公开(公告)号：US20070264594A1

公开(公告)日：2007-11-15

申请号：US11746202

申请日：2007-05-09

Applicant: Ching-Yu Chang ,  Heng-Jen Lee ,  Chin-Hsiang Lin ,  Hua-Tai Lin ,  Kuei Shun Chen ,  Bang-Chein Ho ,  Li-Kong Turn ,  Hung-Jui Kuo ,  Ko-Bin Kao ,  Tsung-Chih Chien

Inventor： Ching-Yu Chang ,  Heng-Jen Lee ,  Chin-Hsiang Lin ,  Hua-Tai Lin ,  Kuei Shun Chen ,  Bang-Chein Ho ,  Li-Kong Turn ,  Hung-Jui Kuo ,  Ko-Bin Kao ,  Tsung-Chih Chien

IPC: G03F7/40

CPC classification number: G03F7/40

Abstract: A method of inhibiting photoresist pattern collapse which includes the steps of providing a substrate; providing a photoresist layer on the substrate; exposing and developing the photoresist layer; applying a top anti-reflective coating layer to the photoresist layer; rinsing the photoresist layer; and drying the photoresist layer.

Abstract translation: 一种抑制光致抗蚀剂图案塌陷的方法，包括提供基底的步骤; 在衬底上提供光致抗蚀剂层; 曝光和显影光致抗蚀剂层; 将顶部抗反射涂层施加到光致抗蚀剂层上; 冲洗光刻胶层; 并干燥光刻胶层。

公开(公告)号：US20070039631A1

公开(公告)日：2007-02-22

申请号：US11204691

申请日：2005-08-16

Applicant: Chen-Yuan Hsia ,  Chang-Cheng Hung ,  Chi-Lun Lu ,  Shih-Ming Chang ,  Wen-Chuan Wang ,  Yen-Bin Huang ,  Ching-Yu Chang ,  Chin-Hsiang Lin

Inventor： Chen-Yuan Hsia ,  Chang-Cheng Hung ,  Chi-Lun Lu ,  Shih-Ming Chang ,  Wen-Chuan Wang ,  Yen-Bin Huang ,  Ching-Yu Chang ,  Chin-Hsiang Lin

IPC: B08B3/12 ,  B08B3/00 ,  C23G1/00 ,  B08B5/04

CPC classification number: B08B6/00 ,  B08B5/00 ,  H01L21/02057 ,  H01L21/67017 ,  H01L21/67051

Abstract: A system for semiconductor wafer manufacturing, comprises a chamber process path for processing the wafer, and a device operable to remove particles from the wafer by electrostatic and electromagnetic methodologies wherein the device is installed in the chamber process path.

Abstract translation: 一种用于半导体晶片制造的系统，包括用于处理晶片的腔室处理路径，以及可操作以通过静电和电磁方法从晶片去除颗粒的装置，其中该装置安装在室过程路径中。

公开(公告)号：US07125741B2

公开(公告)日：2006-10-24

申请号：US10720735

申请日：2003-11-24

Applicant: Yu-Lin Yen ,  Ching-Yu Chang

Inventor： Yu-Lin Yen ,  Ching-Yu Chang

IPC: H01L21/00 ,  H01L21/4763 ,  H01L21/44

CPC classification number: H01L21/0276 ,  H01L21/0332 ,  Y10S438/952

Abstract: A rework process of patterned photo-resist layer is provided. First, a substrate is provided with a first DARC, a first primer and a first patterned photo-resist layer being sequentially formed thereon. Next, remove the first patterned photo-resist layer and the first primer from the first DARC. After that, form a second DARC on the first DARC; form a second primer on the second DARC. Last, form a second patterned photo-resist layer on the second primer.

