公开(公告)号：US08311758B2

公开(公告)日：2012-11-13

申请号：US11335056

申请日：2006-01-18

Applicant: Richard James Casler, Jr. ,  Fenglei Du ,  Stephen Craig Fullerton

Inventor： Richard James Casler, Jr. ,  Fenglei Du ,  Stephen Craig Fullerton

IPC: G01C3/00

CPC classification number: G05B13/048 ,  G01R31/2891 ,  H01L22/20

Abstract: An improved method and apparatus for automatically aligning probe pins to the test or bond pads of semiconductor devices under changing conditions. In at least one embodiment, a dynamic model is used to predict an impact of changing conditions to wafer probing process. This reduces the need for frequent measurements and calibrations during probing and testing, thereby increasing the number of dice that can be probed and tested in a given period of time and increasing the accuracy of probing at the same time. Embodiments of the present invention also make it possible to adjust positions of probe pins and pads in response to the changing conditions while they are in contact with each other.

Abstract translation: 一种改进的方法和装置，用于在变化的条件下将探针引脚自动对准半导体器件的测试或接合焊盘。 在至少一个实施例中，使用动态模型来预测改变条件对晶片探测过程的影响。 这减少了在探测和测试期间频繁测量和校准的需要，从而增加了在给定时间段内可以探测和测试的骰子的数量，同时提高了探测的准确性。 本发明的实施例还使得可以在彼此接触的同时响应于变化条件来调整探针和焊盘的位置。

公开(公告)号：US20120242363A1

公开(公告)日：2012-09-27

申请号：US13288925

申请日：2011-11-03

Applicant: Keith J. Breinlinger ,  Benjamin N. Eldridge ,  Eric D. Hobbs ,  Michael J. Armstrong ,  John K. Gritters

Inventor： Keith J. Breinlinger ,  Benjamin N. Eldridge ,  Eric D. Hobbs ,  Michael J. Armstrong ,  John K. Gritters

IPC: G01R1/067 ,  H01R43/16 ,  H01R24/66 ,  G01R31/26 ,  H01R24/00 ,  H01R13/02

CPC classification number: G01R1/06716 ,  G01R1/06733 ,  G01R1/07357 ,  H01R13/2407 ,  H01R43/16 ,  Y10T29/49204

Abstract: An electrically conductive contact element can include a first base and a second base with elongate, spaced apart leaves between the bases. A first end of each leaf can be coupled to the first base and an opposite second end of the leaf can be coupled to the second base. A body of the leaf between the first end and the second end can be sufficiently elongate to respond to a force through said contact element substantially parallel with the first axis and the second axis by first compressing axially while said force is less than a buckling force and then bending while said force is greater than the buckling force.

Abstract translation: 导电接触元件可以包括第一基部和在基部之间具有细长间隔开的叶片的第二基部。 每个叶片的第一端可以联接到第一基部，并且叶片的相对的第二端可以联接到第二基部。 在第一端和第二端之间的叶片的主体可以是足够伸长的，以响应于通过所述接触元件的力，所述力通过在所述力小于屈曲力的同时第一轴向压缩而基本上平行于第一轴线和第二轴线，并且 然后在所述力大于屈曲力时弯曲。

公开(公告)号：US08269514B2

公开(公告)日：2012-09-18

申请号：US12547454

申请日：2009-08-25

Applicant: Eric D. Hobbs ,  Gaetan L. Mathieu ,  Frank M. Zalar

Inventor： Eric D. Hobbs ,  Gaetan L. Mathieu ,  Frank M. Zalar

IPC: G01R31/20

CPC classification number: G01R1/06761 ,  G01R31/2863

Abstract: Embodiments of the present invention can relate to probe card assemblies, multilayer support substrates for use therein, and methods of designing multilayer support substrates for use in probe card assemblies. In some embodiments, a probe card assembly may include a multilayer support substrate engineered to substantially match thermal expansion of a reference material over a desired temperature range; and a probe substrate coupled to the multilayer support substrate. In some embodiments, the reference material may be silicon.

Abstract translation: 本发明的实施例可以涉及用于其中的探针卡组件，多层支撑衬底以及设计用于探针卡组件的多层支撑衬底的方法。 在一些实施例中，探针卡组件可以包括被设计成基本匹配参考材料在所需温度范围内的热膨胀的多层支撑衬底; 以及耦合到多层支撑衬底的探针衬底。 在一些实施例中，参考材料可以是硅。

公开(公告)号：US08203352B2

公开(公告)日：2012-06-19

申请号：US12861984

申请日：2010-08-24

Applicant: Li Fan ,  John K. Gritters

Inventor： Li Fan ,  John K. Gritters

IPC: G01R31/00 ,  G01R1/067

CPC classification number: G01R1/07342 ,  G01R1/06727 ,  G01R1/07378 ,  G01R31/31905

Abstract: A probe group can include multiple probes for testing devices having contact pads. The probes can comprise beams, contact tip structures, and mounting portions. The beams can provide for controlled deflection of the probes. The contact tip structures can be connected to the beams and can include contact portions for contacting with the devices. The mounting portions of the beams can be attached to support structures, which can be arranged in a staggered pattern. The beams located in a first row of the staggered pattern can include narrowing regions that lie substantially in line with the mounting portions of a second row of the beams.

