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公开(公告)号：US20230003937A1
公开(公告)日：2023-01-05
申请号：US17363846
申请日：2021-06-30
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor： Michal Rakowski , Petar I. Todorov , Yusheng Bian , Won Suk Lee , Asif J. Chowdhury , Kenneth Giewont
Abstract: Disclosed is a photonic structure and associated method. The structure includes a closed-curve waveguide having a first height, as measured from the top surface of an insulator layer, and an outer curved sidewall that extends essentially vertically the full first height (e.g., to minimize signal loss). The structure includes a closed-curve thermal coupler and a heating element. The closed-curve thermal coupler is thermally coupled to and laterally surrounded by the closed-curve waveguide and has a second height that is less than the first height. In some embodiments, the closed-curve waveguide and the closed-curve thermal coupler are continuous portions of the same semiconductor layer having different thicknesses. The heating element is thermally coupled to the closed-curve thermal coupler and thereby indirectly thermally coupled to the closed-curve waveguide. Thus, the heating element is usable for thermally tuning the closed-curve waveguide via the closed-curve thermal coupler to minimize any temperature-dependent resonance shift (TDRS).
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公开(公告)号：US20220413232A1
公开(公告)日：2022-12-29
申请号：US17362154
申请日：2021-06-29
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor： Spencer Porter , Mark Levy , Siva P. Adusumilli , Yusheng Bian
IPC: G02B6/42
Abstract: Structures for a coupler and methods of forming a structure for a coupler. A structure for a directional coupler may include a first waveguide core having one or more first airgaps and a second waveguide core including one or more second airgaps. The one or more second airgaps are positioned in the second waveguide core adjacent to the one or more first airgaps in the first waveguide core. A structure for an edge coupler is also provided in which the waveguide core of the edge coupler includes one or more airgaps.
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公开(公告)号：US11537866B2
公开(公告)日：2022-12-27
申请号：US16880253
申请日：2020-05-21
Applicant: GLOBALFOUNDRIES U.S. INC.
Inventor： Akhilesh R. Jaiswal , Ajey Poovannummoottil Jacob , Yusheng Bian , Michal Rakowski
IPC: G06N3/067 , H01L27/144 , G06N3/04 , H01L31/0232 , H01L31/02
Abstract: The present disclosure relates to semiconductor structures and, more particularly, to optical neuro-mimetic devices and methods of manufacture. The structure includes: a plurality of photodetectors and electrical circuitry that converts photocurrent generated from the photodetectors into electrical current and then sums up the electrical current to mimic neural functionality.
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公开(公告)号：US11536903B1
公开(公告)日：2022-12-27
申请号：US17406773
申请日：2021-08-19
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor： Theodore Letavic , Yusheng Bian , Kenneth J. Giewont , Karen Nummy
Abstract: Structures for an edge coupler and methods of fabricating a structure for an edge coupler. A first waveguide core has a first section that has a tapered shape and a second section that is adjoined to the first section. Multiple segments are positioned with a spaced arrangement adjacent to an end surface of the second section of the first waveguide core. A slab layer is adjoined to the first section of the first waveguide core. A second waveguide core has a section that overlaps with the first section of the first waveguide core to define a layer stack. The section of the second waveguide core has a tapered shape, and the first and second waveguide cores are comprised of different materials. The first section of the first waveguide core has a first thickness, and the slab layer has a second thickness that is less than the first thickness.
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155.发明申请公开(公告)号：US20220404547A1
公开(公告)日：2022-12-22
申请号：US17354408
申请日：2021-06-22
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor： Yusheng Bian , Qizhi Liu
Abstract: Embodiments of the disclosure provide an optical antenna for a photonic integrated circuit (PIC). The optical antenna includes a vertically oriented semiconductor waveguide with a first end on a semiconductor layer. The vertically oriented semiconductor waveguide includes a first sidewall and a second sidewall opposite the first sidewall. A reflective material is along the second sidewall of the vertically oriented semiconductor waveguide. A first plurality of grating protrusions extends from the first sidewall of the vertically oriented semiconductor waveguide.
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Patent Agency Ranking
156.发明授权公开(公告)号：US11515685B2
公开(公告)日：2022-11-29
申请号：US17167201
申请日：2021-02-04
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor： Yusheng Bian , Roderick A. Augur , Michal Rakowski , Kenneth J. Giewont , Karen A. Nummy
Abstract: A laser structure, including: a dielectric matrix formed of a first material; a laser source formed within the dielectric matrix and formed of a semiconductor material; and a plurality of side confining features formed within the dielectric matrix and extending parallel to and along a length of the laser source. The plurality of side confining features are formed of the semiconductor material.
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公开(公告)号：US20220373738A1
公开(公告)日：2022-11-24
申请号：US17328048
申请日：2021-05-24
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor： Yusheng Bian , Steven M. Shank
Abstract: Structures for a polarization rotator and methods of fabricating a structure for a polarization rotator. The structure includes a substrate, a first waveguide core over the substrate, and a second waveguide core over the substrate. The second waveguide core is positioned proximate to the section of the first waveguide core. The second waveguide core is comprised of a material having a refractive index that is reversibly variable in response to a stimulus.
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公开(公告)号：US20220350079A1
公开(公告)日：2022-11-03
申请号：US17306334
申请日：2021-05-03
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor： Abdelsalam Aboketaf , Yusheng Bian
Abstract: Structures for a photodetector or terminator and methods of fabricating a structure for a photodetector or terminator. The structure includes a waveguide core having a longitudinal axis, a pad connected to the waveguide core, and a light-absorbing layer on the pad adjacent to the waveguide core. The light-absorbing layer includes an annular portion, a first taper, and a second taper laterally spaced from the first taper. The first taper and the second taper are positioned adjacent to the waveguide core.
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公开(公告)号：US11487059B2
公开(公告)日：2022-11-01
申请号：US17179532
申请日：2021-02-19
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor： Asli Sahin , Karen A. Nummy , Thomas Houghton , Kevin K. Dezfulian , Kenneth J. Giewont , Yusheng Bian
Abstract: A photonics integrated circuit includes a semiconductor substrate; a buried insulator layer positioned over the semiconductor substrate; and a back-end-of-line (BEOL) insulator stack over a first portion of the buried insulator layer. In addition, the PIC includes a silicon nitride (SiN) waveguide edge coupler positioned in a first region over the buried insulator layer and at least partially under the BEOL insulator stack. An oxide layer extends over a side of the BEOL insulator stack. The SiN waveguide edge coupler provides better power handling and fabrication tolerance than silicon waveguide edge couplers, despite the location under various BEOL layers. The PIC can also include silicon waveguide edger coupler(s).
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公开(公告)号：US20220326434A1
公开(公告)日：2022-10-13
申请号：US17227843
申请日：2021-04-12
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor： Yusheng Bian
Abstract: Structures for an optical component of a photonics chip and methods of forming a structure for an optical component of a photonics chip. The structure includes a slotted waveguide component having a first and second waveguide cores over a dielectric layer. The first waveguide core separated from the second waveguide core by a slot. The structure further includes a third waveguide core over the dielectric layer. The third waveguide core is positioned in a different level relative to the dielectric layer than the slotted waveguide component, and the third waveguide core and the first slot have an overlapping arrangement
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