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公开(公告)号:US11696683B2
公开(公告)日:2023-07-11
申请号:US17173181
申请日:2021-02-10
Applicant: International Business Machines Corporation
Inventor: Bo Wen , Bing Dang , Jeffrey L. Rogers , Duixian Liu
IPC: A61B5/00
CPC classification number: A61B5/0024 , A61B5/0022 , A61B5/0028 , A61B5/6833 , A61B5/7225 , A61B2562/046
Abstract: A system for interfacing an in-body medical device with an external network includes a subdermal wideband on-body network (WON) hub, which in turn includes a hub rechargeable battery, a hub processor coupled to the hub rechargeable battery, a device interface configured to communicate with the in-body medical device, and coupled to the hub processor, and a hub-satellite near field communications wireless interface coupled to the hub processor. The system also includes a wearable WON server that in turn includes a server processor, a server-satellite interface coupled to the server processor, and an external network interface coupled to the server processor. The server processor implements a software controller; and a skin-mountable WON tethered satellite that includes a wired satellite-server interface, coupled to the wearable WON server, and a tethered satellite near-field communications (NFC) wireless interface, configured to communicate with the hub-satellite NFC wireless interface, and coupled to the wired satellite-server interface.
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公开(公告)号:US11574835B2
公开(公告)日:2023-02-07
申请号:US16670023
申请日:2019-10-31
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor: Bing Dang , Jeffrey D. Gelorme , John U. Knickerbocker
IPC: H01L21/683 , C08G59/06 , C09J163/00 , C09J171/00 , C08L63/00 , C08L71/00 , H01L21/02 , C08K3/04 , C09J9/00
Abstract: A bonding material including a phenoxy resin thermoplastic component, and a carbon black filler component. The carbon black filler component is present in an amount greater than 1 wt. %. The carbon black filler converts the phenoxy resin thermoplastic component from a material that transmits infra-red (IR) wavelengths to a material that absorbs a substantial portion of infra-red (IR) wavelengths.
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公开(公告)号:US20220406454A1
公开(公告)日:2022-12-22
申请号:US17304183
申请日:2021-06-16
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor: Bo Wen , Bing Dang , Vince Siu , Noel Christopher Codella , Erhan Bilal , Jeffrey L. Rogers
Abstract: A method, a structure, and a computer system for enabling telemedicine using printed devices. Exemplary embodiments may include receiving a design for a device and printing the device based on the design using a printer. The exemplary embodiments may further include combining the device with a smart device and utilizing the device to collect data during a telemedicine session administered on the smart device.
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公开(公告)号:US11424152B2
公开(公告)日:2022-08-23
申请号:US16779783
申请日:2020-02-03
Applicant: International Business Machines Corporation
Inventor: Paul S. Andry , Bing Dang , Jeffrey Donald Gelorme , Li-Wen Hung , John U. Knickerbocker , Cornelia Kang-I Tsang
IPC: H01L21/683 , H01L21/78
Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The release layer comprises at least one additive that adjusts a frequency of electro-magnetic radiation absorption property of the release layer. The additive comprises, for example, a 355 nm chemical absorber and/or chemical absorber for one of more wavelengths in a range comprising 600 nm to 740 nm. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.
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公开(公告)号:US20220200086A1
公开(公告)日:2022-06-23
申请号:US17128371
申请日:2020-12-21
Applicant: International Business Machines Corporation
Inventor: Qianwen Chen , Jae-Woong Nah , Bing Dang , Leanna Pancoast , John Knickerbocker
IPC: H01M50/171 , H01M10/0585 , H01M50/186 , H01M50/197 , H01M50/191
Abstract: A method of manufacturing a micro-battery is provided. The method includes forming a micro-battery device by forming a first metal anode via and a first metal cathode via in a first substrate, forming a first metal layer on a bottom side of the first substrate, forming a first battery element on a top side of the substrate, forming an encapsulation layer around the first battery element, forming trenches through the encapsulation layer and the first substrate on different sides of the first battery element, and forming a metal sealing layer in the trenches to cover at least a plurality of sidewall surfaces of the first battery element. The metal sealing layer is electrically connected to the battery element through the first metal layer and the first metal cathode via.