Abstract translation: 探针组可以包括用于测试具有接触垫的设备的多个探针。 探针可以包括梁，接触尖端结构和安装部分。 梁可以提供探头的可控偏转。 接触尖端结构可以连接到梁，并且可以包括用于与装置接触的接触部分。 梁的安装部分可以附接到可以以交错图案布置的支撑结构。 位于交错图案的第一行中的光束可以包括基本上与第二排光束的安装部分成一直线的变窄区域。

公开(公告)号：US08015536B2

公开(公告)日：2011-09-06

申请号：US12259779

申请日：2008-10-28

Applicant: Mac Stevens

Inventor： Mac Stevens

IPC: G06F17/50

CPC classification number: G06F17/5077

Abstract: Traces routed through a computer depiction of a routing area of an electronics system comprise a plurality of connected nodes. Forces are assigned to the nodes, and the nodes are moved in accordance with the forces. The forces may be based on such things as the proximity of the nodes to each other and to obstacles in the routing area. This tends to smooth, straighten and/or shorten the traces, and may also tend to correct design rule violations.

Abstract translation: 通过电子系统的路由区域的计算机描绘路由的跟踪包括多个连接的节点。 力被分配给节点，并且节点根据力被移动。 力可以基于诸如节点彼此接近以及路由区域中的障碍物等事情。 这倾向于平滑，拉直和/或缩短痕迹，并且还可能倾向于纠正设计规则违规。

公开(公告)号：US08011089B2

公开(公告)日：2011-09-06

申请号：US12546924

申请日：2009-08-25

Applicant: Mohammad Eslamy ,  David V. Pedersen ,  Harry D. Cobb

Inventor： Mohammad Eslamy ,  David V. Pedersen ,  Harry D. Cobb

IPC: H01R9/00

CPC classification number: G01R31/2886 ,  G01R3/00 ,  Y10T29/49004 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49171 ,  Y10T29/49178 ,  Y10T29/49204 ,  Y10T29/4921 ,  Y10T29/49211

Abstract: A method of fabricating a large area, multi-element contactor. A segmented contactor is provided for testing semiconductor devices on a wafer that comprises a plurality of contactor units mounted to a substrate. The contactor units are formed, tested, and assembled to a backing substrate. The contactor units may include leads extending laterally for connection to an external instrument such as a burn-in board. The contactor units include conductive areas such as pads that are placed into contact with conductive terminals on devices under test.

Abstract translation: 一种制造大面积多元件接触器的方法。 提供分段接触器用于测试晶片上的半导体器件，其包括安装到衬底的多个接触器单元。 接触器单元被形成，测试和组装到背衬基板上。 接触器单元可以包括横向延伸的引线以连接到诸如老化板的外部仪器。 接触器单元包括诸如焊盘的导电区域，其被放置成与被测器件上的导电端子接触。

公开(公告)号：US07977958B2

公开(公告)日：2011-07-12

申请号：US11846446

申请日：2007-08-28

Applicant: Charles A. Miller

Inventor： Charles A. Miller

IPC: G01R31/20

CPC classification number: G01R31/2889 ,  G01R31/31713

Abstract: An emitter follower or source follower transistor is provided in the channel of a wafer test system between a DUT and a test system controller to enable a low power DUT to drive a test system channel. A bypass resistor is included between the base and emitter of the emitter follower transistor to enable bi-directional signals to be provided between the DUT channel and test system controller, as well as to enable parametric tests to be performed. The emitter follower transistor and bypass resistor can be provided on the probe card, with a pull down termination circuit included in the test system controller. The test system controller can provide compensation for the base to emitter voltage drop of the emitter follower transistor.

