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    Tool and method for forming an integrated optical circuit
    122.
    发明授权
    Tool and method for forming an integrated optical circuit 有权
    用于形成集成光电路的工具和方法

    公开(公告)号：US06875379B2

    公开(公告)日：2005-04-05

    申请号：US09751537

    申请日：2000-12-29

    Applicant: Thomas P. Glenn ,  Steven Webster

    Inventor： Thomas P. Glenn ,  Steven Webster

    IPC: B29C33/38 ,  B29C33/42 ,  B29C33/56 ,  B29C43/36 ,  B29C43/46 ,  B29C45/00 ,  B29C59/14 ,  B29D11/00

    CPC classification number: B29C43/36 ,  B29C33/3842 ,  B29C33/42 ,  B29C33/565 ,  B29C43/46 ,  B29C45/00 ,  B29C59/14 ,  B29C2043/463

    Abstract: Tools and methods for making molded an optical integrated circuit including one or more waveguides are disclosed. In one embodiment, a molding die is provided that includes a substrate that has a topographically patterned first surface. A conformal protective film is provided over the first surface of the substrate. The substrate may be formed of silicon or gallium arsenide, and may be patterned using conventional semiconductor patterning techniques, such as plasma etching. The protective film may be metal (e.g., nickel or titanium), diamond, or some other hard material. Typically, a plurality of such molding dies are formed from a wafer of the substrate material. The die is pressed into a moldable material, such as thermal plastic, to form the wave guide(s) of the optical integrated circuit. A plurality of the dies may be mounted around the curved surface of a heated roller, and a heated tape of the waveguide material may be fed under the roller in a mass production process. Alternatively, the die may be mounted in an injection molding cavity, and the IOC may be formed by an injection molding process.

    Abstract translation: 公开了用于制造包括一个或多个波导的光学集成电路的工具和方法。 在一个实施例中，提供了一种模制模具，其包括具有地形图案化的第一表面的基底。 在衬底的第一表面上提供保形膜。 衬底可以由硅或砷化镓形成，并且可以使用常规的半导体图案化技术（诸如等离子体蚀刻）进行图案化。 保护膜可以是金属（例如镍或钛），金刚石或其它一些硬质材料。 通常，由基板材料的晶片形成多个这样的模具。 模具被压入诸如热塑性的可模制材料中，以形成光学集成电路的波导。 多个模具可以安装在加热辊的弯曲表面周围，并且波导材料的加热带可以在批量生产过程中在辊下进给。 或者，模具可以安装在注射模制腔中，并且IOC可以通过注射成型工艺形成。

    Flip chip on glass sensor package
    123.
    发明授权
    Flip chip on glass sensor package 有权
    翻转芯片在玻璃传感器封装

    公开(公告)号：US06849916B1

    公开(公告)日：2005-02-01

    申请号：US09713848

    申请日：2000-11-15

    Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

    Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

    IPC: H01L23/02 ,  H01L27/146 ,  H01L31/00 ,  H01L31/0203 ,  H04N5/225

    CPC classification number: H01L31/0203 ,  H01L27/14618 ,  H01L2924/0002 ,  H04N5/2253 ,  H01L2924/00

    Abstract: An image sensor package includes an image sensor having an active area and bond pads on a front surface of the image sensor. A window is mounted to the image sensor by flip chip bumps formed between the bond pads of the image sensor and interior traces on an interior surface of the window. The window has an area less than an area of the front surface of the image sensor. A bead is formed between the window and the front surface of the image sensor thus forming a sealed cavity in which the active area is located. The bead has sides coplanar with sides of the image sensor such that the image sensor package is chip size.

    Abstract translation: 图像传感器封装包括具有有源区域的图像传感器和图像传感器前表面上的接合焊盘。 通过在图像传感器的接合焊盘和窗口的内表面上的内部迹线之间形成的倒装芯片凸块将窗口安装到图像传感器。 窗口的面积小于图像传感器前表面的面积。 在窗口和图像传感器的前表面之间形成珠，从而形成有效区域所在的密封空腔。 珠粒具有与图像传感器的侧面共面的侧面，使得图像传感器封装是芯片尺寸。

    Method for forming an image sensor package with vision die in lens housing
    125.
    发明授权
    Method for forming an image sensor package with vision die in lens housing 有权
    用于在镜片壳体中形成具有视觉模具的图像传感器封装的方法

    公开(公告)号：US06734419B1

    公开(公告)日：2004-05-11

    申请号：US09896014

    申请日：2001-06-28

    Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

    Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

    IPC: H01J502

    CPC classification number: H04N5/2253 ,  H04N5/2254 ,  H04N5/2257

    Abstract: A method for forming an image sensor assembly includes forming a lead frame or Land Grid Array (LGA) integrally into a molded image sensor die package so that the lead frame or LGA is fully supported and structurally fortified by the molded image sensor die package. An image sensor die is then attached to the thus supported lead frame or LGA using a standard flip-chip connection.

