公开(公告)号：US08051339B2

公开(公告)日：2011-11-01

申请号：US12015484

申请日：2008-01-16

Applicant: Ming-Hsun Sung ,  Yu-Lin Hsieh

Inventor： Ming-Hsun Sung ,  Yu-Lin Hsieh

IPC: G11C29/00

CPC classification number: G06F11/1068 ,  G11C2029/0411

Abstract: A data preserving method and a data accessing method for a non-volatile memory are provided. In the data preserving method, a data is checked according to an error correcting code (ECC) to obtain an error bit number of the data. When the error bit number is greater than a threshold, the data is moved from a first memory unit to a second memory unit and is corrected according to the ECC. Thereby, the data stability of the non-volatile memory is improved.

Abstract translation: 提供了一种用于非易失性存储器的数据保存方法和数据访问方法。 在数据保存方法中，根据纠错码（ECC）检查数据，以获得数据的错误位数。 当错误位数大于阈值时，数据从第一存储器单元移动到第二存储器单元，并根据ECC进行校正。 从而提高了非易失性存储器的数据稳定性。

公开(公告)号：US20110246231A1

公开(公告)日：2011-10-06

申请号：US12751984

申请日：2010-03-31

Applicant: Yu Lin Sie ,  VenkataChari SampathKumar ,  Jason R. W. Ramsay ,  Jeffrey Winter ,  Margaret Elisabeth Rottsolk ,  Shawna D. Cooper ,  Keith Daniels ,  Katherine W. Osborne ,  Pranavakumar Punniamoorthy ,  Matthew Bordenet ,  Suzanne Tocco ,  Muzammil Ahmed

Inventor： Yu Lin Sie ,  VenkataChari SampathKumar ,  Jason R. W. Ramsay ,  Jeffrey Winter ,  Margaret Elisabeth Rottsolk ,  Shawna D. Cooper ,  Keith Daniels ,  Katherine W. Osborne ,  Pranavakumar Punniamoorthy ,  Matthew Bordenet ,  Suzanne Tocco ,  Muzammil Ahmed

IPC: G06Q50/00 ,  G06Q10/00 ,  G06F17/30 ,  G06F3/048

CPC classification number: G06Q50/22 ,  G06Q10/10 ,  G06Q50/24 ,  G16H10/60

Abstract: A connection component generates a user interface for display to a patient computing device. The user interface provides the patient computing device with access to hospital visit records of the patient maintained in a hospital database. The user interface may further receive selection of a care provider by the patient for granting the care provider electronic access to the patient's hospital visit records.

Abstract translation: 连接组件产生用于向患者计算设备显示的用户界面。 用户界面为患者计算设备提供对医院数据库中维护的患者的医院访问记录的访问。 用户界面可以进一步接收患者对护理提供者的选择，以便给予护理提供者电子访问病人的医院访问记录。

公开(公告)号：US20110239128A1

公开(公告)日：2011-09-29

申请号：US13069659

申请日：2011-03-23

Applicant: YU-LIN WANG ,  WEI-HUNG CHEN

Inventor： YU-LIN WANG ,  WEI-HUNG CHEN

IPC: G06F3/00

CPC classification number: H04L67/06 ,  G06K9/228 ,  H04L67/04 ,  H04L67/34

Abstract: The present invention relates to a data transmission method and system. The system includes a connection module for setting up a transmission path between a computer end and a device end, a display unit, a capture unit disposed at the device end for capturing an image of the screen including an icon, and a computing unit for recognizing the image to determine that the icon corresponding to an object is shown on the image. The method includes the steps of: displaying a screen including an icon at the computer end; capturing an image including an icon of the screen; recognizing the image to determine that the icon corresponding to an object is shown on the image; and transmitting the object from the computer end to the device end through the transmission path. The present invention does not require complicated operation at the computer end and improves convenience for the application.