Abstract translation: 提供了图案化光刻胶层的返工工艺。 首先，在衬底上依次形成有第一DARC，第一底漆和第一图案化的光致抗蚀剂层。 接下来，从第一DARC去除第一图案化的光致抗蚀剂层和第一底漆。 之后，在第一个DARC上形成第二个DARC; 在第二个DARC上形成第二个引物。 最后，在第二底漆上形成第二图案的光致抗蚀剂层。

公开(公告)号：US07097945B2

公开(公告)日：2006-08-29

申请号：US10249559

申请日：2003-04-18

Applicant: Ching-Yu Chang ,  Hsin-huei Chen ,  Meng-Wei Chen

Inventor： Ching-Yu Chang ,  Hsin-huei Chen ,  Meng-Wei Chen

IPC: G03F1/00 ,  H01L21/302

CPC classification number: G03F1/70

Abstract: A method of reducing a critical dimension (“CD”) bias between a dense pattern and an isolation pattern is disclosed. The method includes a first step of providing a mask having a dense pattern, an isolation pattern and the other area of the mask is transparent, in which mask the dense pattern has a first opaque pattern and the isolation pattern has a second opaque pattern. The second step of the method is forming a virtual pattern around the isolation pattern, in which a distance between the virtual pattern and the isolation pattern is y, and the virtual pattern has a pattern line width x. By forming the virtual pattern around the isolation pattern, the flare effect of the isolation pattern is close to that of the dense pattern, thus the CD bias between a dense pattern, and an isolation pattern is reduced, and the process window does not shrink.

Abstract translation: 公开了一种降低致密图案和隔离图案之间的临界尺寸（“CD”）偏压的方法。 该方法包括提供具有致密图案的掩模，隔离图案和掩模的另一区域是透明的第一步骤，其中密集图案具有第一不透明图案，并且隔离图案具有第二不透明图案。 该方法的第二步是在隔离图案周围形成虚拟图案，其中虚拟图案和隔离图案之间的距离为y，虚拟图案具有图案线宽度x。 通过在隔离图案周围形成虚拟图案，隔离图案的耀斑效应接近密集图案的闪光效果，因此减小密集图案和隔离图案之间的CD偏差，并且处理窗口不缩小。

公开(公告)号：US07097921B2

公开(公告)日：2006-08-29

申请号：US10446927

申请日：2003-05-29

Applicant: Ching-Yu Chang ,  Yu-Lin Yen ,  Chin-Da Su

Inventor： Ching-Yu Chang ,  Yu-Lin Yen ,  Chin-Da Su

IPC: B32B18/00

CPC classification number: C23C28/00 ,  H01L23/53223 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A sandwich ARC structure for preventing metal to contact from shifting, the sandwich ARC structure comprising a first Ti layer formed on a metal laer and a first TiN layer formed on the first Ti layer. A second Ti layer is formed on the first TiN layer and a second TiN layer is formed on the second Ti layer. Wherein the sandwich ARC structure formed of first Ti/first TiN/second Ti/second TiN will reduces the tress between said metal layer and a dielectric layer formed below the metal layer.

Abstract translation: 一种用于防止金属接触移动的夹层ARC结构，所述夹层ARC结构包括形成在金属层上的第一Ti层和形成在第一Ti层上的第一TiN层。 在第一TiN层上形成第二Ti层，在第二Ti层上形成第二TiN层。 其中由第一Ti /第一TiN /第二Ti /第二TiN形成的夹层ARC结构将减少所述金属层和形成在金属层下面的电介质层之间的发束。

公开(公告)号：US07051800B2

公开(公告)日：2006-05-30

申请号：US09727946

申请日：2000-12-01

Applicant: Ching-Yu Chang ,  I-Pien Wu

Inventor： Ching-Yu Chang ,  I-Pien Wu

IPC: F28F3/12

CPC classification number: H01L21/67109 ,  F28F3/12

Abstract: A cooling system for a hot plate. The cooling system includes a plurality of pipelines inside the hot plate. Each pipeline has an inlet and an outlet. The inlet permits a cooling fluid to enter and the outlet permits the cooling fluid to leave. The cooling fluid running inside the pipelines picks up heat from the hot plate and carries away so that the hot plate is cooled.

公开(公告)号：US20060057507A1

公开(公告)日：2006-03-16

申请号：US10942499

申请日：2004-09-15

Applicant: Ching-Yu Chang ,  Kuei Chen ,  Bang-Ching Ho

Inventor： Ching-Yu Chang ,  Kuei Chen ,  Bang-Ching Ho

IPC: G03F7/00

CPC classification number: G03F7/091 ,  G03F7/11

Abstract: A method comprises forming a BARC layer on a substrate, treating the BARC layer to make its surface hydrophilic, forming a photoresist layer on the treated BARC layer, exposing the photoresist layer to a predetermined pattern, and developing the photoresist layer to form patterned photoresist.

