公开(公告)号：US08039935B2

公开(公告)日：2011-10-18

申请号：US11652088

申请日：2007-01-11

Applicant: Shu-Ming Chang ,  Lee-Cheng Shen ,  Wei-Chung Lo

Inventor： Shu-Ming Chang ,  Lee-Cheng Shen ,  Wei-Chung Lo

IPC: H01L23/02

CPC classification number: H01L23/3114 ,  H01L23/525 ,  H01L24/02 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/0231 ,  H01L2224/02319 ,  H01L2224/0233 ,  H01L2224/0235 ,  H01L2224/0236 ,  H01L2224/0401 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00

Abstract: A wafer level chip scale packaging structure and the method of fabricating the same are provided to form a sacrificial layer below the bump using a normal semiconductor process. The bump is used to connect the signals between the Si wafer and the PCB. The interface between the sacrificial layer and the adjacent layers is the weakest part in the whole structure. When the stress applied to the bump is overloaded, the interface between the sacrificial layer and the adjacent layers will crash to remove the stress generated by different thermal expansion coefficients of the Si wafer and the PCB. The sacrificial layer would help avoid the crash occurring to the bump to protect the electrical conduction between the Si wafer and the PCB.

Abstract translation: 提供晶片级芯片级封装结构及其制造方法，以使用正常的半导体工艺在凸块下方形成牺牲层。 该凸块用于连接Si晶圆和PCB之间的信号。 牺牲层和相邻层之间的界面是整个结构中最薄弱的部分。 当施加到凸块的应力过载时，牺牲层和相邻层之间的界面将崩溃以消除由Si晶片和PCB的不同热膨胀系数产生的应力。 牺牲层将有助于避免碰撞发生的碰撞以保护Si晶片和PCB之间的电导通。

公开(公告)号：US07976190B2

公开(公告)日：2011-07-12

申请号：US12292062

申请日：2008-11-12

Applicant: Che-Cheng Shen ,  Yen-Fu Liu ,  Ching-Kun Chang ,  Kuo-Hsin Yeh

Inventor： Che-Cheng Shen ,  Yen-Fu Liu ,  Ching-Kun Chang ,  Kuo-Hsin Yeh

IPC: F21S4/00 ,  F21V21/00

CPC classification number: F21S8/043 ,  F21S4/20 ,  F21V5/04 ,  F21V15/01 ,  F21V15/015 ,  F21V17/104 ,  F21V21/025 ,  F21V23/06 ,  F21Y2103/10 ,  F21Y2115/10 ,  Y10S362/80

Abstract: A custom assembly light-emitting module using plugs and jacks for obtaining vertical electrical connections, includes a light-emitting unit, a lens unit, a plug unit and a jack unit. The lens unit is detachably combined with the light-emitting unit. The plug unit is disposed beside one side of the lens unit and electrically connected with the light-emitting unit. The jack unit is disposed on a bottom side of the plug unit and electrically connected with the plug unit. In addition, the light-emitting unit has two first retaining structures being formed on two opposite lateral sides thereof, the lens unit has a hollow transparent structure and a lens integratedly with the hollow transparent structure, two second retaining structures are disposed in the hollow transparent structure, and the light-emitting unit is detachably disposed in the hollow transparent structure.

Abstract translation: 使用用于获得垂直电连接的插头和插座的定制组件发光模块包括发光单元，透镜单元，插头单元和插孔单元。 透镜单元与发光单元可拆卸地组合。 插头单元设置在透镜单元的一侧旁边并与发光单元电连接。 插座单元设置在插头单元的底侧并与插头单元电连接。 此外，发光单元具有两个第一保持结构，其两个相对的侧面形成，透镜单元具有中空的透明结构和与中空透明结构一体的透镜，两个第二保持结构设置在中空透明 结构，并且发光单元可拆卸地设置在中空透明结构中。

公开(公告)号：US07973399B2

公开(公告)日：2011-07-05

申请号：US11849371

申请日：2007-09-04

Applicant: Li-Cheng Shen

Inventor： Li-Cheng Shen

IPC: H01L23/06

CPC classification number: H01L23/5389 ,  H01L21/568 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/3025 ,  H01L2924/00

