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    Method for preparing high performance ball grid array board and jig applicable to said method
    1.
    发明授权
    Method for preparing high performance ball grid array board and jig applicable to said method 失效
    制备适用于所述方法的高性能球栅阵列板和夹具的方法

    公开(公告)号：US06755229B2

    公开(公告)日：2004-06-29

    申请号：US09984282

    申请日：2001-10-29

    申请人： Myung-Sam Kang ,  Keon-Yang Park ,  Jang-Kyu Kang

    发明人： Myung-Sam Kang ,  Keon-Yang Park ,  Jang-Kyu Kang

    IPC分类号： B32B3500

    CPC分类号： H01L21/50 ,  H01L23/36 ,  H01L23/49816 ,  H01L2924/0002 ,  Y10T156/1744 ,  H01L2924/00

    摘要： Disclosed are a method for preparing a high performance BGA board and a jig applicable to the method. The method comprises pre-bonding an adhesive to a BGA board laminated structure or a heatsink by use of a jig; and main-bonding the BGA board laminated structure or the heatsink to which the adhesive is previously stuck in the pre-bonding step to the heatsink or the BGA board laminated structure, respectively, by use of a jig. A high performance BGA board can be prepared by use of an individual heatsink and a strip-type jig without a strip-type heatsink, and in which the Ni-plated side of the heatsink can be prevented from being contaminated.

    摘要翻译： 公开了一种制备适用于该方法的高性能BGA板和夹具的方法。 该方法包括使用夹具将粘合剂预粘合到BGA板层叠结构或散热片上; 并且通过使用夹具将BGA板层压结构或粘合剂预先粘附在预粘合步骤中的散热器分别主要粘合到散热器或BGA板层叠结构。 可以通过使用单独的散热器和无带式散热器的带状夹具来制备高性能BGA板，并且可以防止散热器的镀镍侧被污染。

    Weak-magnetic field sensor using printed circuit board technology and method of manufacturing the same
    2.
    发明授权
    Weak-magnetic field sensor using printed circuit board technology and method of manufacturing the same 失效
    使用印刷电路板技术的弱磁场传感器及其制造方法

    公开(公告)号：US07015691B2

    公开(公告)日：2006-03-21

    申请号：US10639285

    申请日：2003-08-12

    申请人： Myung-Sam Kang ,  Sang-On Choi ,  Won-Youl Choi ,  Jang-Kyu Kang

    发明人： Myung-Sam Kang ,  Sang-On Choi ,  Won-Youl Choi ,  Jang-Kyu Kang

    IPC分类号： G01R33/04

    CPC分类号： G01R33/045 ,  G01R15/185 ,  H01F5/003 ,  Y10T29/49073

    摘要： In a weak-magnetic field sensor a rectangular ring-shaped magnetic core is wound by exciting circuit patterns and detecting circuit patterns, and weak-magnetic field sensors are implemented in x-axis and y-axis directions, respectively, to precisely calculate azimuth, thereby sensing a weak-magnetic field having a strength similar to that of earth's magnetic field. The sensor includes a magnetic core having first and second cores connected in parallel to each other; exciting coils wound around the first and second cores, respectively, to supply alternating excitation current to the magnetic core; and a detecting coil alternately arranged together with the exciting coils on the same surfaces on which the exciting coils are formed, and wound around the first and second cores, in order to detect variation of magnetic fluxes generated in the magnetic core.

    摘要翻译： 在弱磁场传感器中，通过激励电路图案和检测电路图案缠绕矩形环形磁芯，分别在x轴和y轴方向上实现弱磁场传感器，以精确计算方位角， 从而感测到具有与地球磁场强度类似的强度的弱磁场。 传感器包括具有彼此并联连接的第一和第二芯的磁芯; 励磁线圈分别缠绕在第一和第二芯上，以向磁芯提供交替的激励电流; 以及检测线圈，与励磁线圈交替布置在其上形成有励磁线圈的相同表面上，并缠绕在第一和第二芯上，以便检测在磁芯中产生的磁通量的变化。

    Printed circuit board with embedded capacitors therein, and process for manufacturing the same
    7.
    发明授权
    Printed circuit board with embedded capacitors therein, and process for manufacturing the same 失效
    具有嵌入式电容器的印刷电路板及其制造方法

    公开(公告)号：US06910266B2

    公开(公告)日：2005-06-28

    申请号：US10609618

    申请日：2003-07-01

    申请人： Seok-Kyu Lee ,  Jang-Kyu Kang ,  Hyun-Ju Jin ,  Byoung-Youl Min

    发明人： Seok-Kyu Lee ,  Jang-Kyu Kang ,  Hyun-Ju Jin ,  Byoung-Youl Min

    IPC分类号： H05K3/46 ,  H05K1/16 ,  H05K3/00 ,  H05K3/42 ,  H05K3/30

    CPC分类号： H05K1/162 ,  H05K3/0023 ,  H05K3/429 ,  H05K3/4652 ,  H05K3/4661 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2203/0568 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49155

    摘要： Disclosed herein are a printed circuit board with embedded capacitors therein and a process for manufacturing the printed circuit board. The embedded capacitors are formed by applying a photosensitive insulating resin to a printed circuit board inner layer, and applying a high dielectric polymer capacitor paste thereto. The process for manufacturing a printed circuit board with embedded capacitors therein comprises the steps of: i) laminating photoresist dry films to a copper clad FR-4, exposing to light and developing the dry films, and etching copper foils of the copper clad FR-4 to form bottom electrodes for forming capacitors; ii) applying a photosensitive insulating resin to the surfaces of the bottom electrodes, and exposing to light and developing to etch the photosensitive insulating resin; iii) applying a capacitor paste to the etched regions and curing the capacitor paste; iv) plating the upper regions of the cured capacitor paste and the photosensitive insulating resin using an electroless copper plating process to form copper foil layers for top electrodes; v) laminating photosensitive dry films to the copper foil layers for top electrodes, and exposing to light and developing the photosensitive dry films to etch regions of the dry films except for the copper foil layers where the top electrodes are to be formed; and vi) etching the regions of the dry films except for the copper foil layers where the top electrodes are to be formed, and the dry films formed on the top electrodes are removed so that the capacitor paste is discretely positioned between the top electrodes and the bottom electrodes to form discrete capacitors.

