Fluxgate sensor integrated in printed circuit board and method for manufacturing the same
    1.
    发明授权
    Fluxgate sensor integrated in printed circuit board and method for manufacturing the same 有权
    集成在印刷电路板中的磁通门传感器及其制造方法

    公开(公告)号:US07407596B2

    公开(公告)日:2008-08-05

    申请号:US11711673

    申请日:2007-02-28

    IPC分类号: H01L21/302

    摘要: A fluxgate sensor is integrated in a printed circuit board. The fluxgate sensor has two bar-type (or rectangular-ring shaped) soft magnetic cores to form a closed magnetic path on a printed circuit board and an excitation coil in the form of a metal film is wound around the two bar-type soft magnetic cores either in a united structure that winds the two bar-type soft magnetic cores altogether, or in a separated structure that winds the two bar-type soft magnetic cores respectively, both in a pattern of number ‘8’. A pick-up coil is mounted on the excitation coil, either winding the two bars altogether, or respectively, in a solenoid pattern. The fluxgate sensor integrated in the printed circuit board can be mass-produced at a cheap manufacturing cost. The fluxgate sensor also can be made compact-sized, and at the same time, is capable of forming a closed-magnetic path. As a result, flux leakage is minimized, and the fluxgate sensor has a high sensitivity as it detects the magnetic field through a variable driving.

    摘要翻译: 磁通门传感器集成在印刷电路板中。 磁通门传感器具有两个棒状(或矩形环形)软磁芯,以在印刷电路板上形成封闭的磁路,并且金属膜形式的励磁线圈缠绕在两个棒式软磁体 核心是以两个棒式软磁芯一起卷绕的联合结构,或者分别以两个条形软磁芯分别缠绕在两个条型软磁芯中,两者都是以“8”的形式。 拾波线圈安装在励磁线圈上,或者以螺线管图案分别缠绕两个杆。 集成在印刷电路板中的磁通门传感器可以以便宜的制造成本批量生产。 磁通门传感器也可以制造成紧凑的尺寸,并且同时能够形成闭合磁路径。 结果,漏磁通被最小化,并且磁通门传感器通过可变驱动来检测磁场时具有高灵敏度。

    Fluxgate sensor integrated in printed circuit board and method for manufacturing the same
    2.
    发明申请
    Fluxgate sensor integrated in printed circuit board and method for manufacturing the same 有权
    集成在印刷电路板中的磁通门传感器及其制造方法

    公开(公告)号:US20070151943A1

    公开(公告)日:2007-07-05

    申请号:US11711673

    申请日:2007-02-28

    IPC分类号: H01B13/00 B44C1/22

    摘要: A fluxgate sensor is integrated in a printed circuit board. The fluxgate sensor has two bar-type (or rectangular-ring shaped) soft magnetic cores to form a closed magnetic path on a printed circuit board and an excitation coil in the form of a metal film is wound around the two bar-type soft magnetic cores either in a united structure that winds the two bar-type soft magnetic cores altogether, or in a separated structure that winds the two bar-type soft magnetic cores respectively, both in a pattern of number ‘8’. A pick-up coil is mounted on the excitation coil, either winding the two bars altogether, or respectively, in a solenoid pattern. The fluxgate sensor integrated in the printed circuit board can be mass-produced at a cheap manufacturing cost. The fluxgate sensor also can be made compact-sized, and at the same time, is capable of forming a closed-magnetic path. As a result, flux leakage is minimized, and the fluxgate sensor has a high sensitivity as it detects the magnetic field through a variable driving.

    摘要翻译: 磁通门传感器集成在印刷电路板中。 磁通门传感器具有两个棒状(或矩形环形)软磁芯,以在印刷电路板上形成封闭的磁路,并且金属膜形式的励磁线圈缠绕在两个棒式软磁体 核心是以两个棒式软磁芯一起卷绕的联合结构,或者分别以两个条形软磁芯分别缠绕在两个条型软磁芯中,两者都是以“8”的形式。 拾波线圈安装在励磁线圈上,或者以螺线管图案分别缠绕两个杆。 集成在印刷电路板中的磁通门传感器可以以便宜的制造成本批量生产。 磁通门传感器也可以制造成紧凑的尺寸,并且同时能够形成闭合磁路径。 结果,漏磁通被最小化,并且磁通门传感器通过可变驱动来检测磁场时具有高灵敏度。

