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公开(公告)号：US20120242363A1
公开(公告)日：2012-09-27
申请号：US13288925
申请日：2011-11-03
申请人： Keith J. Breinlinger , Benjamin N. Eldridge , Eric D. Hobbs , Michael J. Armstrong , John K. Gritters
发明人： Keith J. Breinlinger , Benjamin N. Eldridge , Eric D. Hobbs , Michael J. Armstrong , John K. Gritters
CPC分类号： G01R1/06716 , G01R1/06733 , G01R1/07357 , H01R13/2407 , H01R43/16 , Y10T29/49204
摘要： An electrically conductive contact element can include a first base and a second base with elongate, spaced apart leaves between the bases. A first end of each leaf can be coupled to the first base and an opposite second end of the leaf can be coupled to the second base. A body of the leaf between the first end and the second end can be sufficiently elongate to respond to a force through said contact element substantially parallel with the first axis and the second axis by first compressing axially while said force is less than a buckling force and then bending while said force is greater than the buckling force.
摘要翻译： 导电接触元件可以包括第一基部和在基部之间具有细长间隔开的叶片的第二基部。 每个叶片的第一端可以联接到第一基部，并且叶片的相对的第二端可以联接到第二基部。 在第一端和第二端之间的叶片的主体可以是足够伸长的，以响应于通过所述接触元件的力，所述力通过在所述力小于屈曲力的同时第一轴向压缩而基本上平行于第一轴线和第二轴线，并且 然后在所述力大于屈曲力时弯曲。
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公开(公告)号：US09702904B2
公开(公告)日：2017-07-11
申请号：US13288925
申请日：2011-11-03
申请人： Keith J. Breinlinger , Benjamin N. Eldridge , Eric D. Hobbs , Michael J. Armstrong , John K. Gritters
发明人： Keith J. Breinlinger , Benjamin N. Eldridge , Eric D. Hobbs , Michael J. Armstrong , John K. Gritters
CPC分类号： G01R1/06716 , G01R1/06733 , G01R1/07357 , H01R13/2407 , H01R43/16 , Y10T29/49204
摘要： An electrically conductive contact element can include a first base and a second base with elongate, spaced apart leaves between the bases. A first end of each leaf can be coupled to the first base and an opposite second end of the leaf can be coupled to the second base. A body of the leaf between the first end and the second end can be sufficiently elongate to respond to a force through said contact element substantially parallel with the first axis and the second axis by first compressing axially while said force is less than a buckling force and then bending while said force is greater than the buckling force.
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公开(公告)号：US07622935B2
公开(公告)日：2009-11-24
申请号：US11551545
申请日：2006-10-20
申请人： Eric D. Hobbs , Alexander H. Slocum , Benjamin N. Eldridge , Keith J. Breinlinger , Shawn Powell
发明人： Eric D. Hobbs , Alexander H. Slocum , Benjamin N. Eldridge , Keith J. Breinlinger , Shawn Powell
CPC分类号： G01R31/2893
摘要： A probe card assembly can comprise a probe head assembly and a wiring substrate. The probe head assembly can comprise a plurality of probes disposed to contact an electronic device disposed on a holder in a test housing. The wiring substrate can include an electrical interface to a test controller and a plurality of electrical wiring composing electrical paths between the electrical interface and ones of the probes, and the wiring substrate can comprise a first portion on which the electrical interface is disposed and a second portion composing the probe head assembly. The second portion of the wiring substrate can be moveable with respect to the first portion of the wiring substrate.
摘要翻译： 探针卡组件可以包括探针头组件和布线衬底。 探针头组件可以包括多个探针，其设置成接触设置在测试壳体中的保持器上的电子设备。 布线基板可以包括与测试控制器的电接口以及构成电接口和探针之间的电气路径的多个电线，并且布线基板可以包括其上设置有电接口的第一部分和第二部分 组成探头组件的部分。 布线基板的第二部分能够相对于布线基板的第一部分移动。
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公开(公告)号：US07977956B2
公开(公告)日：2011-07-12
申请号：US12431271
申请日：2009-04-28
CPC分类号： G01R31/2891
摘要： Embodiments of methods and apparatus for aligning a probe card assembly in a test system are provided herein. In some embodiments, an apparatus for testing devices may include a probe card assembly having a plurality of probes, each probe having a tip for contacting a device to be tested, and having an identified set of one or more features that are preselected in accordance with selected criteria for aligning the probe card assembly within a prober after installation therein. In some embodiments, the identity of the identified set of one or more features may be communicated to the prober to facilitate a global alignment of the probe card assembly that minimizes an aggregate misalignment of all of the tips in the probe card assembly.