    Abstract translation: 一种用于形成图像传感器组件的方法包括将引线框架或焊盘网格阵列（LGA）整体地形成到模制的图像传感器芯片封装中，使得引线框架或LGA被模制的图像传感器芯片封装完全支撑并在结构上加强。 然后使用标准倒装芯片连接将图像传感器裸片附接到如此支撑的引线框架或LGA。

    Integrally connected image sensor packages having a window support in contact with a window and the active area
    128.
    发明授权
    Integrally connected image sensor packages having a window support in contact with a window and the active area 有权
    具有与窗口和活动区域接触的窗口支撑件的整体连接的图像传感器封装

    公开(公告)号：US06515269B1

    公开(公告)日：2003-02-04

    申请号：US09490717

    申请日：2000-01-25

    Applicant: Steven Webster ,  Tony Arellano ,  Roy Dale Hollaway

    Inventor： Steven Webster ,  Tony Arellano ,  Roy Dale Hollaway

    IPC: H01L2700

    CPC classification number: H01L27/14618 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

    Abstract: An image sensor package includes an image sensor having an active area, a window, and a window support in contact with the active area and in contact with the window. The window support entirely encloses, and thus protects, the active area of the image sensor. During use, radiation passes through the window, passes through the window support, and strikes the active area, which responds to the radiation. By forming the window and the window support to have a similar refractive index, the amount of reflected radiation is minimized thus enhancing the sensitivity of the image sensor package. Further, the window support completely fills the region between the window and the active area thus eliminating any possibility of moisture condensation within the image sensor package.

    Abstract translation: 图像传感器封装包括具有活动区域，窗口和与活动区域接触并与窗口接触的窗口支撑件的图像传感器。 窗户支架完全封闭，从而保护图像传感器的有效区域。 在使用过程中，辐射通过窗户，穿过窗户支撑件，并撞击响应辐射的有源区域。 通过将窗口和窗口支撑件形成为具有类似的折射率，反射辐射的量被最小化，从而增强了图像传感器封装的灵敏度。 此外，窗户支撑件完全填充窗口和有效区域之间的区域，从而消除了图像传感器封装内的湿气凝结的任何可能性。

    Wafer scale image sensor package fabrication method
    129.
    发明授权
    Wafer scale image sensor package fabrication method 有权
    晶圆尺寸图像传感器封装制造方法

    公开(公告)号：US06503780B1

    公开(公告)日：2003-01-07

    申请号：US09610309

    申请日：2000-07-05

    Applicant: Thomas P. Glenn ,  Steven Webster ,  Tony Arellano

    Inventor： Thomas P. Glenn ,  Steven Webster ,  Tony Arellano

    IPC: H01L2144

    CPC classification number: H01L27/14618 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: To form an image sensor package, a series of shallow cuts are made in an interior surface of a window sheet having a plurality of windows. A window support layer is formed on an upper surface of a wafer having a plurality of image sensors. The interior surface of the window sheet is pressed into the window support layer such that the windows are above active areas of the image sensors. The shallow cuts in combination with the window support layer define cavities above bond pads of the image sensors. The window sheet is cut from an exterior surface directly opposite of the cavities above the bond pads to singulating the windows from one another. The wafer is then singulated to form a plurality of image sensor packages.

    Abstract translation: 为了形成图像传感器封装，在具有多个窗口的窗片的内表面中形成一系列浅切口。 在具有多个图像传感器的晶片的上表面上形成窗口支撑层。 窗片的内表面被压入窗户支撑层，使得窗口在图像传感器的有效区域之上。 与窗口支撑层组合的浅切口在图像传感器的接合焊盘上方形成空腔。 窗板从与接合垫上方的空腔直接相对的外表面切割，以将窗口彼此分开。 然后将晶片分割成多个图像传感器封装。

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