    Fluxgate sensor integrated having pick-up coil mounted on excitation coil in printed circuit board and method for manufacturing the same
    3.
    发明授权
    Fluxgate sensor integrated having pick-up coil mounted on excitation coil in printed circuit board and method for manufacturing the same 有权
    集成有印刷电路板中安装在励磁线圈上的拾取线圈的磁通门传感器及其制造方法

    公开(公告)号:US07212001B2

    公开(公告)日:2007-05-01

    申请号:US10228965

    申请日:2002-08-28

    IPC分类号: G01R33/04

    摘要: A fluxgate sensor is integrated in a printed circuit board. The fluxgate sensor has two bar-type(or rectangular-ring shaped) soft magnetic cores to form a closed magnetic path on a printed circuit board and an excitation coil in the form of a metal film is wound around the two bar-type soft magnetic cores either in a united structure that winds the two bar-type soft magnetic cores altogether, or in a separated structure that winds the two bar-type soft magnetic cores respectively, both in a pattern of number ‘8’. A pick-up coil is mounted on the excitation coil, either winding the two bars altogether, or respectively, in a solenoid pattern. The fluxgate sensor integrated in the printed circuit board can be mass-produced at a cheap manufacturing cost. The fluxgate sensor also can be made compact-sized, and at the same time, is capable of forming a closed-magnetic path. As a result, flux leakage is minimized, and the fluxgate sensor has a high sensitivity as it detects the magnetic field through a variable driving.

    摘要翻译: 磁通门传感器集成在印刷电路板中。 磁通门传感器具有两个棒状(或矩形环形)软磁芯,以在印刷电路板上形成封闭的磁路,并且金属膜形式的励磁线圈缠绕在两个棒式软磁体 核心是以两个棒式软磁芯一起卷绕的联合结构,或者分别以两个条形软磁芯分别缠绕在两个条型软磁芯中,两者都是以“8”的形式。 拾波线圈安装在励磁线圈上,或者以螺线管图案分别缠绕两个杆。 集成在印刷电路板中的磁通门传感器可以以便宜的制造成本批量生产。 磁通门传感器也可以制造成紧凑的尺寸,并且同时能够形成闭合磁路径。 结果,漏磁通被最小化,并且磁通门传感器通过可变驱动来检测磁场时具有高灵敏度。

    Method for preparing high performance ball grid array board and jig applicable to said method
    5.
    发明授权
    Method for preparing high performance ball grid array board and jig applicable to said method 失效
    制备适用于所述方法的高性能球栅阵列板和夹具的方法

    公开(公告)号:US06755229B2

    公开(公告)日:2004-06-29

    申请号:US09984282

    申请日:2001-10-29

    IPC分类号: B32B3500

    摘要: Disclosed are a method for preparing a high performance BGA board and a jig applicable to the method. The method comprises pre-bonding an adhesive to a BGA board laminated structure or a heatsink by use of a jig; and main-bonding the BGA board laminated structure or the heatsink to which the adhesive is previously stuck in the pre-bonding step to the heatsink or the BGA board laminated structure, respectively, by use of a jig. A high performance BGA board can be prepared by use of an individual heatsink and a strip-type jig without a strip-type heatsink, and in which the Ni-plated side of the heatsink can be prevented from being contaminated.

    摘要翻译: 公开了一种制备适用于该方法的高性能BGA板和夹具的方法。 该方法包括使用夹具将粘合剂预粘合到BGA板层叠结构或散热片上; 并且通过使用夹具将BGA板层压结构或粘合剂预先粘附在预粘合步骤中的散热器分别主要粘合到散热器或BGA板层叠结构。 可以通过使用单独的散热器和无带式散热器的带状夹具来制备高性能BGA板,并且可以防止散热器的镀镍侧被污染。

    Weak-magnetic field sensor using printed circuit board manufacturing technique and method of manufacturing the same
    6.
    发明授权
    Weak-magnetic field sensor using printed circuit board manufacturing technique and method of manufacturing the same 失效
    使用印刷电路板制造技术的弱磁场传感器及其制造方法

