公开(公告)号：US06455927B1

公开(公告)日：2002-09-24

申请号：US09804749

申请日：2001-03-12

Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

IPC: H01L2302

CPC classification number: B81B7/0067 ,  G02B26/0841 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2224/45099

Abstract: A micromirror device package includes a micromirror device chip having a micromirror device area on an upper surface of the micromirror device chip. A window is mounted above the micromirror device area and to the upper surface of the micromirror device chip by a bead. By forming the window of borosilicate glass and the bead of solder glass, the micromirror device area is hermetically sealed. In this manner, corrosion and contamination of the micromirror device area is prevented.

Abstract translation: 微镜器件封装包括在微镜器件芯片的上表面上具有微镜器件区域的微镜器件芯片。 窗口通过一个珠子安装在微反射镜装置区域上方和微镜装置芯片的上表面上。 通过形成硼硅酸盐玻璃窗和焊料玻璃珠，微镜装置区域被气密密封。 以这种方式，防止微镜装置区域的腐蚀和污染。

公开(公告)号：US06455774B1

公开(公告)日：2002-09-24

申请号：US09457505

申请日：1999-12-08

Applicant: Steven Webster

Inventor： Steven Webster

IPC: H01L2302

CPC classification number: H01L27/14618 ,  H01L23/10 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00

Abstract: An image sensor package includes a molding having an interior locking feature and an exterior locking feature. The molding is a low cost molded part. The image sensor package further includes a window having an interior surface and an exterior surface. The exterior locking feature of the molding contacts a periphery of the exterior surface of the window and the interior locking feature of the molding contacts a periphery of the interior surface of the window. In this manner, the window is supported by the molding both top and bottom. Also, the distance which moisture must travel along the interface between the molding and window to reach the image sensor is maximized thus essentially eliminating moisture ingress into the image sensor package.

Abstract translation: 图像传感器封装包括具有内部锁定特征和外部锁定特征的模制件。 模制件是低成本的模制件。 图像传感器封装还包括具有内表面和外表面的窗口。 模制件的外部锁定特征与窗口的外表面的周边相接触，并且模制件的内部锁定特征与窗的内表面的周边接触。 以这种方式，窗口由顶部和底部的成型支撑。 此外，水分必须沿着模制件和窗户之间的界面行进以到达图像传感器的距离最大化，从而基本上消除湿气进入图像传感器封装中。

公开(公告)号：US06432737B1

公开(公告)日：2002-08-13

申请号：US09754239

申请日：2001-01-03

Applicant: Steven Webster

Inventor： Steven Webster

IPC: H01L2100

CPC classification number: B81B7/0077 ,  B81C2203/0154 ,  H01L21/56 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00

Abstract: A plurality of pressure sensor dice are attached to an array of pressure sensor die attach sites located on a custom substrate having holes. The pressure sensor dice are then electrically connected to the pressure sensor die attach sites using standard flip chip techniques. The resulting array of pressure sensor sub-assemblies is then molded, so that a cavity is formed that is open at the bottom of each hole in the custom substrate. A portion of the outer surface of the micro-machine element of each pressure sensor die is left exposed at the bottom of the hole in the substrate. After molding, the exposed outer surface of the micro-machine element is covered with a pressure coupling gel applied in the hole. The resulting array of packaged pressure sensors are then sigulated using well know sawing or laser techniques or by snapping a specially formed snap array.

Abstract translation: 多个压力传感器芯片附接到位于具有孔的定制基板上的压力传感器芯片附着位置的阵列。 然后使用标准的倒装芯片技术将压力传感器芯片电连接到压力传感器芯片附着位置。然后将所得的压力传感器子组件阵列模制成一个空腔，其在每个孔的底部开口 定制基板。 每个压力传感器模具的微机元件的外表面的一部分在基板的孔的底部露出。 在模制之后，微孔元件的暴露的外表面被施加在孔中的压力耦合凝胶覆盖。 然后使用熟知的锯切或激光技术或通过捕捉特殊形成的卡扣阵列来将所得的封装的压力传感器阵列进行旋转。

公开(公告)号：US06424315B1

公开(公告)日：2002-07-23

申请号：US09631449

申请日：2000-08-02

Applicant: Thomas P. Glenn ,  Steven Webster

Inventor： Thomas P. Glenn ,  Steven Webster

IPC: H01Q138

CPC classification number: H01Q1/2225 ,  G06K19/07327 ,  G06K19/07775 ,  G06K19/07779 ,  H01Q1/22 ,  H01Q1/38 ,  H01Q1/526 ,  H01Q9/27 ,  Y10T29/49016

Abstract: A miniature radio-frequency identification (RFID) transceiver and a method for making the same are provided. The RFID transceiver is small in size and physically rugged. The RFID transceiver includes an integrated circuit and a radio-frequency antenna that is fixed to the integrated circuit and electrically connected to the integrated circuit. The integrated circuit includes an RFID transceiver circuit. The antenna may be a single thin-film layer over the top surface of the integrated circuit or multiple layers that form a larger antenna in a compact, folded structure. Multiple antenna layers may also be used to form a three-dimensional structure for improved antenna operation or may be used to form separate, independent antennas.