Abstract translation: 数据传输方法和系统技术领域本发明涉及一种数据传输方法和系统。 该系统包括用于设置计算机端和设备端之间的传输路径的连接模块，显示单元，设置在设备端的捕获单元，用于捕获包括图标的屏幕的图像;以及计算单元，用于识别 该图像确定在图像上显示与对象相对应的图标。 该方法包括以下步骤：在计算机端显示包括图标的屏幕; 拍摄包括屏幕图标的图像; 识别图像以确定在图像上显示对应于对象的图标; 并且通过传输路径将对象从计算机端传送到设备端。 本发明不需要在计算机端进行复杂的操作，并且提高了应用的便利性。

公开(公告)号：US20110235444A1

公开(公告)日：2011-09-29

申请号：US13070977

申请日：2011-03-24

Applicant: Ching-Te Chuang ,  Wei-Chiang Shih ,  Hung-Yu Lee ,  Jihi-Yu Lin ,  Ming-Hsien Tu ,  Shyh-Jye Jou ,  Kun-Di Lee

Inventor： Ching-Te Chuang ,  Wei-Chiang Shih ,  Hung-Yu Lee ,  Jihi-Yu Lin ,  Ming-Hsien Tu ,  Shyh-Jye Jou ,  Kun-Di Lee

IPC: G11C7/00

CPC classification number: G11C11/413

Abstract: SRAM writing system and related apparatus are provided. The writing system of the invention has a dummy replica writing circuit, a negative pulse controller and at least a normal writing circuit; each normal writing circuit includes a write driver and a negative pulse supplier. While writing, the dummy replica writing circuit drives a dummy replica bit-line, such that the negative pulse controller generates a negative pulse control signal according to level of the dummy replica bit-line. In each writing circuit, when the write driver conducts to connect an associated bit-line to a bias end for driving a level transition, the negative pulse supplier switches the bias end from an operation voltage to a different negative pulse voltage according to the received negative pulse control signal.

Abstract translation: 提供SRAM写入系统及相关装置。 本发明的写入系统具有虚拟副本写入电路，负脉冲控制器和至少一个正常写入电路; 每个正常写入电路包括写入驱动器和负脉冲供应器。 在写入时，虚拟副本写入电路驱动虚拟副本位线，使得负脉冲控制器根据虚拟副本位线的电平产生负脉冲控制信号。 在每个写入电路中，当写入驱动器将相关联的位线连接到用于驱动电平转换的偏置端时，负脉冲供应器根据接收到的负值将偏置端从工作电压切换到不同的负脉冲电压 脉冲控制信号。

公开(公告)号：US20110212439A1

公开(公告)日：2011-09-01

申请号：US13100665

申请日：2011-05-04

Applicant: YUAN-TSONG CHEN ,  SHUEN-IU HUNG ,  CHIH-LUNG SHEN ,  CHI-FENG CHANG ,  HSIN-YU LIN ,  WEI-HSUAN CHEN

Inventor： YUAN-TSONG CHEN ,  SHUEN-IU HUNG ,  CHIH-LUNG SHEN ,  CHI-FENG CHANG ,  HSIN-YU LIN ,  WEI-HSUAN CHEN

IPC: C12Q1/68 ,  G01N33/50

CPC classification number: C12Q1/6881 ,  C12Q1/6883 ,  C12Q2600/136 ,  C12Q2600/142 ,  C12Q2600/156 ,  C12Q2600/16 ,  C12Q2600/172 ,  Y10T436/143333

Abstract: This invention relates to a method of determining the presence of certain HLA alleles, such as HLA-B*1502 or HLA-B*5801, and a kit for carrying out this method. Also disclosed is a method for assessing whether a patient is at risk for developing adverse drug reactions (e.g., Stevens-Johnson syndrome, toxic epidermal necrolysis, or hypersensitivity syndrome) based on the presence or absence of a genetic marker (e.g., HLA-B*1502, HLA-B*5801, or HLA-B*4601).

