中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

148 records (took 0.02 seconds)

    Mounting for a package containing a chip
    142.
    发明授权
    Mounting for a package containing a chip 有权
    安装一个包含芯片的包装

    公开(公告)号：US06545345B1

    公开(公告)日：2003-04-08

    申请号：US09813485

    申请日：2001-03-20

    Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy D. Hollaway

    Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy D. Hollaway

    IPC: H01L23495

    CPC classification number: H05K1/182 ,  H01L23/5389 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32145 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: A mounting for a package containing a semiconductor chip is disclosed, along with methods of making such a mounting. The mounting includes a substrate having a mounting surface with conductive traces thereon, and an aperture extending through the substrate. The package includes a base, such as a leadframe or a laminate sheet, and input/output terminals. A chip is on a first side of the base and is electrically connected (directly or indirectly) to the input/output terminals. A cap, which may be a molded encapsulant, is provided on the first side of the base over the chip. The package is mounted on the substrate so that the cap is in the aperture, and a peripheral portion of the first side of the base is over the mounting surface so as to support the package in the aperture and allow the input/output terminals of the package to be juxtaposed with to the circuit patterns of the mounting surface. Because the cap is within the aperture, a height of the package above the mounting surface is minimized.

    Abstract translation: 公开了一种用于包含半导体芯片的封装的安装件，以及制造这种安装的方法。 安装件包括具有其上具有导电迹线的安装表面的基板和延伸穿过基板的孔。 该包装包括底座，例如引线框或层压板，以及输入/输出端子。 芯片位于基座的第一侧，并与输入/输出端子电连接（直接或间接）。 在芯片上的基座的第一侧上提供可以是模制密封剂的盖。 封装被安装在基板上，使得帽位于孔中，并且基座的第一侧的周边部分在安装表面上方，以便将封装支撑在孔中，并且允许端子的输入/输出端子 包装与安装表面的电路图案并列。 因为盖在孔内，所以在安装表面上方的包装的高度被最小化。

    Bond wire pressure sensor die package
    143.
    发明授权
    Bond wire pressure sensor die package 有权
    焊丝压力传感器芯片封装

    公开(公告)号：US06441503B1

    公开(公告)日：2002-08-27

    申请号：US09754393

    申请日：2001-01-03

    Applicant: Steven Webster

    Inventor： Steven Webster

    IPC: H01L2328

    CPC classification number: G01L19/141 ,  G01L19/0645 ,  G01L19/147 ,  H01L21/565 ,  H01L23/3128 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

    Abstract: A plurality of pressure sensor dice are attached to an array of pressure sensor die attach sites located on a substrate. The pressure sensor dice are then electrically connected to the pressure sensor die attach sites using standard wire bond techniques. The resulting array of pressure sensor sub-assemblies is then molded, using a mold tool that closes on three sides of the substrate so that a cavity is formed that is open on the fourth side. A portion of the outer surface of the micro-machine element of each pressure sensor die is left exposed at the bottom of a cavity or hole in the encapsulant. After molding, the exposed outer surface of the micro-machine element is covered with a pressure coupling gel applied in the cavity. The resulting array of packaged pressure sensors are then sigulated using well know sawing or laser techniques or by snapping a specially formed snap array.

    Abstract translation: 多个压力传感器芯片附接到位于基板上的压力传感器芯片附着位置的阵列。 然后使用标准引线接合技术将压力传感器芯片电连接到压力传感器芯片附接位置。然后使用在基板的三侧封闭的模具来模制所得到的压力传感器子组件阵列，使得腔体 形成在第四侧是敞开的。 每个压力传感器模具的微机元件的外表面的一部分在密封剂的空腔或孔的底部露出。 在模制之后，微机元件的暴露的外表面被施加在空腔中的压力耦合凝胶覆盖。 然后使用熟知的锯切或激光技术或通过捕捉特殊形成的卡扣阵列来将所得的封装的压力传感器阵列进行旋转。

    Active heat sink for cooling a semiconductor chip
    144.
    发明授权
    Active heat sink for cooling a semiconductor chip 有权
    主动散热片用于冷却半导体芯片

    公开(公告)号：US06429513B1

    公开(公告)日：2002-08-06

    申请号：US09866100

    申请日：2001-05-25

    Applicant: Charles A. Shermer, IV ,  Thomas P. Glenn ,  Steven Webster ,  Donald Craig Foster

    Inventor： Charles A. Shermer, IV ,  Thomas P. Glenn ,  Steven Webster ,  Donald Craig Foster

    IPC: H01L2334

    CPC classification number: H01L23/427 ,  H01L23/4334 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2924/15311

    Abstract: Semiconductor packages and other electronic assemblies having an active heat sink are disclosed, along with methods of making the same. The active heat sink includes a cavity partially filled with a heat activated liquid. Heat generated during operation of a chip boils the heat activated liquid. The vapor condenses on an inner surface of the active heat sink and transfers heat to an outer, possibly finned, surface exposed to ambient to dissipate heat. In some embodiments, the active heat sink may be a closed vessel mounted on the chip. In some embodiments, the vessel of the active heat sink is formed from a die pad of a leadframe substrate. The die pad includes a recess that forms the active heat sink cavity when bonded to the back surface of the chip. The heat activated liquid directly contacts the back surface of the chip in these embodiments.