Abstract translation: 提供了一种微型射频识别（RFID）收发器及其制造方法。 RFID收发器尺寸小，物理坚固。 RFID收发器包括集成电路和固定到集成电路并电连接到集成电路的射频天线。 集成电路包括RFID收发器电路。 该天线可以是在集成电路的顶表面上的单个薄膜层或者以紧凑折叠的结构形成较大天线的多个层。 也可以使用多个天线层来形成用于改进的天线操作的三维结构，或者可以用于形成独立的独立天线。

公开(公告)号：US06399418B1

公开(公告)日：2002-06-04

申请号：US09916719

申请日：2001-07-26

Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

IPC: H01L2144

CPC classification number: H01L21/568 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L31/0203 ,  H01L31/02327 ,  H01L31/18 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: An electronic device, such as a sensor die, is packaged by first forming a hole through a substrate. The hole is made large enough to position the entire electronic device within the hole. A tape is then applied to the second surface of the substrate to cover a second side of the hole, thereby creating a tape surface at the bottom of the hole. The electronic device is then positioned within the hole such that the electronic device is in contact with, and adhered to, the tape surface at the bottom of the hole. Electronic connections are made between the electronic device and the substrate and a layer of encapsulant is applied. In one embodiment, the electronic device is a sensor die and an optical element is positioned over an active region of the sensor die before the encapsulant is applied. The encapsulant then surrounds and holds the optical element in position over the active region of the sensor die.

Abstract translation: 通过首先通过基板形成孔来封装诸如传感器管芯的电子装置。 孔足够大以将整个电子设备定位在孔内。 然后将带施加到基板的第二表面以覆盖孔的第二侧，从而在孔的底部形成带表面。 然后将电子设备定位在孔内，使得电子设备与孔的底部接触并粘附到带表面。 在电子设备和基板之间形成电子连接，并且施加一层密封剂。在一个实施例中，电子设备是传感器管芯，并且在施加密封剂之前，光学元件位于传感器管芯的有源区域上方。 然后，密封剂围绕并将光学元件保持在传感器管芯的有源区域上的适当位置。

公开(公告)号：US06389687B1

公开(公告)日：2002-05-21

申请号：US09457517

申请日：1999-12-08

Applicant: Thomas P. Glenn ,  Steven Webster

Inventor： Thomas P. Glenn ,  Steven Webster

IPC: H05K330

CPC classification number: H01L27/14636 ,  H01L21/50 ,  H01L23/04 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14625 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01039 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/181 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/53178 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Image sensor packages are fabricated simultaneously to minimize the cost associated with each individual image sensor package. To fabricate the image sensor packages, windows are molded in molding compound to form a molded window array. A substrate includes a plurality of individual substrates integrally connected together in an array format. Image sensors are attached and electrically connected to corresponding individual substrates. An adhesive layer attaches the molded window array to the substrate. The substrate and attached molded window array are singulated into a plurality of individual image sensor packages.

Abstract translation: 同时制造图像传感器封装以最小化与每个单独的图像传感器封装相关联的成本。 为了制造图像传感器封装，将窗口模制成模制化合物以形成模制的窗口阵列。 衬底包括以阵列形式整体连接在一起的多个单独衬底。 图像传感器被附接并电连接到相应的各个基板。 粘合剂层将模制的窗口阵列附着到基底上。 衬底和附着的模制窗阵列被分割成多个单独的图像传感器封装。

公开(公告)号：US4892508A

公开(公告)日：1990-01-09

申请号：US365380

申请日：1989-06-13

Applicant: Robert Ryan ,  Steven Webster ,  Richard Prouty ,  Peter Rosa

Inventor： Robert Ryan ,  Steven Webster ,  Richard Prouty ,  Peter Rosa

IPC: B61B12/06

CPC classification number: B61B12/06

Abstract: An improved safety control mechanism for a pulley apparatus of the type comprising main support bars having at least two wheels mounted at their centers a spaced distance apart between the bars and a swing arm assembly pivotally connected to the bars at a point between the centers of the wheels, the swing arm assembly comprising a pair of arms straddling opposing surfaces of the bars and pivotally connected to the bars by a main pivot mechanism extending through complementary aligned apertures in the arms and the bars, the improvement comprising a second bolt mechanism extending through a second complementary aperture disposed in either the bars or the arms and a slot disposed in the other of the bars or the arms; the second aperture or the slot provided in the bars being disposed in the second distance between the center mountings of the wheels; the second aperture or the slot provided in the arms being aligned with the other of the second aperture or the slot provided in the bars with the arms and the bars connected by the main pivot bolt; the slot having an arcuate engagement surface which follows the pivot of the arms and engages the second bolt mechanism against detachment of the arms upon failure of the main pivot bolt; the second aperture and the slot being disposed around the complementary aligned apertures through which the main pivot bolt extends.

Abstract translation: 一种用于这种类型的滑轮装置的改进的安全控制机构，包括主支撑杆，所述主支撑杆具有至少两个轮，它们安装在它们的中心处，在杆之间间隔开间隔开，并且摆动臂组件枢转地连接到杆， 所述摆臂组件包括跨越所述杆的相对表面的一对臂并且通过延伸穿过所述臂和所述杆中的互补对准的孔的主枢转机构枢转地连接到所述杆，所述改进包括延伸穿过所述杆的第二螺栓机构 设置在杆或臂中的第二互补孔和设置在杆或臂中的另一个中的槽; 设置在杆中的第二孔或槽设置在车轮的中心安装件之间的第二距离内; 设置在臂中的第二孔或槽与设置在杆中的另一个第二孔或槽对准，臂和杆通过主枢轴螺栓连接; 所述槽具有跟随所述臂的枢轴并且接合所述第二螺栓机构的弓形接合表面，以防止所述臂在所述主枢轴螺栓故障时脱离; 所述第二孔和所述狭槽围绕所述主枢轴螺栓延伸穿过的所述互补对齐的孔设置。