公开(公告)号：US20050236721A1

公开(公告)日：2005-10-27

申请号：US10833206

申请日：2004-04-26

Applicant: Yu-Lin Yen ,  Ching-Yu Chang

Inventor： Yu-Lin Yen ,  Ching-Yu Chang

IPC: G03F7/20 ,  G03F9/00 ,  H01L23/544

CPC classification number: G03F9/7003 ,  G03F7/70633 ,  G03F9/7076 ,  G03F9/708 ,  G03F9/7084 ,  H01L23/544 ,  H01L2223/5442 ,  H01L2223/54453 ,  H01L2924/0002 ,  Y10S438/975 ,  H01L2924/00

Abstract: An integrated circuit capable of operating despite a profile shift is disclosed. Overlay marks on the integrated circuit are surrounded by a trench that tends to relieve the effect of a profile shift caused by stress applied to the integrated circuit. The position of the overlay marks tends, therefore, not to be affected by the stress.

Abstract translation: 公开了尽管轮廓偏移的能够运行的集成电路。 集成电路上的覆盖标记被沟槽包围，该沟槽倾向于减轻由施加到集成电路的应力引起的轮廓移位的影响。 因此，覆盖标记的位置倾向于不受应力的影响。

公开(公告)号：US06908854B2

公开(公告)日：2005-06-21

申请号：US10715413

申请日：2003-11-19

Applicant: Ching-Yu Chang

Inventor： Ching-Yu Chang

IPC: H01L21/027 ,  H01L21/311 ,  H01L21/768 ,  H01L21/8246 ,  H01L27/112 ,  H01L21/4763

CPC classification number: H01L27/112 ,  H01L21/0273 ,  H01L21/31144 ,  H01L21/76807 ,  H01L21/76811 ,  H01L21/76825 ,  H01L27/11253 ,  Y10S438/948 ,  Y10S438/949

Abstract: A method of forming a dual-layer resist and application thereof. With respect to the method of forming a dual-layer resist, first, a patterned first resist layer is formed on a substrate. Next, the first resist layer is cured so that the first resist layer does not dissolve in a resist solvent. Finally, a patterned second resist layer is formed on the cured first resist layer. The method of forming a dual-layer resist can be applied to mask ROM coding, hole formation and a dual damascene structure.

Abstract translation: 一种形成双层抗蚀剂的方法及其应用。 关于形成双层抗蚀剂的方法，首先，在基板上形成图案化的第一抗蚀剂层。 接下来，使第一抗蚀剂层固化，使得第一抗蚀剂层不溶于抗蚀剂溶剂。 最后，在固化的第一抗蚀剂层上形成图案化的第二抗蚀剂层。 可以应用形成双层抗蚀剂的方法来掩蔽ROM编码，孔形成和双镶嵌结构。

公开(公告)号：US20050009345A1

公开(公告)日：2005-01-13

申请号：US10720735

申请日：2003-11-24

Applicant: Yu-Lin Yen ,  Ching-Yu Chang

Inventor： Yu-Lin Yen ,  Ching-Yu Chang

IPC: H01L21/00 ,  H01L21/027 ,  H01L21/033 ,  H01L21/302 ,  H01L21/461

CPC classification number: H01L21/0276 ,  H01L21/0332 ,  Y10S438/952

Abstract: A rework process of patterned photo-resist layer is provided. First, a substrate is provided with a first DARC, a first primer and a first patterned photo-resist layer being sequentially formed thereon. Next, remove the first patterned photo-resist layer and the first primer from the first DARC. After that, form a second DARC on the first DARC; form a second primer on the second DARC. Last, form a second patterned photo-resist layer on the second primer.

Abstract translation: 提供了图案化光刻胶层的返工工艺。 首先，在衬底上依次形成有第一DARC，第一底漆和第一图案化的光致抗蚀剂层。 接下来，从第一DARC去除第一图案化的光致抗蚀剂层和第一底漆。 之后，在第一个DARC上形成第二个DARC; 在第二个DARC上形成第二个引物。 最后，在第二底漆上形成第二图案的光致抗蚀剂层。