    公开(公告)号:US06747450B2

    公开(公告)日:2004-06-08

    申请号:US10140294

    申请日:2002-05-08

    IPC分类号: G01R3304

    摘要: A weak-magnetic field sensor using printed circuit board manufacturing technique and a method of manufacturing the same which detects earth magnetism to obtain positional information is disclosed. The sensor comprises a magnetic layer patterned in a certain shape; a first stacked board stacked on a lower surface of the magnetic layer and formed with a first driving pattern; a second stacked board stacked on an upper surface of the magnetic layer and formed with a second driving pattern, the first and second driving patterns being electrically connected to each other; a third lower stacked board stacked on a lower surface of the first stacked board and formed with a first pickup pattern; and a third upper stacked board stacked on an upper surface of the second stacked board and formed with a second pickup pattern, the third lower and upper stacked boards being electrically connected to each other.

    摘要翻译: 公开了使用印刷电路板制造技术的弱磁场传感器及其制造方法,其检测地磁以获得位置信息。 传感器包括以特定形状图案化的磁性层; 堆叠在所述磁性层的下表面上并形成有第一驱动图案的第一堆叠板; 堆叠在所述磁性层的上表面上并形成有第二驱动图案的第二堆叠板,所述第一和第二驱动图案彼此电连接; 堆叠在第一堆叠板的下表面上并形成有第一拾取图案的第三下堆叠板; 以及堆叠在所述第二堆叠板的上表面上并形成有第二拾取图案的第三上堆叠板,所述第三下堆叠板和上堆叠板彼此电连接。

    Method for manufacturing printed circuit board
    7.
    发明授权
    Method for manufacturing printed circuit board 有权
    印刷电路板制造方法

    公开(公告)号:US06393696B1

    公开(公告)日:2002-05-28

    申请号:US09469795

    申请日:1999-12-21

    IPC分类号: H05K336

    摘要: A method for manufacturing a printed circuit board is disclosed. When a metal is plated on an upper board to form a circuit, bonding fingers for being bonded with a semiconductor chip are prevented from being electroplated with a metal. That is, a slot with an ink layer formed therein is formed in each of a plurality of boards. Then window regions of different sizes are defined, and a working is carried out on the portion where the slots are not formed. That is, the copper clad laminates are subjected to a working to form slots, and an ink layer is formed within each of the slots. In this manner, during the plating of the upper face of the printed circuit board, the metal is prevented from intruding into the window region, thereby preventing the formation of a short circuit.

    摘要翻译: 公开了一种印刷电路板的制造方法。 当金属镀在上板上以形成电路时,防止与半导体芯片接合的接合指状物被金属电镀。 也就是说,在多个板中的每一个中形成有形成有油墨层的槽。 然后定义不同尺寸的窗口区域,并且在未形成槽的部分进行加工。 也就是说,覆铜层压板经受加工以形成槽,并且在每个槽内形成油墨层。 以这种方式,在印刷电路板的上表面的电镀期间,防止金属进入窗口区域,从而防止形成短路。

    Fabricating method for a fluxgate sensor integrated in printed circuit board
    8.
    发明授权
    Fabricating method for a fluxgate sensor integrated in printed circuit board 有权
    集成在印刷电路板中的磁通门传感器的制造方法

    公开(公告)号:US07087450B2

    公开(公告)日:2006-08-08

    申请号:US11061611

    申请日:2005-02-22

    IPC分类号: H01L21/00

    摘要: A fluxgate sensor integrated in a printed circuit board. The fluxgate sensor has soft magnetic cores having a lower core and an upper core mounted on the lower core, for forming a closed magnetic path on a printed circuit board, an excitation coil formed as a metal film, alternately winding the upper and the lower soft magnetic cores substantially in a number ‘8’ pattern, and a pick-up coil formed as a metal film, having a structure of winding the upper and the lower soft magnetic cores substantially in a solenoid pattern, the pick-up coil being placed on the same plane as an external contour of the excitation coil.

