公开(公告)号：US20230187414A1

公开(公告)日：2023-06-15

申请号：US18105826

申请日：2023-02-04

Applicant: Monolithic 3D Inc.

Inventor： Zvi Or-Bach ,  Brian Cronquist

IPC: H01L25/065 ,  H01L21/768 ,  H01L23/48 ,  H01L23/485 ,  H01L23/522 ,  H01L27/06 ,  H01L29/66 ,  H01L21/74 ,  H01L25/00 ,  H01L23/00 ,  H01L27/088

CPC classification number: H01L25/0657 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/485 ,  H01L23/522 ,  H01L27/0688 ,  H01L29/66621 ,  H01L21/743 ,  H01L25/50 ,  H01L24/25 ,  H01L27/088 ,  H01L2924/12032 ,  H01L2924/13091 ,  H01L2924/351 ,  H01L2924/0002 ,  H01L27/092

Abstract: A semiconductor device, the device including: a first silicon layer including a first single crystal silicon; a first metal layer disposed over the first single crystal silicon layer; a second metal layer disposed over the first metal layer; a first level including a plurality of transistors, the first level disposed over the second metal layer, where the plurality of transistors include a second single crystal silicon; a third metal layer disposed over the first level; a fourth metal layer disposed over the third metal layer, where the fourth metal layer is aligned to the first metal layer with a less than 40 nm alignment error; and a via disposed through the first level, where the fourth metal layer provides a global power distribution, and where a typical thickness of the fourth metal layer is at least 50% greater than a typical thickness of the third metal.

公开(公告)号：US20230170244A1

公开(公告)日：2023-06-01

申请号：US18092337

申请日：2023-01-01

Applicant: Monolithic 3D Inc.

Inventor： Zvi Or-Bach ,  Brian Cronquist ,  Deepak C. Sekar

IPC: H01L21/683 ,  H01L21/74 ,  H01L21/762 ,  H01L21/768 ,  H01L21/822 ,  H01L21/8238 ,  H01L21/84 ,  H01L23/48 ,  H01L23/525 ,  H01L27/02 ,  H01L27/06 ,  H01L27/092 ,  H01L27/10 ,  H01L27/105 ,  H01L27/118 ,  H01L27/12 ,  H01L29/423 ,  H01L29/66 ,  H01L29/78 ,  H01L29/788 ,  H01L29/792 ,  G11C8/16 ,  H10B10/00 ,  H10B12/00 ,  H10B20/00 ,  H10B41/20 ,  H10B41/40 ,  H10B41/41 ,  H10B43/20 ,  H10B43/40

CPC classification number: H01L21/6835 ,  H01L21/743 ,  H01L21/76254 ,  H01L21/76898 ,  H01L21/8221 ,  H01L21/823828 ,  H01L21/84 ,  H01L23/481 ,  H01L23/5252 ,  H01L27/0207 ,  H01L27/0688 ,  H01L27/092 ,  H01L27/10 ,  H01L27/105 ,  H01L27/11807 ,  H01L27/11898 ,  H01L27/1203 ,  H01L29/4236 ,  H01L29/66272 ,  H01L29/66621 ,  H01L29/66825 ,  H01L29/66833 ,  H01L29/66901 ,  H01L29/78 ,  H01L29/7841 ,  H01L29/7843 ,  H01L29/7881 ,  H01L29/792 ,  G11C8/16 ,  H10B10/00 ,  H10B10/125 ,  H10B12/09 ,  H10B12/20 ,  H10B12/50 ,  H10B12/053 ,  H10B20/00 ,  H10B41/20 ,  H10B41/40 ,  H10B41/41 ,  H10B43/20 ,  H10B43/40 ,  H01L2924/13062 ,  H01L23/3677

Abstract: A 3D semiconductor device, the device comprising: a first level comprising a first single crystal layer, said first level comprising first transistors, wherein each of said first transistors comprises a single crystal channel; first metal layers interconnecting at least said first transistors; a second metal layer overlaying said first metal layers; and a second level comprising a second single crystal layer, said second level comprising second transistors, wherein said second level overlays said first level, wherein at least one of said first transistors controls power delivery for at least one of said second transistor, wherein said second level is directly bonded to said first level, and wherein said bonded comprises direct oxide to oxide bonds.