Abstract: An embedded chip package includes a substrate, a semiconductor structure, an encapsulating material layer and a plurality of conductive vias. Herein the substrate includes at least a dielectric layer and at least a patterned circuit layer disposed on the dielectric layer. The semiconductor structure is disposed on the substrate and has a plurality of electrical bonding pads, and the electrical bonding pads contact the dielectric layer. The encapsulating material layer is disposed on the substrate and around the semiconductor structure. In addition, a plurality of conductive vias is disposed in the substrate to electrically connect the patterned circuit layer to the electrical bonding pads.

Abstract translation: 嵌入式芯片封装包括衬底，半导体结构，封装材料层和多个导电通孔。 这里，衬底包括至少介电层和至少设置在电介质层上的图案化电路层。 半导体结构设置在基板上并具有多个电接合焊盘，电接合焊盘与电介质层接触。 封装材料层设置在基板上并围绕半导体结构。 此外，在衬底中设置多个导电通孔以将图案化电路层电连接到电接合焊盘。

公开(公告)号：US07896610B2

公开(公告)日：2011-03-01

申请号：US10911178

申请日：2004-08-04

Applicant: Cheng-Shen Kao

Inventor： Cheng-Shen Kao

IPC: F01D25/04

CPC classification number: F16F15/04 ,  F04D29/601 ,  F04D29/668 ,  F16F2230/34

Abstract: A three-dimensionally vibration-preventing buffering mechanism is proposed, which is designed for use in conjunction with a dynamic module for the purpose of buffering the three dimensional vibrations of the dynamic module during operation, and which is characterized by the use of a group of specially-designed chained elastic members, each being composed of at least three integrally-linked flexure hinges whose axes of concavity are oriented respectively in parallel with the three axes of a three-dimensional rectangular coordinate system, so that the vibrations of the dynamic module in all three dimensional directions can be respectively buffered by these flexure hinges to provide a three-dimensional vibration-preventing buffering effect.

Abstract translation: 提出了一种三维防振缓冲机构，其被设计为与动态模块结合使用，用于在操作期间缓冲动态模块的三维振动，其特征在于使用一组 特别设计的链接弹性构件，每个由至少三个整体连接的弯曲铰链组成，其弯曲轴线分别与三维直角坐标系的三个轴平行定向，使得动态模块的振动 所有的三维方向都可以分别由这些弯曲铰链缓冲，以提供三维的防振缓冲效果。

公开(公告)号：US07803012B2

公开(公告)日：2010-09-28

申请号：US12437703

申请日：2009-05-08

Applicant: Yu-Cheng Shen ,  Min-Hua Hsu

Inventor： Yu-Cheng Shen ,  Min-Hua Hsu

IPC: H01R13/72

CPC classification number: H01R13/72 ,  H01R13/652 ,  H01R13/6675 ,  H01R24/70 ,  H01R2103/00

Abstract: A cable collector of a power supply apparatus is provided. The power supply apparatus includes a power adaptor, a cable, and a cable collector. One side of the cable is connected with the power adaptor. The cable collector includes a first board, a first power connector, and two first blocking boards. The first board is connected with a first surface of the power adaptor. The first power connector is formed on the first board. The first board is connected with the power adaptor via the first power connector. The two first blocking boards are formed on two sides of the first board.

Abstract translation: 提供电源装置的电缆收集器。 电源装置包括电源适配器，电缆和电缆收集器。 电缆的一侧与电源适配器连接。 电缆收集器包括第一板，第一电源连接器和两个第一阻挡板。 第一板与电源适配器的第一表面连接。 第一电源连接器形成在第一板上。 第一个电路板通过第一个电源连接器与电源适配器连接。 两个第一阻挡板形成在第一板的两侧。