    摘要翻译： 这里公开了一种其中具有嵌入式电容器的印刷电路板和用于制造印刷电路板的工艺。 嵌入式电容器通过将印刷电路板内层施加感光绝缘树脂，并向其施加高介电聚合物电容器膏而形成。 制造具有嵌入式电容器的印刷电路板的方法包括以下步骤：i）将光致抗蚀剂干膜层压到铜包覆FR-4上，曝光并显影干膜，并蚀刻铜包覆FR- 4以形成用于形成电容器的底部电极; ii）将感光绝缘树脂施加到底部电极的表面，并暴露于光和显影以蚀刻感光绝缘树脂; iii）将电容器膏施加到蚀刻区域并固化电容器糊; iv）使用化学镀铜工艺电镀固化的电容器浆料和感光绝缘树脂的上部区域，以形成用于顶部电极的铜箔层; v）将感光性干膜层压到用于顶部电极的铜箔层上，暴露于光并显影感光干膜以蚀刻除了要形成顶部电极的铜箔层之外的干膜的区域; 以及vi）蚀刻除了要形成顶部电极的铜箔层之外的干膜的区域，并且除去形成在顶部电极上的干膜，使得电容器糊料离散地位于顶部电极和 底部电极形成分立电容。

    Printed circuit board with embedded capacitors therein, and process for manufacturing the same
    9.
    发明授权
    Printed circuit board with embedded capacitors therein, and process for manufacturing the same 有权
    具有嵌入式电容器的印刷电路板及其制造方法

    公开(公告)号：US07092237B2

    公开(公告)日：2006-08-15

    申请号：US11117315

    申请日：2005-04-29

    申请人： Seok-Kyu Lee ,  Jang-Kyu Kang ,  Hyun-Ju Jin ,  Byoung-Youl Min

    发明人： Seok-Kyu Lee ,  Jang-Kyu Kang ,  Hyun-Ju Jin ,  Byoung-Youl Min

    IPC分类号： H01G4/06 ,  H01G4/005

    CPC分类号： H05K1/162 ,  H05K3/0023 ,  H05K3/429 ,  H05K3/4652 ,  H05K3/4661 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2203/0568 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49155

    摘要： Disclosed herein are a printed circuit board with embedded capacitors therein and a process for manufacturing the printed circuit board. The embedded capacitors are formed by applying a photosensitive insulating resin to a printed circuit board inner layer, and applying a high dielectric polymer capacitor paste thereto. The process for manufacturing a printed circuit board with embedded capacitors therein comprises the steps of: i) laminating photo resist dry films to a copper clad FR-4, exposing to light and developing the dry films, and etching copper foils of the copper clad FR-4 to form bottom electrodes for forming capacitors; ii) applying a photosensitive insulating resin to the surfaces of the bottom electrodes, and exposing to light and developing to etch the photosensitive insulating resin; iii) applying a capacitor paste to the etched regions and curing the capacitor paste; iv) plating the upper regions of the cured capacitor paste and the photosensitive insulating resin using an electroless copper plating process to form copper foil layers for top electrodes; v) laminating photosensitive dry films to the copper foil layers for top electrodes, and exposing to light and developing the photosensitive dry films to etch regions of the dry films except for the copper foil layers where the top electrodes are to be formed; and vi) etching the regions of the dry films except for the copper foil layers where the top electrodes are to be formed, and the dry films formed on the top electrodes are removed so that the capacitor paste is discretely positioned between the top electrodes and the bottom electrodes to form discrete capacitors.

    摘要翻译： 这里公开了一种其中具有嵌入式电容器的印刷电路板和用于制造印刷电路板的工艺。 嵌入式电容器通过将印刷电路板内层施加感光绝缘树脂，并向其施加高介电聚合物电容器膏而形成。 制造具有嵌入式电容器的印刷电路板的方法包括以下步骤：i）将光致抗蚀剂干膜层压到铜包覆FR-4上，曝光并显影干膜，并蚀刻铜包覆FR的铜箔 -4形成用于形成电容器的底部电极; ii）将感光绝缘树脂施加到底部电极的表面，并暴露于光和显影以蚀刻感光绝缘树脂; iii）将电容器膏施加到蚀刻区域并固化电容器糊; iv）使用化学镀铜工艺电镀固化的电容器浆料和感光绝缘树脂的上部区域，以形成用于顶部电极的铜箔层; v）将感光性干膜层压到用于顶部电极的铜箔层上，暴露于光并显影感光干膜以蚀刻除了要形成顶部电极的铜箔层之外的干膜的区域; 以及vi）蚀刻除了要形成顶部电极的铜箔层之外的干膜的区域，并且除去形成在顶部电极上的干膜，使得电容器糊料离散地位于顶部电极和 底部电极形成分立电容。