公开(公告)号：US08088856B2

公开(公告)日：2012-01-03

申请号：US12617919

申请日：2009-11-13

申请人： Toshio Shiobara ,  Tsutomu Kashiwagi ,  Yusuke Taguchi

发明人： Toshio Shiobara ,  Tsutomu Kashiwagi ,  Yusuke Taguchi

IPC分类号： C08L83/00 ,  C08K3/22 ,  C08K3/36 ,  C08K3/18 ,  C08K3/30

CPC分类号： C08G59/306 ,  C08G59/3245 ,  C08G59/42

摘要： A heat-curable resin composition that yields a cured product having excellent heat resistance and light resistance, and a premolded package molded using the composition. The heat-curable resin composition comprises components (A) to (E) listed below: (A) an isocyanuric acid derivative containing at least one epoxy group within each molecule, in an amount of 100 parts by mass, (B) a silicone resin containing at least one epoxy group within each molecule, in an amount of 10 to 1,000 parts by mass, (C) an acid anhydride curing agent, in an amount such that the ratio of [total epoxy group equivalents within component (A) and component (B)/carboxyl group equivalents within component (C)] is within a range from 0.6 to 2.2, (D) a curing accelerator, in an amount within a range from 0.05 to 5 parts by mass per 100 parts by mass of the combined mass of components (A), (B) and (C), and (E) an inorganic filler, in an amount of 200 to 1,000 parts by mass per 100 parts by mass of the combined mass of components (A), (B) and (C).

摘要翻译： 产生具有优异的耐热性和耐光性的固化产物的热固化树脂组合物和使用该组合物成型的预成型包装。 热固性树脂组合物包含下列成分（A）〜（E）：（A）在各分子内含有至少一个环氧基的异氰脲酸衍生物，其量为100质量份，（B）有机硅树脂 在各分子内含有至少一个环氧基，其量为10〜1000质量份，（C）酸酐固化剂，其量使得[组分（A）和组分 （C）成分中的（B）/羧基当量]在0.6〜2.2的范围内，（D）固化促进剂的含量为0.05〜5质量份，相对于100质量份 组分（A），（B）和（C）的质量和（E）无机填料的量为每100质量份组分（A），（B ）和（C）。

公开(公告)号：US08034893B2

公开(公告)日：2011-10-11

申请号：US11475043

申请日：2006-06-27

申请人： Hideki Akiba ,  Toshio Shiobara

发明人： Hideki Akiba ,  Toshio Shiobara

IPC分类号： C08G69/26

CPC分类号： H01L23/296 ,  C08L79/08 ,  C08L2205/02 ,  C09D179/08 ,  H01L2924/0002 ,  C08L2666/20 ,  H01L2924/00

摘要： A resin solution composition comprising (A) a polyamic acid resin, (B) an alkoxysilyl-containing polyamic acid resin, and (C) an organic solvent cures into a product that has good substrate adhesion and heat resistance and is effective in forming a protective film on a semiconductor device prior to encapsulation with epoxy resin molding material (molding compound) in that it overcomes the chip cracking and thermal deterioration problems of semiconductor packages by thermal stress.

摘要翻译： 包含（A）聚酰胺酸树脂，（B）含烷氧基甲硅烷基的聚酰胺酸树脂和（C）有机溶剂的树脂溶液组合物固化成具有良好的基材粘合性和耐热性的产品，并且有效地形成保护 在用环氧树脂成型材料（模塑料）封装之前，半导体器件上的薄膜通过热应力克服了半导体封装的芯片裂纹和热劣化问题。

公开(公告)号：US08017246B2

公开(公告)日：2011-09-13

申请号：US11937425

申请日：2007-11-08

申请人： Yasumasa Morita ,  Nicolaas Joseph Martin van Leth ,  Cheun Jye Yow ,  Wai Choo Chai ,  Kinya Kodama ,  Tsutomu Kashiwagi ,  Toshio Shiobara

发明人： Yasumasa Morita ,  Nicolaas Joseph Martin van Leth ,  Cheun Jye Yow ,  Wai Choo Chai ,  Kinya Kodama ,  Tsutomu Kashiwagi ,  Toshio Shiobara

IPC分类号： B32B9/04 ,  C08G77/12 ,  C08G77/04 ,  B05D5/06

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C09D183/04 ,  H01L33/56 ,  Y10T428/31663 ,  C08L83/00

摘要： A silicone resin composition and process for coating a light transmitting surface of an optoelectronic device is disclosed. The process involves applying a silicone resin to the light transmitting surface, and causing the silicone resin to cure to form a light transmitting protective coating on the light transmitting surface, the silicone resin having a sufficiently low proportion of organosiloxanes having molecular weights of up to about 1000, such that the protective coating includes less than about 10% of the organosiloxanes having molecular weights of up to about 1000.

