board. The fluxgate sensor has soft magnetic cores having a lower core and an upper core mounted on the lower core, for forming a closed magnetic path on a printed circuit board, an excitation coil formed as a metal film, alternately winding the upper and the lower soft magnetic cores substantially in a number ‘8’ pattern, and a pick-up coil formed as a metal film, having a structure of winding the upper and the lower soft magnetic cores substantially in a solenoid pattern, the pick-up coil being placed on the same plane as an external contour of the excitation coil.
摘要:
Disclosed are a method for preparing a high performance BGA board and a jig applicable to the method. The method comprises pre-bonding an adhesive to a BGA board laminated structure or a heatsink by use of a jig; and main-bonding the BGA board laminated structure or the heatsink to which the adhesive is previously stuck in the pre-bonding step to the heatsink or the BGA board laminated structure, respectively, by use of a jig. A high performance BGA board can be prepared by use of an individual heatsink and a strip-type jig without a strip-type heatsink, and in which the Ni-plated side of the heatsink can be prevented from being contaminated.
摘要:
A weak-magnetic field sensor using printed circuit board manufacturing technique and a method of manufacturing the same which detects earth magnetism to obtain positional information is disclosed. The sensor comprises a magnetic layer patterned in a certain shape; a first stacked board stacked on a lower surface of the magnetic layer and formed with a first driving pattern; a second stacked board stacked on an upper surface of the magnetic layer and formed with a second driving pattern, the first and second driving patterns being electrically connected to each other; a third lower stacked board stacked on a lower surface of the first stacked board and formed with a first pickup pattern; and a third upper stacked board stacked on an upper surface of the second stacked board and formed with a second pickup pattern, the third lower and upper stacked boards being electrically connected to each other.
摘要:
A method for manufacturing a printed circuit board is disclosed. When a metal is plated on an upper board to form a circuit, bonding fingers for being bonded with a semiconductor chip are prevented from being electroplated with a metal. That is, a slot with an ink layer formed therein is formed in each of a plurality of boards. Then window regions of different sizes are defined, and a working is carried out on the portion where the slots are not formed. That is, the copper clad laminates are subjected to a working to form slots, and an ink layer is formed within each of the slots. In this manner, during the plating of the upper face of the printed circuit board, the metal is prevented from intruding into the window region, thereby preventing the formation of a short circuit.
摘要:
A fluxgate sensor integrated in a printed circuit board. The fluxgate sensor has soft magnetic cores having a lower core and an upper core mounted on the lower core, for forming a closed magnetic path on a printed circuit board, an excitation coil formed as a metal film, alternately winding the upper and the lower soft magnetic cores substantially in a number ‘8’ pattern, and a pick-up coil formed as a metal film, having a structure of winding the upper and the lower soft magnetic cores substantially in a solenoid pattern, the pick-up coil being placed on the same plane as an external contour of the excitation coil.
摘要:
A weak-magnetic field sensor using printed circuit board manufacturing technique and a method of manufacturing the same which detects the Earth's magnetic field to obtain positional information is disclosed. The sensor comprises a first base board which is formed at its upper and lower surfaces with first driving patterns such that the upper and lower first driving patterns are electrically connected to each other, a pair of first stacked boards which are stacked on upper and lower surfaces of the first base board and which are formed with magnetic layers to be parallel to each other and patterned in a certain shape, and a pair of second stacked boards which are stacked on outer surfaces of the pair of first stacked boards and which are formed with second driving patterns electrically connected to the first driving patterns of the first base board to surround magnetic layers and formed with pickup patterns to surround the first and second driving patterns.
摘要:
A method for manufacturing a build-up multi-layer printed circuit board is disclosed in which a YAG laser is used upon the formation of a via hole in the multi-layer printed circuit board, such that it can have the following advantages: the manufacturing process would become simple; the component packaging density and freedom for the design of the board would be improved; and a high speed of signal process would be ensured. The method for manufacturing a build-up multi-layer printed circuit board includes the steps of: forming a first printed circuit pattern on a copper clad laminate (CCL) by applying a general photo-etching process, the CCL having a copper foil on the one face thereof; stacking a resin-coated (on one face) copper foil (RCC) on the CCL with the first printed circuit pattern formed thereon, and heating and pressing this structure; irradiating a YAG laser to the board with said RCC stacked so as to form a via hole at a predetermined position by removing said RCC; carrying out an electroless and electro copper plating on the board with the via hole formed therein to form a plated layer; and forming a second printed circuit pattern on said plated layer to electrically connect the layers on which the first and second printed circuit patterns are formed.