摘要:
A semiconductor device including an isolation layer structure including a doped polysilicon layer pattern doped with first and second impurities of first and second conductivity types at lower and upper portions thereof, the doped polysilicon layer pattern being on an inner wall of a first trench on a substrate including an active region in which the first trench is not formed and a field region including the first trench, and an insulation structure filling a remaining portion of the first trench; a gate structure on the active region; a well region at a portion of the active region adjacent to lower portions of the doped polysilicon layer pattern and being doped with third impurities of the second conductivity type; and a source/drain at a portion of the active region adjacent to upper portions of the doped polysilicon layer pattern and being doped with fourth impurities of the first conductivity type.
摘要:
An example semiconductor device includes a trench formed in a semiconductor substrate to define an active region, a filling dielectric layer provided within the trench, an oxide layer provided between the filling dielectric layer and the trench, a nitride layer provided between the oxide layer and the filling dielectric layer, and a barrier layer provided between the oxide layer and the nitride layer.
摘要:
A print information processing apparatus for performing a printing process is disclosed. The print information processing apparatus is connected to a printer via a network and includes an interface configured to connect a removable recording medium; a data storage unit configured to store encrypted data; a decryption unit configured to read decryption information used to decrypt the encrypted data from the removable recording medium connected to the interface and to decrypt the encrypted data by using the decryption information. In the print information processing apparatus, the decryption unit permits the printing process of the encrypted data only when the removable recording medium is connected to the interface.
摘要:
An object of the present invention relates to provide an ethylene polymer having excellent mechanical strength and excellent molding processability in a wide molding processing temperature range. The invention relates to use an ethylene polymer comprising a repeating unit derived from ethylene, or a repeating unit derived from ethylene and a repeating unit derived from a C3-8 α-olefin, the ethylene polymer being satisfied with the following (A) to (F). (A) Density (d(kg/m3)) is from 910 to 970, (B) MFR(g/10 min)) is from 0.01 to 50, (C) terminal vinyl number is 0.2 or less per 1,000 carbon atoms, (D) melt strength (MS160 (mN)) measured at 160° C. and MFR are satisfied with MS160>90−130×log(MFR), (E) melt strength (MS190(mN)) measured at 190° C. and MS160 are satisfied with MS160/MS190
摘要:
A method includes the steps of: implanting boron into a surface region of a silicon substrate to form a p+ diffused region; implanting indium into the surface of the p+ diffused region, to form an indium-implanted layer; forming a contact metal layer on the indium-implanted layer; and reacting silicon in the silicon substrate including the indium-implanted layer with metal in the contact metal layer to form a titanium silicide layer.
摘要:
The present invention provides a polymerizable compound denoted by general formula (1). In general formula (1), A denotes an oxygen atom, sulfur atom, or NR, R denotes a hydrogen atom, alkyl group, aryl group, or heterocyclic group, X denotes a hydrogen atom, polymerizable group, optionally polymerizable group-substituted alkyl group or the like, B and C each independently denote a hydrogen atom, halogen atom, polymerizable group, optionally polymerizable group-substituted alkyl group or the like, wherein at least one from among B and C denotes a hydrogen atom and at least one from among X, Y, and Z comprises a polymerizable group, m denotes an integer ranging from 0 to 5, n denotes an integer ranging from 0 to 2, and Q denotes an elimination group.
摘要:
A magnetic element in a flat-plate shape includes a linearly-extending first flat plate being made of one of a magnetic material and a conductive material and a helical second flat plate being made of the other of the magnetic material and the conductive material, and the first flat plate is inserted into the helical structure of the second flat plate so as to alternatively weave front and back surfaces of the second flat plate.