摘要翻译： 公开了一种有机硅树脂组合物和用于涂覆光电子器件的透光表面的方法。 该方法包括将硅树脂施加到透光表面上，并使硅树脂固化以在透光表面上形成透光保护涂层，硅树脂具有足够低比例的分子量高达约 1000，使得保护性涂层包含小于约10％的分子量高达约1000的有机硅氧烷。

公开(公告)号：US07943706B2

公开(公告)日：2011-05-17

申请号：US11386667

申请日：2006-03-23

申请人： Yasuo Kimura ,  Eiichi Asano ,  Toshio Shiobara ,  Takayuki Aoki

发明人： Yasuo Kimura ,  Eiichi Asano ,  Toshio Shiobara ,  Takayuki Aoki

IPC分类号： C08F283/00 ,  B32B27/38 ,  C08G59/50

CPC分类号： H01L23/293 ,  C08G59/245 ,  C08G59/3218 ,  C08G59/621 ,  C08L63/00 ,  H01L2924/0002 ,  Y10T428/31511 ,  C08L2666/16 ,  H01L2924/00

摘要： An epoxy resin composition comprising(A) at least one epoxy resin comprising (a) a naphthalene ring-containing epoxy resin having at least one substituted or unsubstituted naphthalene ring in a molecule and having an epoxy equivalent of 175 to 210,(B) a phenolic resin having at least one substituted or unsubstituted naphthalene ring in a molecule, and(C) an inorganic filler,the substituted or unsubstituted naphthalene ring of the epoxy resin (a) being contained in an amount of 45 to 60% by weight in the total amount of the epoxy resin (A) is best suited for semiconductor encapsulation because it has good flow, a low coefficient of linear expansion, a high Tg, minimal moisture absorption, and crack resistance upon lead-free soldering.

摘要翻译： 一种环氧树脂组合物，其包含（A）至少一种环氧树脂，其包含（a）在分子中具有至少一个取代或未取代的萘环并且具有175至210的环氧当量的含萘环的环氧树脂，（B） 在分子中具有至少一个取代或未取代的萘环的酚醛树脂和（C）无机填料，所述环氧树脂（a）中的取代或未取代的萘环的含量为45〜60重量％ 环氧树脂（A）的总量最适合于半导体封装，因为它具有良好的流动性，低的线性膨胀系数，高的Tg，最小的吸湿性和无铅焊接时的抗裂纹性。

公开(公告)号：US07829651B2

公开(公告)日：2010-11-09

申请号：US11437662

申请日：2006-05-22

申请人： Toshio Shiobara ,  Tsutomi Kashiwagi ,  Katsuyuki Imazawa

发明人： Toshio Shiobara ,  Tsutomi Kashiwagi ,  Katsuyuki Imazawa

IPC分类号： C08G77/00 ,  C08G77/04

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08L83/00

摘要： Silicone resin compositions comprising (A) an organopolysiloxane containing at least two aliphatic unsaturated bonds, (B) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, (C) a platinum group metal base catalyst, and (D) a mold release agent cure into colorless, transparent, heat resistant parts which can be smoothly released from the mold and used as lenses in LED devices.

摘要翻译： 硅氧烷树脂组合物，其包含（A）含有至少两个脂族不饱和键的有机聚硅氧烷，（B）分子中具有至少两个与硅键合的氢原子的有机氢聚硅氧烷，（C）铂族金属碱催化剂和（D） 脱模剂固化成无色，透明，耐热的部件，可以从模具中顺利释放并用作LED器件中的透镜。

