Abstract:
A low-power crystal-controlled CMOS oscillator wherein a long and wide additional transistor is provided in the first stage of the output amplifier. This prevents the output amplifier from diverting too much current from the primary amplifier stage during start-up.
Abstract:
A low-power crystal-controlled CMOS oscillator wherein a long and wide additional transistor is provided in the first stage of the output amplifier. This prevents the output amplifier from diverting too much current from the primary amplifier stage during start-up.
Abstract:
A nonvolatile static random access memory cell (10) includes a pair of cross-coupled transistors (12, 14) which function as a bistable circuit to store data states. Variable threshold transistors (36, 41) are respectively connected in series between the driver transistors (12, 14) and load devices (48, 50). A control node (40) is driven to a high voltage state to cause one of the variable threshold transistors (36, 41) to be driven to have a higher threshold voltage and thereby store the data state held in the cross-coupled transistors (12, 14). The data state is thus stored in nonvolatile form. Upon recall the memory cell (10) is reactivated and the threshold differential between the variable threshold transistors (36, 41) causes the driver transistors (12, 14) to be set at the stored data state. The data recalled by the memory cell (10) is in true rather than in complementary form. The variable threshold transistors (36, 41) are reset by driving the power terminal V.sub.cc to a high voltage state to reestablish common threshold voltages for the variable threshold voltage transistors (36, 41).
Abstract:
An integrated circuit memory cell (10) having a bit line (12), a word line (14) and a cell voltage supply (26) is provided. The integrated circuit memory cell (10) includes a first clock line (34) and a second clock line (36). A first transistor (20) is interconnected to the bit line (12) and the word line (14) for providing access to the memory cell (10). A second transistor (22) is interconnected to the cell voltage supply source (26) and to the first transistor (20) thereby defining a first node (S). The second transistor (22) provides a charging path from the cell voltage supply source (26) to the first node (S). A capacitor (30) is provided and interconnects the first clock line (34) and the second transistor (22). The interconnection between the capacitor (30) and the second transistor (22) defines a second node (K). The capacitor (30) provides a coupling path between the first clock line (34) and the second node (K) for conditionally supplying a voltage from the first clock line (34) to the second node (K) to render voltage at the second node (K) higher than the cell voltage supply source (26). A third transistor is provided for the memory cell (10) and is interconnected to the first node (S) and the second node (K) and the second clock line (36). The third transistor (24) provides a charging path between the second clock line (36) and the second node (K) for conditionally maintaining a voltage at the second node (K).
Abstract:
A dual storage cell memory includes an array of dual storage cells, each of the dual storage cells containing a first memory cell and a second memory cell. The first and second memory cells are well known six-transistor static memory cells with the addition of transfer circuitry for transferring data directly from the internal data nodes of each of the memory cells to its corresponding complementary memory cell without requiring the use of the enable transistors or the bit lines associated with each of the dual storage cells.
Abstract:
An embedded framing bit pattern in a serial bit stream is located by combining the last bit to arrive of the serial bit stream with a predetermined number of prior bits of the serial bit stream which are spaced apart by the pitch of the bits of the framing bit pattern, and this combination of the bits is tested to determine if the combination matches part of the framing bit pattern. If a match does not occur, then the bits which were combined together are changed to a bit pattern that will not result in a match when these bits (except for the eldest bit which is disregarded) is combined again with a new bit of the serial bit stream, no matter what the logic state of the new bit. In this manner all of the bits, as they arrive and are combined and tested, will eventually be changed except the bits which are part of the framing bit pattern.
Abstract:
A low-power crystal-controlled CMOS oscillator wherein a long and wide additional transistor is provided in the first stage of the output amplifier. This prevents the output amplifier from diverting too much current from the primary amplifier stage during startup.
Abstract:
A temperature and processing compensated time delay circuit of the type which can be fabricated in a monolithic integrated circuit utilizes a field effect transistor (FET) (12) connected to the terminals of a charged capacitor (14). A bias voltage connected to the gate of the FET (12) varies with temperature in a manner to compensate for the changes in current which flows from the capacitor (14) through the FET (12) due to changes in temperature. The bias voltage also varies from one integrated circuit to another in a manner to compensate for variations in FET threshold voltage caused by variations in the processing of the integrated circuits.
Abstract:
An embedded framing bit pattern in a serial bit stream is located by combining the last bit to arrive of the serial bit stream with a predetermined number of prior bits of the serial bit stream which are spaced apart by the pitch of the bits of the framing bit pattern, and this combination of bits is tested to determine if the combination matches part of the framing bit pattern. If a match does not occur, then the bits which were combined together are changed to a bit pattern that will not result in a match when these bits (except for the eldest bit which is disregarded) is combined again with a new bit of the serial bit stream, no matter what the logic state of the new bit. In this manner all of the bits, as they arrive and are combined and tested, will eventually be changed except the bits which are part of the framing bit pattern.
Abstract:
A dual storage cell memory includes an array of dual storage cells, each of the dual storage cells containing a first memory cell and a second memory cell. The first and second memory cells are well known six-transistor static memory cells with the addition of transfer circuitry for transferring data directly from the internal data nodes of each of the memory cells to its corresponding complementary memory cell without requiring the use of the enable transistors or the bit lines associated with each of the dual storage cells.