公开(公告)号：US20120249176A1

公开(公告)日：2012-10-04

申请号：US13169051

申请日：2011-06-27

Applicant: Heng-Chieh Chien ,  Ra-Min Tain ,  John H. Lau ,  Yu-Lin Chao ,  Ming-Ji Dai

Inventor： Heng-Chieh Chien ,  Ra-Min Tain ,  John H. Lau ,  Yu-Lin Chao ,  Ming-Ji Dai

IPC: G01R31/00

CPC classification number: G01N25/18

Abstract: A test structure including a substrate, at least one conductive plug, a first conductive trace and a second conductive trace is provided. The substrate has a first area and a second area. The at lest one conductive plug is disposed in the substrate in the first area, wherein the conductive plug does not penetrate through the substrate.The first conductive trace is disposed on the conductive plug and on the substrate in the first area. The second conductive trace is disposed on the substrate in the second area. It is noted that the first conductive trace and the second conductive trace have the same material and the same shape. A measurement method of the above-mentioned test structure is also provided.

Abstract translation: 提供了包括基板，至少一个导电插塞，第一导电迹线和第二导电迹线的测试结构。 衬底具有第一区域和第二区域。 至少一个导电插头设置在第一区域中的基板中，其中导电插塞不穿透基板。 第一导电迹线设置在第一区域中的导电插塞和基板上。 第二导电迹线设置在第二区域中的基板上。 注意，第一导电迹线和第二导电迹线具有相同的材料和相同的形状。 还提供了上述测试结构的测量方法。

公开(公告)号：US08004079B2

公开(公告)日：2011-08-23

申请号：US12464873

申请日：2009-05-13

Applicant: Ra-Min Tain ,  Yu-Lin Chao ,  Shu-Jung Yang ,  Rong-Chang Fang ,  Wei Li ,  Chih-Yuan Cheng ,  Ming-Che Hsieh

Inventor： Ra-Min Tain ,  Yu-Lin Chao ,  Shu-Jung Yang ,  Rong-Chang Fang ,  Wei Li ,  Chih-Yuan Cheng ,  Ming-Che Hsieh

IPC: H01L23/10 ,  H01L23/34

CPC classification number: H01L25/105 ,  H01L23/3128 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A chip package structure includes a substrate, a chip, a thermal conductive layer, a plurality of signal contacts, and a molding compound. The substrate includes a plurality of first thermal conductive vias, a connecting circuit, and a plurality of signal vias electrically connected to the connecting circuit, and the substrate has a chip disposing region. The chip is disposed on the chip disposing region of the substrate and electrically connected to the signal vias through the connecting circuit. The thermal conductive layer is disposed over the substrate, connected to the first thermal conductive vias, and located above the chip disposing region. Besides, the thermal conductive layer has first openings exposing the signal vias. The signal contacts are respectively disposed in the first openings and connected to the signal vias. The molding compound encapsulates the chip.

Abstract translation: 芯片封装结构包括衬底，芯片，导热层，多个信号触点和模塑料。 衬底包括多个第一导热通孔，连接电路和电连接到连接电路的多个信号通孔，并且衬底具有芯片布置区域。 芯片设置在基板的芯片布置区域上，并通过连接电路与信号通孔电连接。 导热层设置在衬底上，连接到第一导热通孔，并且位于芯片布置区域的上方。 此外，导热层具有暴露信号通孔的第一开口。 信号触点分别设置在第一开口中并连接到信号通路。 模塑料封装芯片。

公开(公告)号：US08519524B1

公开(公告)日：2013-08-27

申请号：US13586890

申请日：2012-08-16

Applicant: Sheng-Tsai Wu ,  John H. Lau ,  Heng-Chieh Chien ,  Ra-Min Tain ,  Ming-Ji Dai ,  Yu-Lin Chao

Inventor： Sheng-Tsai Wu ,  John H. Lau ,  Heng-Chieh Chien ,  Ra-Min Tain ,  Ming-Ji Dai ,  Yu-Lin Chao

IPC: H01L23/02

CPC classification number: H01L23/49827 ,  H01L21/486 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0652 ,  H01L2221/68327 ,  H01L2221/68345 ,  H01L2224/0345 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13014 ,  H01L2224/13082 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1624 ,  H01L2224/17104 ,  H01L2224/81193 ,  H01L2224/94 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/01074 ,  H01L2224/03 ,  H01L2224/13099 ,  H01L2224/05099 ,  H01L2224/05599 ,  H01L2224/05552

Abstract: A chip stacking structure including a carrier, a first redistribution layer, a second redistribution layer, at least one first chip, at least one second chip, and at least one conductor is provided. The carrier has a first surface and a second surface opposite to each other. The carrier has at least one through hole. The first and second redistribution layers are disposed on the first and second surfaces of the carrier, respectively. The first and second chips are disposed on the first and second surfaces of the carrier and electrically connected with the first and second redistribution layers, respectively. The conductor is disposed on one of the first and second chips. The conductor is disposed in the through hole. The first and second chips are electrically connected by the conductor. A gap is formed between the conductor and an inner wall of the carrier which surrounds the through hole.