摘要:
An azo compound and tautomer thereof represented by the following formula (1) or the formula (2): wherein R1, R2, R5, R7, R8, R10, R11, R14, R16, R17, R18, and R19 each independently represents a hydrogen atom, alkyl group, aryl group, alkoxy group, aryloxy group, alkylsulfonyl group, arylsulfonyl group, alkylthio group, arylthio group, cyano group, acyl group, carbamoyl group, amino group, nitro group, or halogen atom; R3, R4, R6, R9, R12, R13, R15, and R20 each independently represents a hydrogen atom, alkyl group, or aryl group; R1 and R2, R2 and R3, R3 and R4, R6 and R7, R7 and R8, R8 and R9, R10 and R11, R11 and R12, R12 and R13, R15 and R16, R16 and R17, R17 and R18, R18 and R19, and R19 and R20 may join to each other to form a ring structure, and A− represents a counter anion.
摘要翻译:由下式(1)或式(2)表示的偶氮化合物及其互变异构体:其中R 1,R 2,R 5, R 7,R 8,R 10,R 11,R 14,R 14, >,R 16,R 17,R 18和R 19各自独立地表示氢原子,烷基 芳基,烷氧基,芳氧基,烷基磺酰基,芳基磺酰基,烷硫基,芳硫基,氰基,酰基,氨基甲酰基,氨基,硝基或卤素原子; R 3,R 4,R 6,R 9,R 12, R 15,R 15和R 20各自独立地表示氢原子,烷基或芳基; R 1和R 2,R 2和R 3,R 3和R 3,和 R 4,R 6和R 7,R 7和R 8, R 8和R 9,R 10和R 11,R 11和R 11和 R 12,R 12和R 13,R 15和R 16, R 16和R 17,R 17和R 18,R 18和R 18和 R 19和R 19和R 20可以彼此连接以形成环结构,并且A 0〜 >表示抗衡阴离子。
摘要:
Provided is a holographic recording composition that comprises a monomer expressed by the Structural Formula (1) below: in the Structural Formula (1) shown above, X1 represents a hydrogen atom or a methyl group; Y1 represents an oxygen atom or NR10 (R10 represents a hydrogen atom or an alkyl group); L1 represents a divalent organic connecting group; n1 is an integer of 0 or 1; R1 to R9 may be identical or different each other and each represents a hydrogen atom, halogen atom, alkyl group, aryl group, heterocyclic group, alkoxy group, aryloxy group, alkoxycarbonyl group, aryloxycarbonyl group, carbamoyl group, sulfamoyl group, amino group, acyloxy group, acylamino group, hydroxyl group, carbonic acid group, sulfonic acid group, or a group expressed by the Structural Formula (1-1) below; R1 to R9 may be further substituted by a substituent; R1 and R2, R3 and R4, R4 and R5, R5 and R6, R6 and R7, or R8 and R9 may form a ring structure together with at least an adjacent carbon atom;
摘要翻译:提供一种全息记录组合物,其包含由下述结构式(1)表示的单体:在上述结构式(1)中,X 1表示氢原子或甲基; Y 1表示氧原子或NR 10(R 10表示氢原子或烷基); L 1表示二价有机连接基团; n 1是0或1的整数; R 1至R 9可彼此相同或不同,并且各自表示氢原子,卤素原子,烷基,芳基,杂环基,烷氧基,芳氧基 ,烷氧基羰基,芳氧基羰基,氨基甲酰基,氨磺酰基,氨基,酰氧基,酰氨基,羟基,碳酸基,磺酸基或下述结构式(1-1)表示的基团。 R 1至R 9可以进一步被取代基取代; R 1和R 2,R 3和R 4,R 4和R 4和 R 5,R 5和R 6,R 6和R 7, 或R 8和R 9可以与至少相邻的碳原子一起形成环结构;
摘要:
A cooling structure of an electronic equipment includes substrate housing parts, an upstream side duct, a downstream side duct, an exhaust device and an air adjusting part. The substrate housing parts detachably house therein one or plurality of substrate units, and the downstream side duct allows the cooling air, which passed from the upstream side duct though the substrate housing part, to flow. The exhaust device is provided at an exhaust part to forcibly discharge air to the outside, thereby allowing the cooling air to flow to the substrate housing parts. The air adjusting part adjusts the volume for cooling air which flows to the downstream side duct.