    Abstract translation: 公开了具有有源散热器的半导体封装和其它电子组件及其制造方法。 活性散热器包括部分填充有热活化液体的空腔。 在芯片运行期间产生的热量使热活化液体沸腾。 蒸汽在有源散热器的内表面上冷凝，并将热量传递到暴露于环境的外部可能有翅片的表面以散热。 在一些实施例中，有源散热器可以是安装在芯片上的封闭容器。 在一些实施例中，有源散热器的容器由引线框架基板的管芯焊盘形成。 芯片焊盘包括当结合到芯片的背面时形成有源散热腔的凹部。 在这些实施例中，热活化液体直接接触芯片的背面。

    Method for forming a bond wire pressure sensor die package
    145.
    发明授权
    Method for forming a bond wire pressure sensor die package 有权
    形成接合线压力传感器芯片封装的方法

    公开(公告)号：US06420201B1

    公开(公告)日：2002-07-16

    申请号：US09754229

    申请日：2001-01-03

    Applicant: Steven Webster

    Inventor： Steven Webster

    IPC: H01L2100

    CPC classification number: G01L9/0054 ,  G01L19/147 ,  H01L21/565 ,  H01L23/3128 ,  H01L24/97 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/10253 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00

    Abstract: A plurality of pressure sensor dice are attached to an array of pressure sensor die attach sites located on a substrate. The pressure sensor dice are then electrically connected to the pressure sensor die attach sites using standard wire bond techniques. The resulting array of pressure sensor sub-assemblies is then molded, using a mold tool which closes on three sides of the substrate so that a cavity is formed that is open on the fourth side. A portion of the outer surface of the micro-machine element of each pressure sensor die is left exposed at the bottom of a cavity or hole in the encapsulant. After molding, the exposed outer surface of the micro-machine element is covered with a pressure coupling gel applied in the cavity. The resulting array of packaged pressure sensors are then sigulated using well know sawing or laser techniques or by snapping a specially formed snap array.

    Abstract translation: 多个压力传感器芯片附接到位于基板上的压力传感器芯片附着位置的阵列。 然后使用标准导线接合技术将压力传感器芯片电压连接到压力传感器芯片附接位置。然后使用在基板的三侧封闭的模具来模制所得到的压力传感器子组件阵列，使得腔体 形成在第四侧是敞开的。 每个压力传感器模具的微机元件的外表面的一部分在密封剂的空腔或孔的底部露出。 在模制之后，微机元件的暴露的外表面被施加在空腔中的压力耦合凝胶覆盖。 然后使用熟知的锯切或激光技术或通过捕捉特殊形成的卡扣阵列来将所得的封装的压力传感器阵列进行旋转。

    Method of singulation using laser cutting
    146.
    发明授权
    Method of singulation using laser cutting 有权
    使用激光切割的分割方法

    公开(公告)号：US06399463B1

    公开(公告)日：2002-06-04

    申请号：US09797756

    申请日：2001-03-01

    Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

    Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

    IPC: H01L2146

    CPC classification number: H01L21/3043 ,  H01L21/78

    Abstract: A wafer is singulated from the back-side surface of the wafer using laser ablation, thus protecting the front-side surface of the wafer and, more particularly, the integrated circuits and/or functional units on the front-side surface. Since, according to the invention, no saw blade is used, the width of the scribe lines does not need to be any larger than the width of the beam from the laser plus some minimal tolerance for alignment. As a result, using the invention, the width of scribe lines is on the order of twenty-four times smaller than the width of scribe lines required by the prior art methods.

    Abstract translation: 使用激光烧蚀从晶片的背面形成晶片，从而保护晶片的前侧表面，更具体地，保护前表面上的集成电路和/或功能单元。 由于根据本发明，没有使用锯片，所以划线的宽度不需要大于来自激光器的光束的宽度加上对准的最小公差。 结果，使用本发明，划线的宽度比现有技术方法所需的划线宽度小24倍。

Patent Agency Ranking