公开(公告)号：US20100207638A1

公开(公告)日：2010-08-19

申请号：US12609064

申请日：2009-10-30

Applicant: Kuo-Chiang Nien ,  Li-Cheng Shen ,  Chin-Lien Hsu ,  Tsung-Ying Hsieh

Inventor： Kuo-Chiang Nien ,  Li-Cheng Shen ,  Chin-Lien Hsu ,  Tsung-Ying Hsieh

IPC: G01R31/02

CPC classification number: G01R31/2887 ,  G01R1/18

Abstract: The invention discloses a testing system and a testing method. The testing system includes a testing platform and a fetching device. The testing platform includes a metal base plate, a DUT board, a testing stand and a metal wall. The DUT board is disposed on the metal base plate. The testing stand is disposed on the DUT board. The metal wall is disposed on the metal base plate and surrounds the testing stand. The fetching device is movably disposed above the testing platform and used for placing a DUT on the testing stand. A metal covering plate of the fetching device corresponds to the metal wall of the testing platform. When the fetching device places the DUT on the testing stand, the metal covering plate cooperates with the metal wall and the metal base plate of the testing platform to form an isolated space, so as to isolate the DUT.

Abstract translation: 本发明公开了一种测试系统和测试方法。 测试系统包括一个测试平台和一个提取设备。 测试平台包括金属底板，DUT板，测试台和金属壁。 DUT板设置在金属基板上。 测试台置于DUT板上。 金属壁设置在金属基板上并围绕测试台。 取出装置可移动地设置在测试平台上方并用于将DUT放置在测试台上。 取出装置的金属覆盖板对应于测试平台的金属壁。 当取出装置将DUT放置在测试台上时，金属盖板与测试平台的金属壁和金属底板配合形成隔离空间，以隔离DUT。

公开(公告)号：US20100068920A1

公开(公告)日：2010-03-18

申请号：US12437703

申请日：2009-05-08

Applicant: Yu-Cheng Shen ,  Min-Hua Hsu

Inventor： Yu-Cheng Shen ,  Min-Hua Hsu

IPC: H01R13/72

CPC classification number: H01R13/72 ,  H01R13/652 ,  H01R13/6675 ,  H01R24/70 ,  H01R2103/00

Abstract: A cable collector of a power supply apparatus is provided. The power supply apparatus includes a power adaptor, a cable, and a cable collector. One side of the cable is connected with the power adaptor. The cable collector includes a first board, a first power connector, and two first blocking boards. The first board is connected with a first surface of the power adaptor. The first power connector is formed on the first board. The first board is connected with the power adaptor via the first power connector. The two first blocking boards are formed on two sides of the first board.

Abstract translation: 提供电源装置的电缆收集器。 电源装置包括电源适配器，电缆和电缆收集器。 电缆的一侧与电源适配器连接。 电缆收集器包括第一板，第一电源连接器和两个第一阻挡板。 第一板与电源适配器的第一表面连接。 第一电源连接器形成在第一板上。 第一个电路板通过第一个电源连接器与电源适配器连接。 两个第一阻挡板形成在第一板的两侧。

公开(公告)号：US20090018186A1

公开(公告)日：2009-01-15

申请号：US12196484

申请日：2008-08-22

Applicant: Youlung Chen ,  Lihong D'Angelo ,  Cheng Shen ,  George A. King

Inventor： Youlung Chen ,  Lihong D'Angelo ,  Cheng Shen ,  George A. King

IPC: A61K31/202 ,  A61K31/20 ,  A61K31/355 ,  A61K31/35

CPC classification number: A23L2/52 ,  A23L2/395 ,  A23L29/03 ,  A23L29/10 ,  A23L33/12 ,  A23V2002/00 ,  A61K9/0095 ,  A61K9/1075 ,  A61K31/047 ,  A61K31/20 ,  A61K31/202 ,  A23V2250/1882 ,  A23V2250/1868 ,  A23V2250/21 ,  A23V2200/222

Abstract: A beverage product comprising at least one beverage base and at least one polyunsaturated fatty acid emulsion, said emulsion comprising a continuous liquid phase; an emulsifier; and a discontinuous liquid phase comprising a blend including a polyunsaturated fatty acid source and a dispersing agent, the polyunsaturated fatty acid source comprising at least one polyunsaturated fatty acid, wherein the weight ratio of the fatty acid source to the dispersing agent in the blend ranges from about 9:1 to about 1:10.