Abstract translation: 提供了包括载体，第一再分布层，第二再分配层，至少一个第一芯片，至少一个第二芯片和至少一个导体的芯片堆叠结构。 载体具有彼此相对的第一表面和第二表面。 载体具有至少一个通孔。 第一和第二再分布层分别设置在载体的第一和第二表面上。 第一和第二芯片设置在载体的第一和第二表面上，并分别与第一和第二再分配层电连接。 导体设置在第一和第二芯片之一上。 导体设置在通孔中。 第一和第二芯片由导体电连接。 在导体和围绕通孔的载体的内壁之间形成间隙。

公开(公告)号：US20100267176A1

公开(公告)日：2010-10-21

申请号：US12545862

申请日：2009-08-24

Applicant: Chun-Kai Liu ,  Yu-Lin Chao ,  Ming-Ji Dai

Inventor： Chun-Kai Liu ,  Yu-Lin Chao ,  Ming-Ji Dai

IPC: H01L33/00 ,  H01L23/34 ,  H01S3/042

CPC classification number: H01S5/4025 ,  H01L23/34 ,  H01L25/167 ,  H01L33/64 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: A light emitting apparatus comprising a substrate, a first functional chip and a first light emitting component is provided. The substrate, the first functional chip, and the first light emitting component have a plurality of first bumps. In addition, the first functional chip has a plurality of first vias. The first light emitting component and the first functional chip are stacked on the substrate. Hence, the first light emitting component is electrically connected to the first functional chip and the substrate by the first vias and the first bumps.

Abstract translation: 提供了包括基板，第一功能芯片和第一发光部件的发光装置。 基板，第一功能芯片和第一发光部件具有多个第一凸块。 此外，第一功能芯片具有多个第一通孔。 第一发光部件和第一功能芯片堆叠在基板上。 因此，第一发光部件通过第一通孔和第一凸块与第一功能芯片和基板电连接。

公开(公告)号：USRE38830E1

公开(公告)日：2005-10-18

申请号：US29155464

申请日：2002-01-23

Applicant: Chia-Wen Wang ,  Yu-Lin Chao ,  Jeng-Yeong Tyan

Inventor： Chia-Wen Wang ,  Yu-Lin Chao ,  Jeng-Yeong Tyan

公开(公告)号：US5557663A

公开(公告)日：1996-09-17

申请号：US389151

申请日：1995-02-15

Applicant: Shu-Chen Huang ,  Yu-Lin Chao ,  Jeng-Yeong Tyan

Inventor： Shu-Chen Huang ,  Yu-Lin Chao ,  Jeng-Yeong Tyan

IPC: H04N7/14 ,  H04M11/00

CPC classification number: H04N7/142 ,  H04N7/148

Abstract: An audio-video user interface for a multimedia communication system is disclosed in this invention. the integrated audio-video user interface includes a base-support for supporting the integrated audio-video interface. The base-support further includes a plurality of audio input and output devices. the audio-video user interface further includes a multi-direction adjustable support for supporting a video input device such as a video camera. The adjustable support is securely attached to the base support and is flexibly adjustable for directing the video input device for pointing to different directions. The audio-video user interface is ready to perform a multi-media communication once connected to a compatible computer with an audio interface card, a video interface card and an integrated service digital network (ISDN) interface card.

Abstract translation: 在本发明中公开了一种用于多媒体通信系统的音频 - 视频用户界面。 集成音频 - 视频用户界面包括用于支持集成音频 - 视频接口的基础支持。 基座支撑还包括多个音频输入和输出装置。 音频 - 视频用户界面还包括用于支持诸如摄像机的视频输入设备的多方向可调节支持。 可调节的支撑件牢固地附接到基座支撑件上，并且可灵活地调节以便引导视频输入装置指向不同的方向。 连接音频接口卡，视频接口卡和综合业务数字网（ISDN）接口卡后，音频 - 视频用户界面就可以一旦连接到兼容计算机就可以执行多媒体通信。

公开(公告)号：US20090294947A1

公开(公告)日：2009-12-03

申请号：US12464873

申请日：2009-05-13

Applicant: Ra-Min Tain ,  Yu-Lin Chao ,  Shu-Jung Yang ,  Rong-Chang Fang ,  Wei Li ,  Chih-Yuan Cheng ,  Ming-Che Hsieh

Inventor： Ra-Min Tain ,  Yu-Lin Chao ,  Shu-Jung Yang ,  Rong-Chang Fang ,  Wei Li ,  Chih-Yuan Cheng ,  Ming-Che Hsieh