摘要翻译： 本文提供了在测试系统中对准探针卡组件的方法和装置的实施例。 在一些实施例中，用于测试装置的装置可以包括具有多个探针的探针卡组件，每个探针具有用于接触要测试的装置的尖端，并且具有根据本发明的预选的一组或多个特征 在探针卡组件安装在其中之后将探针卡组件对准的选择标准。 在一些实施例中，所识别的一个或多个特征集合的身份可以被传送到探测器，以促进探针卡组件的全局对准，其最小化探针卡组件中的所有尖端的聚集失准。
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公开(公告)号：US20100271062A1
公开(公告)日：2010-10-28
申请号：US12431271
申请日：2009-04-28
IPC分类号： G01R31/02
CPC分类号： G01R31/2891
摘要： Embodiments of methods and apparatus for aligning a probe card assembly in a test system are provided herein. In some embodiments, an apparatus for testing devices may include a probe card assembly having a plurality of probes, each probe having a tip for contacting a device to be tested, and having an identified set of one or more features that are preselected in accordance with selected criteria for aligning the probe card assembly within a prober after installation therein. In some embodiments, the identity of the identified set of one or more features may be communicated to the prober to facilitate a global alignment of the probe card assembly that minimizes an aggregate misalignment of all of the tips in the probe card assembly
摘要翻译： 本文提供了在测试系统中对准探针卡组件的方法和装置的实施例。 在一些实施例中，用于测试装置的装置可以包括具有多个探针的探针卡组件，每个探针具有用于接触要测试的装置的尖端，并且具有根据本发明的预选的一组或多个特征 在探针卡组件安装在其中之后将探针卡组件对准的选择标准。 在一些实施例中，所识别的一组一个或多个特征的身份可以被传送到探测器，以促进探针卡组件的全局对准，其最小化探针卡组件中的所有尖端的聚集失准
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公开(公告)号：US20110156735A1
公开(公告)日：2011-06-30
申请号：US12979200
申请日：2010-12-27
IPC分类号： G01R31/00
CPC分类号： G01R1/0491 , G01R31/3025
摘要： Wafer cassette systems and methods of using wafer cassette systems. A wafer cassette system can include a base and a probe card assembly. The base and the probe card assembly can each include complementary interlocking alignment elements. The alignment elements can constrain relative movement of the base and probe card assembly in directions parallel to a wafer receiving surface of the base, while permitting relative movement in a direction perpendicular to the receiving surface.
摘要翻译： 晶圆盒系统和使用晶片盒系统的方法。 晶片盒系统可以包括基座和探针卡组件。 基座和探针卡组件可以各自包括互补的互锁对准元件。 对准元件可以约束基部和探针卡组件在平行于基部的晶片接收表面的方向上的相对运动，同时允许在垂直于接收表面的方向上的相对运动。
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公开(公告)号：US20110156734A1
公开(公告)日：2011-06-30
申请号：US12979159
申请日：2010-12-27
申请人： Tommie E. Berry , Keith J. Breinlinger , Eric D. Hobbs , Marc Loranger , Alexander H. Slocum , Adrian S. Wilson
发明人： Tommie E. Berry , Keith J. Breinlinger , Eric D. Hobbs , Marc Loranger , Alexander H. Slocum , Adrian S. Wilson
IPC分类号： G01R31/00
CPC分类号： G01R31/2891
摘要： Devices under test (DUTs) can be tested in a test system that includes an aligner and test cells. A DUT can be moved into and clamped in an aligned position on a carrier in the aligner. In the align position, electrically conductive terminals of the DUT can be in a predetermined position with respect to carrier alignment features of the carrier. The DUT/carrier combination can then be moved from the aligner into one of the test cells, where alignment features of the carrier are mechanically coupled with alignment features of a contactor in the test cell. The mechanical coupling automatically aligns terminals of the DUT with probes of the contactor. The probes thus contact and make electrical connections with the terminals of the DUT. The DUT is then tested. The aligner and each of the test cells can be separate and independent devices so that a DUT can be aligned in the aligner while other DUTs, having previously been aligned to a carrier in the aligner, are tested in a test cell.
