Abstract:
Disclosed herein is a capacitor for a magnetron. The capacitor has dielectric members, which have a converging angle of less than 180° defined between lines extending from both sides of each dielectric member formed between corresponding ends of inner and outer electrodes of the dielectric member. The capacitor is reduced in size while having enhanced capacitance, thereby reducing a manufacturing time. The capacitor also has central conductors having enlarged portions larger than the inner electrode, thereby further enhancing the capacitance.
Abstract:
Disclosed herein is a dispersant for dispersing carbon nanotubes which comprises a head having a high affinity for carbon nanotubes and a tail having a high affinity for a dispersion medium. The head includes an aromatic hydrocarbon group with a high affinity for carbon nanotubes to prevent aggregation of the carbon nanotubes, thereby improving the dispersibility of the carbon nanotubes. Further disclosed is a carbon nanotube composition comprising the dispersant.
Abstract:
A method for forming an isolation trench in a semiconductor device includes the steps of: forming a pad oxide layer over a semiconductor substrate; forming a pad nitride layer over the pad oxide layer; forming a photoresist pattern defining an isolation area on the pad nitride layer; forming a trench in the substrate by etching the pad nitride layer, the pad oxide layer, and the substrate, using the photoresist pattern as a mask; filling the trench with a dielectric material; and oxidizing a portion of the substrate in the vicinity of top corners of the trench.
Abstract:
A method of reducing hot carrier degradation and a semiconductor structure so formed are disclosed. One embodiment of the method includes depositing a silicon nitride layer over a transistor device, ion implanting a species into the silicon nitride layer to drive hydrogen from the silicon nitride layer, and annealing to diffuse the hydrogen into a channel region of the transistor device. The species may be chosen from, for example: germanium (Ge), arsenic (As), xenon (Xe), nitrogen (N), oxygen (O), carbon (C), boron (B), indium (In), argon (Ar), helium (He), and deuterium (De). The ion implantation modulates atoms in the silicon nitride layer such as hydrogen, nitrogen and hydrogen-nitrogen bonds such that hydrogen can be controllably diffused into the channel region.
Abstract:
A manufacturing method of a double LDD MOS transistor includes forming a gate electrode on a semiconductor substrate; forming a first LDD area by implanting and thermally annealing impurity ions using the gate electrode as a mask; forming a first spacer on both lateral walls of the gate electrode; forming a second LDD area by implanting and thermally annealing impurity ions using the gate electrode and the first spacer as a mask; forming a second spacer on both lateral walls of the gate electrode and the first spacer; and forming a source-drain diffusion area by implanting and thermally annealing impurity ions using the gate electrode, the first spacer, and the second spacer as a mask.
Abstract:
A semiconductor device structure is provided which includes a first semiconductor device; a second semiconductor device; and a unitary stressed film disposed over both the first and second semiconductor devices. The stressed film has a first portion overlying the first semiconductor device, the first portion imparting a first magnitude compressive stress to a conduction channel of the first semiconductor device, the stressed film further having a second portion overlying the second semiconductor device, the second portion not imparting the first magnitude compressive stress to a conduction channel of the second semiconductor device, the second portion including an ion concentration not present in the second portion such that the second portion imparts one of a compressive stress having a magnitude much lower than the first magnitude, zero stress, and a tensile stress to the conduction channel of the second semiconductor device.
Abstract:
A vehicle-trailer back-up control system that employs an active front steer sub-system. The system includes a smart hitch controller that receives a vehicle speed signal and a hand-wheel angle signal, and calculates a hitch angle command signal. The system further includes a hitch angle sensor that measures the hitch angle between the vehicle and the trailer that is compared to the hitch angle command signal to generate a hitch angle error signal. A PID control unit receives the hitch angle error signal, and generates a corrected road wheel angle signal based on proportional and derivative gains. The corrected road wheel angle signal is used to generate a motor angle signal that is applied to a steering actuator to be combined with the steering angle signal to generate the front wheel steering signal during a back-up maneuver.
Abstract:
A complex type cleaner includes: a body provided with a dust collecting container for storing dust; a fan motor installed at the body and generating a suction force; a vacuum cleaning head disposed at a lower side of the body, for sucking dust at the time of performing vacuum cleaning; and a water cleaning head mounted at the vacuum cleaning head, and provided with a suction head through which contaminated water is sucked at the time of performing water cleaning and a water collecting container for storing contaminated water sucked through the suction head. As a suction nozzle for sucking contaminated water and a water collecting container for storing the contaminated water sucked through the suction nozzle are integrally formed and installed at a suction head, there is provided a complex type capable of reducing the number of parts and a production cost, and employing a small capacity fan motor.
Abstract:
The present invention relates to a plasma display apparatus, and more particularly, to a plasma display apparatus having an electrode pad. The plasma display apparatus includes a plasma display panel having electrodes, an electrode driving unit for driving the plasma display panel, and an electrode pad for connecting the electrode driving unit and the plasma display panel. The electrode pad includes a first electrode part including a first electrode connection part connected to the electrodes of the plasma display panel and having a first line width, a first intermediate connection part connected at one end to the first electrode connection part and having a second line width smaller than the first line width, and a first connector connection part connected at one end to the other end of the first intermediate connection part and having a third line width greater than the second line width, and a second electrode part, and a second electrode part including a second electrode connection part connected to the electrodes of the plasma display panel and having a fourth line width, a second intermediate connection part connected at one end to the second electrode connection part and having a fifth line width, which is smaller than or the same as the fourth line width, and a second connector connection part connected at one end to the other end of the second intermediate connection part and having a sixth line width greater than the fifth line width. The first electrode part is disposed adjacent to the second electrode part, and the length of the first intermediate connection part and the length of the second intermediate connection part are different from each other. According to the present invention, the line width of the intermediate connection part is made narrow and the width of the connector connection part is made wide. An align tolerance can be secured.
Abstract:
A CMOS image sensor with improved sensitivity includes a main pixel array region of an active pixel array region formed on a semiconductor substrate. A passivation layer is formed over the sensor, and it is at least partially removed from the main pixel array region, such that incident light being detected by the main pixel array does not pass through the passivation layer. Optical absorption and refraction caused by the material of the passivation layer are eliminated, resulting in an image sensor with improved optical sensitivity.