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公开(公告)号:US20210280834A1
公开(公告)日:2021-09-09
申请号:US16813071
申请日:2020-03-09
Applicant: International Business Machines Corporation
Inventor: Bing Dang , Leanna Pancoast , Jae-Woong Nah , John Knickerbocker
IPC: H01M2/02 , H01M10/052 , H01M2/30 , H01M10/04
Abstract: Microbatteries and methods for forming microbatteries are provided. The microbatteries and methods address at least one or both of edge sealing issues for edges of a stack forming part of a microbatteries and overall sealing for individual cells for microbatteries in a batch process. A transferable solder molding apparatus and sealing structure are proposed in an example to provide a metal casing for a solid-state thin-film microbattery. An exemplary proposed process involves deposition or pre-forming low-temperature solder casing separately from the microbatteries. Then a thermal compression may be used to transfer the solder casing to each battery cell, with a handler apparatus in a batch process in an example. These exemplary embodiments can address the temperature tolerance constrain for solid state thin film battery during handling, metal sealing, and packaging.
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公开(公告)号:US20210265606A1
公开(公告)日:2021-08-26
申请号:US16796636
申请日:2020-02-20
Applicant: International Business Machines Corporation
Inventor: Bing Dang , John Knickerbocker , Qianwen Chen
IPC: H01M2/02 , H01M2/20 , H01M10/0585
Abstract: Thin Film Batteries are made of battery layers. Each battery layer has a substrate with one or more battery structures on the substrate surface. The battery structures have a first electrode connection and a second electrode, a first electrode (e.g. a cathode or anode) is electrically connected to the first electrode connection and a second electrode (e.g. an anode or cathode) is electrically connected to the second electrode connection. An electrolyte is at least partial disposed between and electrically connected to the first and second electrodes. A first edge connection on one of the substrate edges is physically and electrically connected to the first electrode connection. A second edge connection on one of the substrate edges is physically and electrically connected to the second electrode connection. An electrically insulating lamination is disposed on the substrate and covers the components except for the first and second edge connections, connected to respective battery electrodes. A first stack external connection electrical connects two or more of the first edge connections and a second stack external connection electrical connects two or more of the second edge connections. A first and second battery pole are connected to the respective first and second stack external connections. The TFBs are hermetically sealed.
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公开(公告)号:US10964925B2
公开(公告)日:2021-03-30
申请号:US16283654
申请日:2019-02-22
Inventor: Bing Dang , Qianwen Chen , Yu Luo , John Knickerbocker , Jae-Woong Nah , Kai Liu , Po-wen Cheng , Tung-hsiu Shih , Mengnian Niu , Kai-wei Nieh
IPC: H01M2/06 , H01M2/30 , H01M10/0585 , H01M10/052
Abstract: Vertical via connections to a battery are hermetically sealed to prevent environmental factors (e.g. moisture, oxygen, and nitrogen) from entering the internals of the battery through porous conductive material filling the vias resulting in reduced battery performance and battery failure.
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公开(公告)号:US10679018B1
公开(公告)日:2020-06-09
申请号:US16268425
申请日:2019-02-05
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor: Rajeev Narayanan , Bing Dang , Bo Wen
Abstract: A magnetic tracking apparatus, method, system and computer program product for magnetically encoding pills are provided. A pill feeder includes a first valve controlling an opening of the pill feeder. A chamber is arranged in communication with an outlet of the pill feeder, and a second valve when closed retains the pill within the chamber, and when open communicates with a passageway for the pill to exit the chamber. A microcontroller is configured to control operation of the first valve and the second valve. A magnetic nano-particle applicator deposits bio-compatible nano-magnetic particles in a magnetic pattern onto a surface of the pill within the chamber. A system for detection of the pill includes a wearable patch or article including a magnetic reader to read the magnetic pattern on a coated pill when consumed by the patient.
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公开(公告)号:US10670656B2
公开(公告)日:2020-06-02
申请号:US15452933
申请日:2017-03-08
Applicant: International Business Machines Corporation
Inventor: Paul S. Andry , Qianwen Chen , Bing Dang , John U. Knickerbocker , Minhua Lu , Robert J. Polastre , Bucknell C. Webb
IPC: G01R31/309 , H05K3/30 , G01R31/28 , H05K1/02 , H05K1/18
Abstract: An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.
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