摘要翻译： 被测设备（DUT）可以在包括对准器和测试单元的测试系统中进行测试。 DUT可以被移动并被夹持在对准器中的载体上的对准位置。 在对准位置，DUT的导电端子可以相对于载体的载体对准特征处于预定位置。 然后可以将DUT /载体组合从对准器移动到测试单元之一中，其中载体的对准特征与测试单元中的接触器的对准特征机械耦合。 机械联轴器将DUT的端子自动对准接触器的探头。 探头因此与DUT的端子接触并进行电气连接。 然后测试DUT。 对准器和每个测试单元可以是分离和独立的器件，使得DUT可以在对准器中对准，而在测试单元中测试已经与对准器中的载体对准的其它DUT。
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8.发明授权公开(公告)号：US07960989B2
公开(公告)日：2011-06-14
申请号：US12478117
申请日：2009-06-04
CPC分类号： G01R31/2889
摘要： A stiffener structure, a wiring substrate, and a frame having a major surface disposed in a stack can be part of a probe card assembly. The wiring substrate can be disposed between the frame and the stiffener structure, and probe substrates can be coupled to the frame by one or more non-adjustably fixed coupling mechanisms. Each of the probe substrates can have probes that are electrically connected through the probe card assembly to an electrical interface on the wiring substrate to a test controller. The non-adjustably fixed coupling mechanisms can be simultaneously stiff in a first direction perpendicular to the major surface and flexible in a second direction generally parallel to the major surface.
摘要翻译： 加强结构，布线基板和具有设置在堆叠中的主表面的框架可以是探针卡组件的一部分。 布线基板可以设置在框架和加强件结构之间，并且探针基板可以通过一个或多个不可调节地固定的联接机构联接到框架。 每个探针基板可以具有通过探针卡组件电连接到布线基板上的电接口到测试控制器的探针。 不可调节固定的联接机构可以在垂直于主表面的第一方向上同时刚性，并且在大致平行于主表面的第二方向上是柔性的。
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9.发明申请公开(公告)号：US20100134127A1
公开(公告)日：2010-06-03
申请号：US12478117
申请日：2009-06-04
IPC分类号： G01R31/02
CPC分类号： G01R31/2889
摘要： A stiffener structure, a wiring substrate, and a frame having a major surface disposed in a stack can be part of a probe card assembly. The wiring substrate can be disposed between the frame and the stiffener structure, and probe substrates can be coupled to the frame by one or more non-adjustably fixed coupling mechanisms. Each of the probe substrates can have probes that are electrically connected through the probe card assembly to an electrical interface on the wiring substrate to a test controller. The non-adjustably fixed coupling mechanisms can be simultaneously stiff in a first direction perpendicular to the major surface and flexible in a second direction generally parallel to the major surface.
摘要翻译： 加强结构，布线基板和具有设置在堆叠中的主表面的框架可以是探针卡组件的一部分。 布线基板可以设置在框架和加强件结构之间，并且探针基板可以通过一个或多个不可调节地固定的联接机构联接到框架。 每个探针基板可以具有通过探针卡组件电连接到布线基板上的电接口到测试控制器的探针。 不可调节固定的联接机构可以在垂直于主表面的第一方向上同时刚性，并且在大致平行于主表面的第二方向上是柔性的。
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10.发明授权Apparatus and method for adjusting thermally induced movement of electro-mechanical assemblies 有权用于调节机电组件的热诱导运动的装置和方法公开(公告)号：US07688063B2
公开(公告)日：2010-03-30
申请号：US12165325
申请日：2008-06-30
IPC分类号： G01R31/02
CPC分类号： G01R1/44 , G01R1/07307 , G01R31/2891
摘要： A thermal adjustment apparatus for adjusting one or more thermally induced movements of an electro-mechanical assembly includes: a compensating element expanding at a first rate different from a second rate at which the electro-mechanical assembly expands for generating a counteracting force in response to changes in temperature; and a coupling mechanism coupling the compensating element to the electro-mechanical assembly, and being adjustable to control an amount of the counteracting force applied to the electro-mechanical assembly as temperature changes.
摘要翻译： 一种用于调节机电组件的一个或多个热诱导运动的热调节装置包括：补偿元件以不同于机电组件膨胀的第二速率的第一速率膨胀以产生响应于变化的反作用力 温度; 以及将补偿元件耦合到机电组件的耦合机构，并且可调节以在温度变化时控制施加到机电组件的抵抗力的量。
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