    摘要翻译: 集成在印刷电路板中的磁通门传感器。 磁通门传感器具有软磁芯,其具有安装在下芯上的下芯和上芯,用于在印刷电路板上形成闭合磁路,形成为金属膜的励磁线圈,交替地卷绕上软和下软 基本上为“8”图案的磁芯和形成为金属膜的拾取线圈,其具有将上下软磁芯基本上卷绕在螺线管图案中的结构,拾取线圈被放置在 与激励线圈的外部轮廓相同的平面。

    Weak-magnetic field sensor using printed circuit board manufacturing technique and method of manufacturing the same
    9.
    发明授权
    Weak-magnetic field sensor using printed circuit board manufacturing technique and method of manufacturing the same 失效
    使用印刷电路板制造技术的弱磁场传感器及其制造方法

    公开(公告)号:US06759845B2

    公开(公告)日:2004-07-06

    申请号:US10140266

    申请日:2002-05-08

    IPC分类号: G01R3304

    摘要: A weak-magnetic field sensor using printed circuit board manufacturing technique and a method of manufacturing the same which detects the Earth's magnetic field to obtain positional information is disclosed. The sensor comprises a first base board which is formed at its upper and lower surfaces with first driving patterns such that the upper and lower first driving patterns are electrically connected to each other, a pair of first stacked boards which are stacked on upper and lower surfaces of the first base board and which are formed with magnetic layers to be parallel to each other and patterned in a certain shape, and a pair of second stacked boards which are stacked on outer surfaces of the pair of first stacked boards and which are formed with second driving patterns electrically connected to the first driving patterns of the first base board to surround magnetic layers and formed with pickup patterns to surround the first and second driving patterns.

    摘要翻译: 公开了使用印刷电路板制造技术的弱磁场传感器及其制造方法,其检测地球磁场以获得位置信息。 传感器包括第一基板,其在其上表面和下表面处形成有第一驱动图案,使得上和下第一驱动图案彼此电连接;一对第一堆叠板,其堆叠在上表面和下表面上 并且形成有彼此平行并且形成一定形状的磁性层的一对第二堆叠板,并且堆叠在一对第一堆叠板的外表面上并且形成有 第二驱动图案,电连接到第一基板的第一驱动图案以包围磁性层并形成有拾取图案以包围第一和第二驱动图案。

    Method for manufacturing build-up multi-layer printed circuit board by using yag laser
    10.
    发明授权
    Method for manufacturing build-up multi-layer printed circuit board by using yag laser 有权
    通过使用yag激光制造积层多层印刷电路板的方法

    公开(公告)号:US06405431B1

    公开(公告)日:2002-06-18

    申请号:US09467780

    申请日:1999-12-20

    IPC分类号: H01K310

    摘要: A method for manufacturing a build-up multi-layer printed circuit board is disclosed in which a YAG laser is used upon the formation of a via hole in the multi-layer printed circuit board, such that it can have the following advantages: the manufacturing process would become simple; the component packaging density and freedom for the design of the board would be improved; and a high speed of signal process would be ensured. The method for manufacturing a build-up multi-layer printed circuit board includes the steps of: forming a first printed circuit pattern on a copper clad laminate (CCL) by applying a general photo-etching process, the CCL having a copper foil on the one face thereof; stacking a resin-coated (on one face) copper foil (RCC) on the CCL with the first printed circuit pattern formed thereon, and heating and pressing this structure; irradiating a YAG laser to the board with said RCC stacked so as to form a via hole at a predetermined position by removing said RCC; carrying out an electroless and electro copper plating on the board with the via hole formed therein to form a plated layer; and forming a second printed circuit pattern on said plated layer to electrically connect the layers on which the first and second printed circuit patterns are formed.

    摘要翻译: 公开了一种用于制造积层多层印刷电路板的方法,其中在多层印刷电路板中形成通孔时使用YAG激光器,使得其可以具有以下优点:制造 过程变得简单; 组件封装密度和板的设计自由度将得到改善; 并且可以确保信号处理的高速度。 用于制造积层多层印刷电路板的方法包括以下步骤:通过施加一般的光蚀刻工艺在覆铜层压板(CCL)上形成第一印刷电路图案,将具有铜箔的CCL 一面; 在其上形成有第一印刷电路图案的CCL上堆叠树脂涂覆(一面)铜箔(RCC),并加热并压制该结构; 用所述RCC将YAG激光照射到所述板上,以便通过去除所述RCC在预定位置形成通孔; 在其上形成有通孔的板上进行化学镀和电镀铜以形成镀层; 以及在所述镀层上形成第二印刷电路图案,以电连接形成有第一和第二印刷电路图案的层。