公开(公告)号：US11621249B2

公开(公告)日：2023-04-04

申请号：US17396646

申请日：2021-08-06

Applicant: Monolithic 3D Inc.

Inventor： Zvi Or-Bach ,  Jin-Woo Han ,  Brian Cronquist

IPC: H01L25/065 ,  H01L25/18 ,  H01L23/00 ,  H01L23/473 ,  H01L23/66 ,  H01L25/00

Abstract: A 3D semiconductor device, the device including: a first level; and a second level, where the first level includes single crystal silicon and a plurality of logic circuits, where the second level is disposed above the first level and includes a plurality of arrays of memory cells, where the single crystal silicon includes an area, and where the area is greater than 1,000 mm2.

公开(公告)号：US11621240B2

公开(公告)日：2023-04-04

申请号：US17949988

申请日：2022-09-21

Applicant: Monolithic 3D Inc.

Inventor： Zvi Or-Bach ,  Jin-Woo Han ,  Brian Cronquist

IPC: H01L23/00 ,  H01L25/065 ,  H01L25/18

Abstract: A semiconductor device, the device including: a first level including control circuits, where the control circuits include a plurality of first transistors and a plurality of metal layers; a memory level disposed on top of the first level, where the memory level includes an array of memory cells, where each of the memory cells include at least one second transistor, where the control circuits control the array of memory cells, where the first level is bonded to the memory level, where the bonded includes oxide to oxide bonding regions and a plurality of metal to metal bonding regions, and where at least one of the memory cells is disposed directly above at least one of the plurality of metal to metal bonding regions.

公开(公告)号：US11616004B1

公开(公告)日：2023-03-28

申请号：US18070422

申请日：2022-11-28

Applicant: Monolithic 3D Inc.

Inventor： Zvi Or-Bach ,  Deepak C. Sekar ,  Brian Cronquist

IPC: H01L23/48 ,  H01L27/06 ,  H01L27/088 ,  H01L27/11551 ,  H01L27/108 ,  H01L29/732 ,  H01L27/11526 ,  H01L27/118 ,  H01L29/10 ,  H01L29/808 ,  H01L27/11573 ,  H01L29/66 ,  H01L27/02 ,  H01L27/11578 ,  H01L29/78 ,  H01L21/74 ,  H01L23/544 ,  H01L23/34 ,  H01L23/50 ,  H01L27/24

Abstract: A 3D semiconductor device, the device including: a first level including a plurality of first metal layers; a second level, where the second level overlays the first level, where the second level includes at least one single crystal silicon layer, where the second level includes a plurality of transistors, where each transistor of the plurality of transistors includes a single crystal channel, where the second level includes a plurality of second metal layers, where the plurality of second metal layers include interconnections between the transistors of the plurality of transistors, where the second level is overlaid by a first isolation layer; and a connective path between the plurality of transistors and the plurality of first metal layers, where the connective path includes a via disposed through at least the single crystal silicon layer, and where at least one of the plurality of transistors includes a gate all around structure.

公开(公告)号：US11594526B2

公开(公告)日：2023-02-28

申请号：US17868776

申请日：2022-07-20

Applicant: Monolithic 3D Inc.

Inventor： Zvi Or-Bach ,  Deepak C. Sekar ,  Brian Cronquist

IPC: H01L25/075 ,  H01L33/16 ,  H01L33/30 ,  H01L33/62

Abstract: A multi-level semiconductor device, the device including: a first level including integrated circuits; a second level including a structure designed to conduct electromagnetic waves, where the second level is disposed above the first level, where the integrated circuits include single crystal transistors; and an oxide layer disposed between the first level and the second level, where the second level is bonded to the oxide layer, and where the bonded includes oxide to oxide bonds.

公开(公告)号：US11594473B2

公开(公告)日：2023-02-28

申请号：US17941891

申请日：2022-09-09

Applicant: Monolithic 3D Inc.