Abstract translation: 在DUT和测试系统控制器之间的晶片测试系统的通道中提供射极跟随器或源极跟随器晶体管，以使低功率DUT能够驱动测试系统通道。 在射极跟随器晶体管的基极和发射极之间包括一个旁路电阻，以便能够在DUT通道和测试系统控制器之间提供双向信号，以及执行参数测试。 射极跟随器晶体管和旁路电阻可以在探针卡上提供，测试系统控制器中包含一个下拉终端电路。 测试系统控制器可以为射极跟随器晶体管的基极到发射极电压降提供补偿。

公开(公告)号：US07977956B2

公开(公告)日：2011-07-12

申请号：US12431271

申请日：2009-04-28

Applicant: Keith J. Breinlinger ,  Benjamin N. Eldridge ,  Eric D. Hobbs ,  Douglas S. Ondricek

Inventor： Keith J. Breinlinger ,  Benjamin N. Eldridge ,  Eric D. Hobbs ,  Douglas S. Ondricek

IPC: G01R31/00 ,  G01R31/20

CPC classification number: G01R31/2891

Abstract: Embodiments of methods and apparatus for aligning a probe card assembly in a test system are provided herein. In some embodiments, an apparatus for testing devices may include a probe card assembly having a plurality of probes, each probe having a tip for contacting a device to be tested, and having an identified set of one or more features that are preselected in accordance with selected criteria for aligning the probe card assembly within a prober after installation therein. In some embodiments, the identity of the identified set of one or more features may be communicated to the prober to facilitate a global alignment of the probe card assembly that minimizes an aggregate misalignment of all of the tips in the probe card assembly.

Abstract translation: 本文提供了在测试系统中对准探针卡组件的方法和装置的实施例。 在一些实施例中，用于测试装置的装置可以包括具有多个探针的探针卡组件，每个探针具有用于接触要测试的装置的尖端，并且具有根据本发明的预选的一组或多个特征 在探针卡组件安装在其中之后将探针卡组件对准的选择标准。 在一些实施例中，所识别的一个或多个特征集合的身份可以被传送到探测器，以促进探针卡组件的全局对准，其最小化探针卡组件中的所有尖端的聚集失准。

公开(公告)号：US07920989B2

公开(公告)日：2011-04-05

申请号：US12611525

申请日：2009-11-03

Applicant: Igor Y. Khandros ,  Benjamin N. Eldridge

Inventor： Igor Y. Khandros ,  Benjamin N. Eldridge

IPC: G01R31/00 ,  G06F19/00

CPC classification number: G01R31/2884 ,  G01R31/3025 ,  G01R31/31907

Abstract: A central test facility transmits wirelessly test data to a local test facility, which tests electronic devices using the test data. The local test facility transmits wirelessly response data generated by the electronic devices back to the central test facility, which analyzes the response data to determine which electronic devices passed the testing. The central test facility may provide the results of the testing to other entities, such as a design facility where the electronic devices were designed or a manufacturing facility where the electronic devices where manufactured. The central test facility may accept requests for test resources from any of a number of local test facilities, schedule test times corresponding to each test request, and at a scheduled test time, wirelessly transmits test data to a corresponding local test facility.

Abstract translation: 中央测试设备将无线测试数据传输到本地测试设备，该测试设备使用测试数据测试电子设备。 本地测试设备将由电子设备生成的无线响应数据发送回中央测试设备，分析响应数据以确定哪些电子设备通过测试。 中央测试设备可以向其他实体提供测试结果，例如设计电子设备的设计设施或其中制造的电子设备的制造设施。 中央测试设备可以接受来自任何本地测试设施的测试资源的请求，对应于每个测试请求的调度测试时间，并且在预定的测试时间，将测试数据无线地传输到相应的本地测试设施。

公开(公告)号：US20110067231A1

公开(公告)日：2011-03-24

申请号：US12952440

申请日：2010-11-23

Applicant: Tae Ma Kim

Inventor： Tae Ma Kim

IPC: B23P19/00

CPC classification number: G01R1/07342 ,  G01R1/06727 ,  G01R3/00 ,  Y10T29/49117 ,  Y10T29/49149 ,  Y10T29/49718 ,  Y10T29/49726 ,  Y10T29/4973 ,  Y10T29/53174 ,  Y10T428/20

Abstract: An electrical element can be attached and electrically connected to a substrate by a conductive adhesive material. The conductive adhesive material can electrically connect the electrical element to a terminal or other electrical conductor on the substrate. The conductive adhesive material can be cured by directing a flow of heated gas onto the material or by heating the material through a support structure on which the substrate is located. A non-conductive adhesive material can attach the electrical element to the substrate with a greater adhesive strength than the conductive adhesive. The non-conductive adhesive material can also be cured by directing a flow of heated gas onto the material or by heating the material through the support structure on which the substrate is located. The non-conductive adhesive material can cover the conductive adhesive material.

Abstract translation: 电气元件可以通过导电粘合剂材料附接和电连接到基底。 导电粘合剂材料可以将电气元件电连接到基板上的端子或其他电导体。 导电粘合剂材料可以通过将加热的气体流引导到材料上或通过加热材料通过其上放置有基底的支撑结构来固化。 非导电粘合剂材料可以以比导电粘合剂更大的粘合强度将电元件附接到基底。 不导电粘合剂材料也可以通过将加热气体流引导到材料上或通过加热材料通过其上放置有基底的支撑结构来固化。 非导电粘合剂材料可以覆盖导电粘合剂材料。