Abstract translation: 本发明涉及确定某些HLA等位基因如HLA-B * 1502或HLA-B * 5801的存在的方法和用于实施该方法的试剂盒。 还公开了一种基于遗传标记（例如HLA-B）的存在或不存在来评估患者是否处于发展不良药物反应（例如，史蒂文斯 - 约翰逊综合征，中毒性表皮坏死松解症或超敏反应综合征）的风险中的方法 * 1502，HLA-B * 5801或HLA-B * 4601）。

公开(公告)号：US08004079B2

公开(公告)日：2011-08-23

申请号：US12464873

申请日：2009-05-13

Applicant: Ra-Min Tain ,  Yu-Lin Chao ,  Shu-Jung Yang ,  Rong-Chang Fang ,  Wei Li ,  Chih-Yuan Cheng ,  Ming-Che Hsieh

Inventor： Ra-Min Tain ,  Yu-Lin Chao ,  Shu-Jung Yang ,  Rong-Chang Fang ,  Wei Li ,  Chih-Yuan Cheng ,  Ming-Che Hsieh

IPC: H01L23/10 ,  H01L23/34

CPC classification number: H01L25/105 ,  H01L23/3128 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A chip package structure includes a substrate, a chip, a thermal conductive layer, a plurality of signal contacts, and a molding compound. The substrate includes a plurality of first thermal conductive vias, a connecting circuit, and a plurality of signal vias electrically connected to the connecting circuit, and the substrate has a chip disposing region. The chip is disposed on the chip disposing region of the substrate and electrically connected to the signal vias through the connecting circuit. The thermal conductive layer is disposed over the substrate, connected to the first thermal conductive vias, and located above the chip disposing region. Besides, the thermal conductive layer has first openings exposing the signal vias. The signal contacts are respectively disposed in the first openings and connected to the signal vias. The molding compound encapsulates the chip.

Abstract translation: 芯片封装结构包括衬底，芯片，导热层，多个信号触点和模塑料。 衬底包括多个第一导热通孔，连接电路和电连接到连接电路的多个信号通孔，并且衬底具有芯片布置区域。 芯片设置在基板的芯片布置区域上，并通过连接电路与信号通孔电连接。 导热层设置在衬底上，连接到第一导热通孔，并且位于芯片布置区域的上方。 此外，导热层具有暴露信号通孔的第一开口。 信号触点分别设置在第一开口中并连接到信号通路。 模塑料封装芯片。

公开(公告)号：US20110188458A1

公开(公告)日：2011-08-04

申请号：US12698901

申请日：2010-02-02

Applicant: Johnson Sebeni ,  Yu-Lin Wang ,  Jianxiong Shi

Inventor： Johnson Sebeni ,  Yu-Lin Wang ,  Jianxiong Shi

IPC: H04W72/04

CPC classification number: H04W52/343 ,  H04L1/0002 ,  H04L1/0003 ,  H04L1/0015 ,  H04W24/02 ,  H04W24/08 ,  H04W52/241 ,  H04W52/245 ,  H04W52/325

Abstract: Methods and apparatus for correcting quantization errors in signal reception based on estimated network loading including solutions for preserving cellular network performance in low noise, high interference environments. In one embodiment, a data channel is amplified with respect to other signals based on network load during periods of relatively low network utilization. Dynamic modification of the data channel's power level is configured to overcome quantization errors, rather than the true noise floor (which is insignificant in low noise environments). Such solutions provide both the fidelity necessary to enable high degrees of unwanted signaling rejection, while still preserving data channel quality.