Inventor： Zvi Or-Bach ,  Deepak C. Sekar ,  Brian Cronquist

IPC: H01L23/48 ,  H01L27/06 ,  H01L27/088 ,  H01L27/11551 ,  H01L27/108 ,  H01L29/732 ,  H01L27/11526 ,  H01L27/118 ,  H01L29/10 ,  H01L29/808 ,  H01L27/11573 ,  H01L29/66 ,  H01L27/02 ,  H01L27/11578 ,  H01L29/78 ,  H01L21/74 ,  H01L23/544 ,  H01L23/34 ,  H01L23/50 ,  H01L27/24

Abstract: A 3D semiconductor device including: a first level including a single crystal silicon layer and a plurality of first transistors, the plurality of first transistors each including a single crystal channel; a first metal layer overlaying the plurality of first transistors; a second metal layer overlaying the first metal layer; a third metal layer overlaying the second metal layer; a second level is disposed above the third metal layer, where the second level includes a plurality of second transistors; a fourth metal layer disposed above the second level; and a connective path between the fourth metal layer and either the third metal layer or the second metal layer, where the connective path includes a via disposed through the second level, where the via has a diameter of less than 800 nm and greater than 5 nm, and where at least one of the plurality of second transistors includes a metal gate.

公开(公告)号：US20230056346A1

公开(公告)日：2023-02-23

申请号：US17898475

申请日：2022-08-29

Applicant: Monolithic 3D Inc.

Inventor： Deepak C. Sekar ,  Zvi Or-Bach

IPC: H01L27/24 ,  H01L21/268 ,  H01L21/683 ,  H01L21/762 ,  H01L21/822 ,  H01L21/84 ,  H01L27/06 ,  H01L27/108 ,  H01L27/11 ,  H01L27/11529 ,  H01L27/11551 ,  H01L27/11578 ,  H01L27/12 ,  H01L29/78 ,  H01L29/423 ,  H01L27/22

Abstract: A method for producing a 3D semiconductor device including: providing a first level, the first level including a first single crystal layer; forming first alignment marks and control circuits in and/or on the first level, where the control circuits include first single crystal transistors and at least two interconnection metal layers; forming at least one second level disposed above the control circuits; performing a first etch step into the second level; forming at least one third level disposed on top of the second level; performing additional processing steps to form first memory cells within the second level and second memory cells within the third level, where each of the first memory cells include at least one second transistor, where each of the second memory cells include at least one third transistor, performing bonding of the first level to the second level, where the bonding includes oxide to oxide bonding.

公开(公告)号：US11575038B1

公开(公告)日：2023-02-07

申请号：US17961565

申请日：2022-10-07

Applicant: Monolithic 3D Inc.

Inventor： Zvi Or-Bach

IPC: H01L29/78 ,  G11C16/02 ,  G11C11/404 ,  G11C11/4097 ,  H01L27/108 ,  H01L27/115 ,  H01L27/11 ,  H01L27/11578 ,  H01L27/24 ,  G11C11/412 ,  G11C16/04

Abstract: A 3D semiconductor device including: a first level including a first single crystal layer, the first level including a plurality of first transistors and at least one first metal layer, where the at least one first metal layer overlays the first single crystal layer, and where the at least one first metal layer includes interconnects between the first transistors forming first control circuits; a second metal layer overlaying the at least one first metal layer; a second level overlaying the second metal layer, the second level including a plurality of second transistors; a third level overlaying the second level, the third level including a plurality of third transistors, where the second level includes a plurality of first memory cells, the first memory cells each including at least one of the second transistors, where the third level includes second memory cells, the second memory cells each including third transistors.

公开(公告)号：US11574109B1

公开(公告)日：2023-02-07

申请号：US17953211

申请日：2022-09-26

Applicant: Monolithic 3D Inc.

Inventor： Zvi Or-Bach ,  Zeev Wurman

IPC: G06F30/392 ,  G06F30/394

Abstract: A method of designing a 3D Integrated Circuit including: partitioning at least one design into at least two levels, a first level and a second level, where the first level includes logic and the second level includes memory; and then obtaining a first placement of at least portion of the second level, where the first placement includes placement of a first memory array, where the Circuit includes a plurality of connections between the first level and the second level; and performing a second placement, where performing the second placement includes placing the first logic circuit based on the first placement of the first memory array, where the performing a second placement includes using a placer executed by a computer, where the placer is a part of a Computer Aided Design tool, and where the logic includes a first logic circuit configured to read data from the first memory array.