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公开(公告)号：US20210041182A1
公开(公告)日：2021-02-11
申请号：US16533235
申请日：2019-08-06
Applicant: Intel Corporation
Inventor： Feras Eid , Telesphor Kamgaing , Georgios Dogiamis , Aleksandar Aleksov , Johanna M. Swan
IPC: F28D15/04 , H01L23/367 , H01L23/38 , H01L23/427
Abstract: Disclosed herein are structures and assemblies that may be used for thermal management in integrated circuit (IC) packages.
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公开(公告)号：US10910305B2
公开(公告)日：2021-02-02
申请号：US16464972
申请日：2016-12-30
Applicant: Intel Corporation
Inventor： Telesphor Kamgaing , Georgios C. Dogiamis , Sasha N. Oster
IPC: H01L23/64 , H01L23/522 , H01G4/33 , H01G4/38 , H01L23/488 , H01L23/50 , H01L23/00 , H01L49/02 , H05K1/16
Abstract: Embodiments of the invention include a microelectronic device that includes a substrate having transistor layers and interconnect layers including conductive layers to form connections to transistor layers. A capacitive bump is disposed on the interconnect layers. The capacitive bump includes a first electrode, a dielectric layer, and a second electrode. In another example, an inductive bump is disposed on the interconnect layers. The inductive bump includes a conductor and a magnetic layer that surrounds the conductor.
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公开(公告)号：US10903818B2
公开(公告)日：2021-01-26
申请号：US15089001
申请日：2016-04-01
Applicant: Intel Corporation
Inventor： Vijay K. Nair , Feras Eid , Adel A. Elsherbini , Telesphor Kamgaing , Georgios C. Dogiamis , Valluri R. Rao , Johanna M. Swan
Abstract: Embodiments of the invention include a piezoelectric package integrated filtering device that includes a film stack. In one example, the film stack includes a first electrode, a piezoelectric material in contact with the first electrode, and a second electrode in contact with the piezoelectric material. The film stack is suspended with respect to a cavity of an organic substrate having organic material and the film stack generates an acoustic wave to be propagated across the film stack in response to an application of an electrical signal between the first and second electrodes.
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公开(公告)号：US10886606B2
公开(公告)日：2021-01-05
申请号：US16464678
申请日：2016-12-30
Applicant: Intel Corporation
Inventor： Telesphor Kamgaing , Sasha N. Oster , Georgios C. Dogiamis
IPC: H01Q1/38 , H01Q21/00 , H01Q1/24 , H01Q21/22 , H01L23/66 , H01L23/522 , H01Q9/04 , H01Q19/22 , H01L23/498 , H01Q1/22 , H01Q21/06
Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having organic dielectric material, conductive layers, and a first portion of a distributed antenna unit. The first substrate supports at least one radio frequency (RF) component. A second substrate is coupled to the first substrate. The second substrate is integrated with a housing of the microelectronic device and includes a second portion of the distributed antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.
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公开(公告)号：US10852495B2
公开(公告)日：2020-12-01
申请号：US15746792
申请日：2015-09-25
Applicant: Intel Corporation
Inventor： Shawna Liff , Adel A. Elsherbini , Telesphor Kamgaing , Sasha N. Oster , Gaurav Chawla
Abstract: Microelectronic package communication is described using radio interfaces connected through wiring. One example includes a system board, an integrated circuit chip, and a package substrate mounted to the system board to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components. A radio on the package substrate is coupled to the integrated circuit chip to modulate the data onto a carrier and to transmit the modulated data. A radio on the system board receives the transmitted modulated data and demodulates the received data, and a cable interface is coupled to the system board radio to couple the received demodulated data to a cable.
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Patent Agency Ranking
公开(公告)号：US20200304215A1
公开(公告)日：2020-09-24
申请号：US16893660
申请日：2020-06-05
Applicant: Intel Corporation
Inventor： Diego Correas-Serrano , Georgios Dogiamis , Henning Braunisch , Neelam Prabhu-Gaunkar , Telesphor Kamgaing , Thomas W. Brown , Stefano Pellerano
Abstract: Embodiments may relate to a communications module comprising with a dispersion compensation module communicatively coupled between a baseband module and a radio frequency (RF) module. The dispersion compensation module may be configured to process a data signal at an intermediate frequency that is between a baseband frequency and a RF frequency. Other embodiments may be described or claimed.
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公开(公告)号：US20200303329A1
公开(公告)日：2020-09-24
申请号：US16397718
申请日：2019-04-29
Applicant: Intel Corporation
Inventor： Adel A. Elsherbini , Georgios Dogiamis , Telesphor Kamgaing , Henning Braunisch , Johanna M. Swan , Shawna M. Liff , Aleksandar Aleksov
Abstract: Embodiments may relate to a microelectronic package that includes a radio frequency (RF) chip coupled with a die by interconnects with a first pitch. The RF chip may further be coupled with a waveguide of a package substrate by interconnects with a second pitch that is different than the first pitch. The RF chip may facilitate conveyance of data to the waveguide as an electromagnetic signal with a frequency greater than approximately 20 gigahertz (GHz). Other embodiments may be described or claimed.
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公开(公告)号：US20200236205A1
公开(公告)日：2020-07-23
申请号：US16843791
申请日：2020-04-08
Applicant: Intel Corporation
Inventor： Telesphor Kamgaing , Georgios Dogiamis , Vijay K. Nair
IPC: H04M1/02 , H01Q1/38 , G06F1/16 , H01Q9/04 , H01Q21/00 , H01Q23/00 , H01Q25/00 , H01Q1/40 , H01Q21/28 , H01Q1/24 , H01Q21/22
Abstract: Embodiments of the invention include a microelectronic device that includes a die having at least one transceiver unit, a redistribution package coupled to the die, and a substrate coupled to the redistribution package. The substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.
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179.发明授权公开(公告)号：US10476545B2
公开(公告)日：2019-11-12
申请号：US15745980
申请日：2015-09-25
Applicant: Intel Corporation
Inventor： Adel A. Elsherbini , Telesphor Kamgaing , Sasha N. Oster , Brandon M. Rawlings , Georgios C. Dogiamis
Abstract: Communication is described between integrated circuit packages using a millimeter-wave wireless radio fabric. In one example a first package has a radio transceiver to communicate with a radio transceiver of a second package. The second package has a radio transceiver to communicate with the radio transceiver of the first package. A switch communicates with the first package and the second package to establish a connection through the respective radio transceivers between the first package and the second package. A system board carries the first package, the second package, and the switch.
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公开(公告)号：US10461388B2
公开(公告)日：2019-10-29
申请号：US15394990
申请日：2016-12-30
Applicant: INTEL CORPORATION
Inventor： Telesphor Kamgaing , Georgios C. Dogiamis , Sasha N. Oster
Abstract: Radio frequency (RF) data transfer between components in rack mounted systems is facilitated through the use of dielectric waveguides and millimeter Wave (mm-Wave) transceivers. A signal generator provides one or more data signals to a serializer/deserializer (SERDES) which serializes a plurality of parallel data signals to produce a single, serialized, signal containing data from each of the input signals to the SERDES. A mm-Wave die upconverts the serialized signal to a mm-Wave signal and a mm-Wave launcher launches the signal into the dielectric waveguide. At the receiving end the process is reversed such that the mm-Wave signal is first downconverted and passed through a SERDES to provide the original one or more signals to a recipient signal generator. Some or all of the components may be formed directly in the semiconductor package.
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