公开(公告)号：US20100125116A1

公开(公告)日：2010-05-20

申请号：US12617919

申请日：2009-11-13

申请人： Toshio Shiobara ,  Tsutomu Kashiwagi ,  Yusuke Taguchi

发明人： Toshio Shiobara ,  Tsutomu Kashiwagi ,  Yusuke Taguchi

IPC分类号： C08L83/00 ,  C08K3/22 ,  C08K3/36 ,  C08K3/18 ,  C08K3/30

CPC分类号： C08G59/306 ,  C08G59/3245 ,  C08G59/42

摘要： A heat-curable resin composition that yields a cured product having excellent heat resistance and light resistance, and a premolded package molded using the composition. The heat-curable resin composition comprises components (A) to (E) listed below: (A) an isocyanuric acid derivative containing at least one epoxy group within each molecule, in an amount of 100 parts by mass, (B) a silicone resin containing at least one epoxy group within each molecule, in an amount of 10 to 1,000 parts by mass, (C) an acid anhydride curing agent, in an amount such that the ratio of [total epoxy group equivalents within component (A) and component (B)/carboxyl group equivalents within component (C)] is within a range from 0.6 to 2.2, (D) a curing accelerator, in an amount within a range from 0.05 to 5 parts by mass per 100 parts by mass of the combined mass of components (A), (B) and (C), and (E) an inorganic filler, in an amount of 200 to 1,000 parts by mass per 100 parts by mass of the combined mass of components (A), (B) and (C).

摘要翻译： 产生具有优异的耐热性和耐光性的固化产物的热固化树脂组合物和使用该组合物成型的预成型包装。 热固性树脂组合物包含下列成分（A）〜（E）：（A）在各分子内含有至少一个环氧基的异氰脲酸衍生物，其量为100质量份，（B）有机硅树脂 在各分子内含有至少一个环氧基，其量为10〜1000质量份，（C）酸酐固化剂，其量使得[组分（A）和组分 （C）成分中的（B）/羧基当量]在0.6〜2.2的范围内，（D）固化促进剂的含量为0.05〜5质量份，相对于100质量份 组分（A），（B）和（C）的质量和（E）无机填料的量为每100质量份组分（A），（B ）和（C）。

公开(公告)号：US07714080B2

公开(公告)日：2010-05-11

申请号：US11357988

申请日：2006-02-22

申请人： Hideki Akiba ,  Toshio Shiobara

发明人： Hideki Akiba ,  Toshio Shiobara

IPC分类号： C08L63/00 ,  H01L21/00 ,  C08G77/04

CPC分类号： C08G77/455 ,  C09D183/10 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1301 ,  H01L2924/13034 ,  C08L2666/14 ,  H01L2924/00014 ,  H01L2924/00

摘要： A primer composition comprising an alkoxysilyl-containing polyamide-imide resin, an epoxy resin, a curing promoter, and an organic solvent forms a cured coating having heat resistance and water resistance through brief low-temperature heating and helps bonding of epoxy resin molding compound to semiconductor members.

摘要翻译： 包含含烷氧基甲硅烷基的聚酰胺酰亚胺树脂，环氧树脂，固化促进剂和有机溶剂的底漆组合物通过短暂的低温加热形成具有耐热性和耐水性的固化涂层，并且有助于将环氧树脂模塑料粘合到 半导体元件。

公开(公告)号：US20100029887A1

公开(公告)日：2010-02-04

申请号：US12510491

申请日：2009-07-28

申请人： Yoshihira Hamamoto ,  Toshio Shiobara ,  Miyuki Wakao ,  Tsutomu Kashiwagi

发明人： Yoshihira Hamamoto ,  Toshio Shiobara ,  Miyuki Wakao ,  Tsutomu Kashiwagi

IPC分类号： C09D183/04 ,  C08G77/04

CPC分类号： C08G59/306 ,  C08G59/3254 ,  C08L83/06

摘要： A resin composition for encapsulating an optical semiconductor element that comprises components (A), (B) and (C) described below: (A) a branched silicone resin containing 2 to 6 epoxy groups, one or more (R1SiO3/2) units, two or more (R2R3SiO)n structures and 3 or more (R43-xR5xSiO1/2) units per molecule, in an amount of 100 parts by weight, wherein R1, R2, R3, R4 and R5 each represents a hydrogen atom, a hydroxyl group or a monovalent organic group of 1 to 20 carbon atoms which monovalent organic group may or may not contain an oxygen atom, provided that at least two of the R5 groups within each molecule represent an epoxy group and/or an epoxy group-containing non-aromatic group, n represents an integer of 3 to 20, and x represents an integer of 1 to 3, (B) a curing agent, in such an amount that a content of epoxy reactive groups in the component (B) ranges from 0.4 to 1.5 moles per 1 mol of epoxy groups within component (A), and (C) a curing catalyst, in an amount within a range from 0.01 to 3 parts by weight per 100 parts by weight of a combination of component (A) and component (B).