IPC: H01L23/34 ,  H01L21/50 ,  H01L25/11

CPC classification number: H01L25/105 ,  H01L23/3128 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A chip package structure includes a substrate, a chip, a thermal conductive layer, a plurality of signal contacts, and a molding compound. The substrate includes a plurality of first thermal conductive vias, a connecting circuit, and a plurality of signal vias electrically connected to the connecting circuit, and the substrate has a chip disposing region. The chip is disposed on the chip disposing region of the substrate and electrically connected to the signal vias through the connecting circuit. The thermal conductive layer is disposed over the substrate, connected to the first thermal conductive vias, and located above the chip disposing region. Besides, the thermal conductive layer has first openings exposing the signal vias. The signal contacts are respectively disposed in the first openings and connected to the signal vias. The molding compound encapsulates the chip.

Abstract translation: 芯片封装结构包括衬底，芯片，导热层，多个信号触点和模塑料。 衬底包括多个第一导热通孔，连接电路和电连接到连接电路的多个信号通孔，并且衬底具有芯片布置区域。 芯片设置在基板的芯片布置区域上，并通过连接电路与信号通孔电连接。 导热层设置在衬底上，连接到第一导热通孔，并且位于芯片布置区域的上方。 此外，导热层具有暴露信号通孔的第一开口。 信号触点分别设置在第一开口中并连接到信号通路。 模塑料封装芯片。

公开(公告)号：US20070151969A1

公开(公告)日：2007-07-05

申请号：US11562420

申请日：2006-11-22

Applicant: Ra-Min Tain ,  Shu-Jung Yang ,  Yu-Lin Chao ,  Yao-Shun Chen ,  Shyi-Ching Liau

Inventor： Ra-Min Tain ,  Shu-Jung Yang ,  Yu-Lin Chao ,  Yao-Shun Chen ,  Shyi-Ching Liau

IPC: H05B6/10

CPC classification number: F01K13/006 ,  F01K21/02

Abstract: A heat-pipe electric-power generating device capable of converting thermal energy to electrical energy is provided. The device includes a heat pipe and the heat pipe has a sealed internal space that can produce a steam-flow from an evaporating end to a condensing end according to a pressure difference caused by a temperature difference between the ends. A steam-flow electric-power generating device has at least a rotating portion disposed in the internal space for generating electric power when driven by a steam-flow. An electrode structure is used for leading the electric power out. The heat pipe is maintained in a sealed condition. In addition, several heat-pipe electric-power generating devices can be arranged into an array to form a heat electric-power generator or disposed inside an apparatus with a heat source for recycling the conventional waste thermal energy into useful electrical energy.

Abstract translation: 提供了一种能够将热能转换成电能的热管式发电装置。 该装置包括热管，并且热管具有密封的内部空间，其可以根据由端部之间的温度差引起的压力差而产生从蒸发端到冷凝端的蒸汽流。 蒸汽流动发电装置至少具有设置在内部空间中的旋转部分，用于在由蒸汽流动驱动时产生电力。 电极结构用于引出电力。 热管保持密封状态。 此外，若干热管式发电装置可以排列成阵列以形成热发电机，或设置在具有用于将常规废热热能再循环到有用电能的热源的装置内。

公开(公告)号：USD464044S1

公开(公告)日：2002-10-08

申请号：US29138506

申请日：2001-03-16

Applicant: Chia-Wen Wang ,  Yu-Lin Chao ,  Cheng-Yeh Yang

Designer： Chia-Wen Wang ,  Yu-Lin Chao ,  Cheng-Yeh Yang

公开(公告)号：US08310037B2

公开(公告)日：2012-11-13

申请号：US12545862

申请日：2009-08-24

Applicant: Chun-Kai Liu ,  Yu-Lin Chao ,  Ming-Ji Dai

Inventor： Chun-Kai Liu ,  Yu-Lin Chao ,  Ming-Ji Dai

IPC: H01L23/02

CPC classification number: H01S5/4025 ,  H01L23/34 ,  H01L25/167 ,  H01L33/64 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: A light emitting apparatus comprising a substrate, a first functional chip and a first light emitting component is provided. The substrate, the first functional chip, and the first light emitting component have a plurality of first bumps. In addition, the first functional chip has a plurality of first vias. The first light emitting component and the first functional chip are stacked on the substrate. Hence, the first light emitting component is electrically connected to the first functional chip and the substrate by the first vias and the first bumps.

Abstract translation: 提供了包括基板，第一功能芯片和第一发光部件的发光装置。 基板，第一功能芯片和第一发光部件具有多个第一凸块。 此外，第一功能芯片具有多个第一通孔。 第一发光部件和第一功能芯片堆叠在基板上。 因此，第一发光部件通过第一通孔和第一凸块与第一功能芯片和基板电连接。