Abstract translation: 基于估计的网络负载来校正信号接收中的量化误差的方法和装置，包括用于在低噪声，高干扰环境中保持蜂窝网络性能的解决方案。 在一个实施例中，在相对低的网络利用期间，基于网络负载，数据信道相对于其他信号被放大。 配置数据通道功率电平的动态修改，以克服量化误差，而不是真实的噪声基底（这在低噪声环境中是无关紧要的）。 这样的解决方案提供了在保持数据信道质量的同时能够实现高度不需要的信令拒绝所必需的保真度。

公开(公告)号：US20110182455A1

公开(公告)日：2011-07-28

申请号：US13009234

申请日：2011-01-19

Applicant: Timothy K. Wickstrom ,  William J. Ballad ,  Mei-Yu Lin ,  Ying-Tzu Chan ,  Jen Nan Feng

Inventor： Timothy K. Wickstrom ,  William J. Ballad ,  Mei-Yu Lin ,  Ying-Tzu Chan ,  Jen Nan Feng

IPC: H04R1/20

CPC classification number: H04R1/10 ,  H04R1/1091

Abstract: An acoustic system includes a receiver or microphone, a tube, a barrier, and an equalization device. The receiver is capable of outputting an audio signal. The tube is in connection with the receiver and the audio signal travels along a length of the tube. The barrier is fitted along the tube and the barrier prevents moisture from passing along the tube toward the receiver. The barrier causes an amount of damping to the audio signal. The equalization device is in connection with the receiver and the equalization device counteracts the damping by the barrier. The barrier is configured to have a submersion rating greater than or equal to 7 IP.

Abstract translation: 声学系统包括接收器或麦克风，管，屏障和均衡装置。 接收机能够输出音频信号。 管与接收器连接，音频信号沿着管的长度行进。 屏障沿管安装，屏障防止水分沿着管向接收器传播。 障碍物对音频信号造成一定数量的阻尼。 均衡装置与接收器连接，均衡装置抵消屏障的阻尼。 屏障被配置为具有大于或等于7 IP的浸没等级。

公开(公告)号：US20110158417A1

公开(公告)日：2011-06-30

申请号：US12939185

申请日：2010-11-04

Applicant: KAI-YU LIN

Inventor： KAI-YU LIN

IPC: G08B21/00 ,  H04R29/00

CPC classification number: G01S7/52001 ,  G01S3/8006

Abstract: A communication device with an audio database comprises an audio receiving module, a locator module, an audio identification module and a notification module. The audio receiving module calculates the strength of the at least one signal, the locator module determines whether each of the strength exceeds a predefined value and determines the directionality of the at least one audio signal in accordance with the strength of the at least one audio signal. The audio identification module compares the audio signal with audio modules in accordance with characteristics parameter to issue a warning.

Abstract translation: 具有音频数据库的通信设备包括音频接收模块，定位器模块，音频识别模块和通知模块。 音频接收模块计算至少一个信号的强度，定位器模块确定每个强度是否超过预定值，并且根据至少一个音频信号的强度来确定至少一个音频信号的方向性 。 音频识别模块根据特性参数将音频信号与音频模块进行比较，以发出警告。

公开(公告)号：US20110156082A1

公开(公告)日：2011-06-30

申请号：US12842018

申请日：2010-07-22

Applicant: TAI-CHERNG YU ,  CHUN-YU LIN

Inventor： TAI-CHERNG YU ,  CHUN-YU LIN

IPC: H01L33/64 ,  H01L33/52

CPC classification number: H01L33/641 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: An exemplary LED module includes a ceramic substrate, a heat spreader, a heat sink, an LED die, and a packaging layer. The substrate defines a hole extending therethrough from a top side to a bottom side thereof. The heat spreader is disposed in the hole with a top side thereof substantially coplanar with the top side of the substrate. An outer circumferential surface of the heat spreader contacts an inner circumferential surface of the substrate around the hole. The heat sink is attached to the top sides of the substrate and the heat spreader. The LED die is attached to a bottom side of the heat spreader, and the packaging layer encapsulates the LED die.

Abstract translation: 示例性LED模块包括陶瓷基板，散热器，散热器，LED管芯和封装层。 衬底限定从其顶侧到底侧延伸穿过的孔。 散热器设置在孔中，其顶侧与基板的顶侧基本上共面。 散热器的外周面与孔周围的基板的内周面接触。 散热器连接到基板和散热器的顶侧。 LED芯片附接到散热器的底侧，并且封装层封装LED管芯。