摘要翻译： 一种包含下述成分（A），（B）和（C）的光半导体元件的树脂组合物：（A）含有2〜6个环氧基的支链硅氧烷树脂，1个以上（R 1 SiO 3/2） 两个或多个（R 2 R 3 SiO）n结构和每个分子3个以上（R 43-x R 5 x SiO 1/2）单元，其量为100重量份，其中R 1，R 2，R 3，R 4和R 5各自表示氢原子，羟基 基团或1〜20个碳原子的一价有机基团，该一价有机基团可以含有或不含有氧原子，条件是每个分子中的至少两个R 5基团表示环氧基和/或含环氧基的非 - - 芳族基团，n表示3〜20的整数，x表示1〜3的整数，（B）固化剂，其量为组分（B）中环氧基反应性基团的含量为0.4 至组分（A）中每1mol环氧基团为1.5摩尔，和（C）固化催化剂，其量范围为fr 每100重量份组分（A）和组分（B）的组合0.01-1重量份。

公开(公告)号：US20090123764A1

公开(公告)日：2009-05-14

申请号：US11937425

申请日：2007-11-08

申请人： Yasumasa Morita ,  Nicolaas Joseph Martin van Leth ,  Cheun Jye Yow ,  Wai Choo Chai ,  Kinya Kodama ,  Tsutomu Kashiwagi ,  Toshio Shiobara

发明人： Yasumasa Morita ,  Nicolaas Joseph Martin van Leth ,  Cheun Jye Yow ,  Wai Choo Chai ,  Kinya Kodama ,  Tsutomu Kashiwagi ,  Toshio Shiobara

IPC分类号： B05D5/06 ,  B32B9/04 ,  C08F220/00

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C09D183/04 ,  H01L33/56 ,  Y10T428/31663 ,  C08L83/00

摘要： A silicone resin composition and process for coating a light transmitting surface of an optoelectronic device is disclosed. The process involves applying a silicone resin to the light transmitting surface, and causing the silicone resin to cure to form a light transmitting protective coating on the light transmitting surface, the silicone resin having a sufficiently low proportion of organosiloxanes having molecular weights of up to about 1000, such that the protective coating includes less than about 10% of the organosiloxanes having molecular weights of up to about 1000.

摘要翻译： 公开了一种有机硅树脂组合物和用于涂覆光电子器件的透光表面的方法。 该方法包括将硅树脂施加到透光表面上，并使硅树脂固化以在透光表面上形成透光保护涂层，硅树脂具有足够低比例的分子量高达约 1000，使得保护性涂层包含小于约10％的分子量高达约1000的有机硅氧烷。

公开(公告)号：US07521813B2

公开(公告)日：2009-04-21

申请号：US10885670

申请日：2004-07-08

申请人： Tsutomu Kashiwagi ,  Toshio Shiobara

发明人： Tsutomu Kashiwagi ,  Toshio Shiobara

IPC分类号： H01L23/29 ,  C08F283/00

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  H01L33/56 ,  H01L2224/32257 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/12044 ,  C08L83/00 ,  H01L2924/00014 ,  H01L2924/00

摘要： A silicone rubber composition comprising (A) an organopolysiloxane containing at least two aliphatic unsaturated bonds, (B) an organopolysiloxane of resin structure comprising SiO2 units, R3nR4pSiO0.5 units and R3qR4rSiO0.5 units wherein R3 is vinyl or allyl, R4 is a monovalent hydrocarbon group free of aliphatic unsaturation, n is 2 or 3, p is 0 or 1, n+p=3, q is 0 or 1, r is 2 or 3, q+r=3, (C) an organohydrogenpolysiloxane having at least two SiH groups, and (D) a platinum catalyst cures into a silicone rubber having excellent rubbery and strength properties and little surface tack.

摘要翻译： 一种硅橡胶组合物，其包含（A）含有至少两个脂族不饱和键的有机聚硅氧烷，（B）包含SiO 2单元的树脂结构的有机聚硅氧烷，R3nR4pSiO0.5单元和R3qR4rSiO0.5单元，其中R3是乙烯基或烯丙基，R4是一价 不含脂肪族不饱和键的烃基，n为2或3，p为0或1，n + p = 3，q为0或1，r为2或3，q + r = 3，（C）有机氢聚硅氧烷， 至少两个SiH基团，和（D）铂催化剂固化成具有优异的橡胶强度和强度性能以及很小的表面粘性的硅橡胶。