Abstract translation: 一种饮料产品，其包含至少一种饮料基质和至少一种多不饱和脂肪酸乳液，所述乳液包含连续液相; 乳化剂 和包含包含多不饱和脂肪酸源和分散剂的共混物的不连续液相，所述多不饱和脂肪酸源包含至少一种多不饱和脂肪酸，其中所述共混物中脂肪酸源与分散剂的重量比为 约9：1至约1:10。

公开(公告)号：US07319050B2

公开(公告)日：2008-01-15

申请号：US11152149

申请日：2005-06-15

Applicant: Shu-Ming Chang ,  Lee-Cheng Shen

Inventor： Shu-Ming Chang ,  Lee-Cheng Shen

IPC: H01L21/44

CPC classification number: H01L24/10 ,  H01L23/3114 ,  H01L24/13 ,  H01L2224/02335 ,  H01L2224/0401 ,  H01L2224/05011 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00

Abstract: A wafer level chip scale packaging structure and the method of fabricating the same are disclosed to form a sacrificial layer below the bump using a normal semiconductor process. The bump is used to connect the signals between the Si wafer and the PCB. The interface between the sacrificial layer and the PCB is the weakest part in the whole structure. When the stress applied to the bump is overloaded, the interface between the sacrificial layer and the adjacent layers will peel or the sacrificial layer material will crash to remove the stress generated by different thermal expansion coefficients of the Si wafer and the PCB. The sacrificial layer would help avoid the crash occurring to the bump to protect the electrical conduction between the Si wafer and the PCB.

Abstract translation: 公开了晶片级芯片级封装结构及其制造方法，以使用正常的半导体工艺在凸块下方形成牺牲层。 该凸块用于连接Si晶圆和PCB之间的信号。 牺牲层和PCB之间的界面是整个结构中最薄弱的部分。 当施加到凸块的应力过载时，牺牲层和相邻层之间的界面将剥离，或者牺牲层材料将崩溃以消除由Si晶片和PCB的不同热膨胀系数产生的应力。 牺牲层将有助于避免碰撞发生的碰撞以保护Si晶片和PCB之间的电导通。

公开(公告)号：US07181669B2

公开(公告)日：2007-02-20

申请号：US10734286

申请日：2003-12-15

Applicant: Yu-Cheng Shen ,  Kuo-Ming Wang ,  Pei Yu ,  Cheng-Yueh Hsiao

Inventor： Yu-Cheng Shen ,  Kuo-Ming Wang ,  Pei Yu ,  Cheng-Yueh Hsiao

IPC: H03M13/05 ,  H03M13/29

CPC classification number: H03M13/2707 ,  H03M13/15 ,  H03M13/1515 ,  H03M13/2915

Abstract: A device and method for block code error correction. The device includes a block code input unit, an erasing address table, an error table and a decoder. The block code input unit is used to input a block code. The erasing address table and the error table have a plurality of erasing entities and error entities in rows and columns, respectively. The decoder decodes the block code in a row direction based on the erasing address table to find data errors on rows and update the error table, and updates the erasing address table in the row direction according to a first determination principle. Next, the decoder decodes the block code in a column direction based on the erasing address table to find data errors on columns and update the error table, and updates the erasing address table in the column direction according to a second determination principle.

Abstract translation: 一种用于块码纠错的装置和方法。 该装置包括块代码输入单元，擦除地址表，错误表和解码器。 块代码输入单元用于输入块代码。 擦除地址表和错误表分别具有行和列中的多个擦除实体和错误实体。 解码器基于擦除地址表对行方向上的块码进行解码，以查找行上的数据错误并更新错误表，并根据第一确定原理更新行方向上的擦除地址表。 接下来，解码器基于擦除地址表在列方向上解码块码，以查找列上的数据错误并更新错误表，并根据第二确定原理更新列方向上的擦除地址表。