公开(公告)号：US08398831B2

公开(公告)日：2013-03-19

申请号：US13079745

申请日：2011-04-04

Applicant: Shantinath Ghongadi ,  Robert Rash ,  Jeff Hawkins ,  Seshasayee Varadarajan ,  Tariq Majid ,  Kousik Ganesan ,  Bryan Buckalew ,  Brian Evans

Inventor： Shantinath Ghongadi ,  Robert Rash ,  Jeff Hawkins ,  Seshasayee Varadarajan ,  Tariq Majid ,  Kousik Ganesan ,  Bryan Buckalew ,  Brian Evans

IPC: C25D17/00 ,  C25D9/00 ,  F16J15/00

CPC classification number: C25D17/001 ,  C25D17/004 ,  C25D17/005 ,  C25D21/08

Abstract: Embodiments of a closed-contact electroplating cup assembly that may be rapidly cleaned while an electroplating system is on-line are disclosed. One disclosed embodiment comprises a cup assembly and a cone assembly, wherein the cup assembly comprises a cup bottom comprising an opening, a seal surrounding the opening, an electrical contact structure comprising a plurality of electrical contacts disposed around the opening, and an interior cup side that is tapered inwardly in along an axial direction of the cup from a cup top toward the cup bottom.

Abstract translation: 公开了一种在电镀系统在线时能够快速清洁的闭式电镀杯组件的实施例。 一个公开的实施例包括杯组件和锥形组件，其中杯组件包括杯底，其包括开口，围绕开口的密封件，包括围绕开口设置的多个电触点的电接触结构，以及内杯侧 其沿着杯的轴向方向从杯形顶部向杯底部向内渐缩。

公开(公告)号：US08308931B2

公开(公告)日：2012-11-13

申请号：US12291356

申请日：2008-11-07

Applicant: Jonathan Reid ,  Bryan Buckalew ,  Zhian He ,  Seyang Park ,  Seshasayee Varadarajan ,  Bryan Pennington ,  Thomas Ponnuswamy ,  Patrick Breling ,  Glenn Ibarreta ,  Steven Mayer

Inventor： Jonathan Reid ,  Bryan Buckalew ,  Zhian He ,  Seyang Park ,  Seshasayee Varadarajan ,  Bryan Pennington ,  Thomas Ponnuswamy ,  Patrick Breling ,  Glenn Ibarreta ,  Steven Mayer

IPC: C25D21/12 ,  C25D7/12 ,  C25D3/38

CPC classification number: C25D17/008 ,  C25D7/123 ,  C25D17/001 ,  C25D17/007 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/76873

Abstract: An apparatus for electroplating a layer of metal on the surface of a wafer includes an ionically resistive ionically permeable element located in close proximity of the wafer (preferably within 5 mm of the wafer surface) which serves to modulate ionic current at the wafer surface, and a second cathode configured to divert a portion of current from the wafer surface. The ionically resistive ionically permeable element in a preferred embodiment is a disk made of a resistive material having a plurality of perforations formed therein, such that perforations do not form communicating channels within the body of the disk. The provided configuration effectively redistributes ionic current in the plating system allowing plating of uniform metal layers and mitigating the terminal effect.

Abstract translation: 用于在晶片表面上电镀一层金属的装置包括位于晶片附近（优选地在晶片表面的5mm内）的离子电离性离子渗透元件，其用于调节晶片表面处的离子电流，以及 第二阴极，被配置为使来自晶片表面的一部分电流转向。 在优选实施例中的离子电阻性离子渗透元件是由电阻材料制成的盘，其中形成有多个穿孔，使得穿孔在盘的主体内不形成连通通道。 所提供的配置有效地重新分布电镀系统中的离子电流，允许电镀均匀的金属层并减轻终端效应。

公开(公告)号：US08128791B1

公开(公告)日：2012-03-06

申请号：US11590413

申请日：2006-10-30

Applicant: Bryan Buckalew ,  Jonathan Reid ,  John Sukamto ,  Zhian He ,  Seshasayee Varadarajan ,  Steven T. Mayer

Inventor： Bryan Buckalew ,  Jonathan Reid ,  John Sukamto ,  Zhian He ,  Seshasayee Varadarajan ,  Steven T. Mayer

IPC: C25D21/14 ,  C25D3/38

CPC classification number: C25D21/14 ,  C25D17/001 ,  C25D17/002

Abstract: In a copper electroplating apparatus having separate anolyte and catholyte portions, the concentration of anolyte components (e.g., acid or copper salt) is controlled by providing a diluent to the recirculating anolyte. The dosing of the diluent can be controlled by the user and can follow a pre-determined schedule. For example, the schedule may specify the diluent dosing parameters, so as to prevent precipitation of copper salt in the anolyte. Thus, precipitation-induced anode passivation can be minimized.

Abstract translation: 在具有单独阳极电解液和阴极电解液部分的铜电镀设备中，通过向循环阳极电解液提供稀释剂来控制阳极电解液组分（例如酸或铜盐）的浓度。 稀释剂的剂量可以由用户控制，并且可以遵循预定的时间表。 例如，时间表可以指定稀释剂配量参数，以防止铜盐在阳极电解液中沉淀。 因此，沉淀诱导的阳极钝化可以最小化。

公开(公告)号：US07985325B2

公开(公告)日：2011-07-26

申请号：US11929638

申请日：2007-10-30

Applicant: Robert Rash ,  Shantinath Ghongadi ,  Kousik Ganesan ,  Zhian He ,  Tariq Majid ,  Jeff Hawkins ,  Seshasayee Varadarajan ,  Bryan Buckalew

Inventor： Robert Rash ,  Shantinath Ghongadi ,  Kousik Ganesan ,  Zhian He ,  Tariq Majid ,  Jeff Hawkins ,  Seshasayee Varadarajan ,  Bryan Buckalew

IPC: C25D17/06

CPC classification number: C25D17/001 ,  C25D7/123 ,  C25D17/02

Abstract: Embodiments of a closed-contact electroplating cup are disclosed. One embodiment comprises a cup bottom comprising an opening, and a seal disposed on the cup bottom around the opening. The seal comprises a wafer-contacting peak located substantially at an inner edge of the seal. The embodiment also comprises an electrical contact structure disposed over a portion of the seal, wherein the electrical contact structure comprises an outer ring and a plurality of contacts extending inwardly from the outer ring, and wherein each contact has a generally flat wafer-contacting surface. The embodiment further comprises a wafer-centering mechanism configured to center a wafer in the cup.

Abstract translation: 公开了一种闭式电镀杯的实施例。 一个实施例包括一个包括一个开口的杯底，以及一个围绕开口设置在杯底的密封件。 密封件包括基本上位于密封件的内边缘处的与晶片接触的峰。 该实施例还包括设置在密封件的一部分上的电接触结构，其中电接触结构包括外环和从外环向内延伸的多个触点，并且其中每个触头具有大致平坦的晶片接触表面。 该实施例还包括晶圆定心机构，其配置成使晶片位于杯中心。