Abstract:
A dynamic logic gate has an asymmetrical dual-gate PFET device for charging a dynamic node during a pre-charge phase of a clock. A logic tree evaluates the dynamic node during an evaluate phase of the clock. The front gate of the asymmetrical dual-gate PFET device is coupled to the clock signal and the back gate is coupled to the ground potential of the power supply. When the clock is a logic zero both the front gate and the back gate are biased ON and the dynamic node charges with maximum current. The clock signal transitions to a logic one during the evaluation phase of the clock turning OFF the front gate. The back gate remains ON and the asymmetrical dual-gate PFET device operates as a keeper device with a current level sufficient to counter leakage on the dynamic node.
Abstract:
Methods and apparatus are provided for varying one or more of a supply voltage and reference voltage in an integrated circuit, using independent control of a diode voltage in an asymmetrical double-gate device. An integrated circuit is provided that is controlled by one or more of a supply voltage and a reference voltage. The integrated circuit comprises an independently controlled asymmetrical double-gate device to adjust one or more of the supply voltage and the reference voltage. The independent control may comprise, for example, a back gate bias. The independently controlled asymmetrical double-gate device may be employed in a number of applications, including voltage islands, static RAM, and to improve the power and performance of a processing unit.
Abstract:
A ring oscillator is formed using inverting stages configured from asymmetrical dual gated FET (ADG-FET) devices. The simplest form uses an odd number of CMOS inverter stages configured with an ADG-PFET and an ADG-NFET. The front gates are used as the logic inputs and are coupled to preceeding outputs from the main ring. The back gates of the ADG-PFET devices are coupled to a first control voltage and the back gates of the ADG-NFET devices are coupled to a second control voltage that is the complement of the first control voltage referenced to an off-set voltage. Other configurations of logic inverting stages using ADG-FET devices may also be used. The control voltage is varied to modulate the current level set by the logic state at the inputs coupled to the front gates.
Abstract:
A dynamic logic gate has a device for charging a dynamic node during a pre-charge phase of a clock. A logic tree evaluates the dynamic node with a device during an evaluate phase of the clock. The dynamic node has a keeper circuit comprising an inverter with its input coupled to the dynamic node and its output coupled to the back gate of a dual gate PFET device. The source of the dual gate PFET is coupled to the power supply and its drain is coupled to the dynamic node forming a half latch. The front gate of the dual gate PFET is coupled to a logic circuit with a mode input and a logic input coupled back to a node sensing the state of the dynamic node. The mode input may be a slow mode to preserve dynamic node state or the clock delayed that turns ON the strong keeper after evaluation.
Abstract:
A new power gating structure with robust data retention capability using only one single double-gate device to provide both power gating switch and virtual supply/ground diode clamp functions. The scheme reduces the transistor count, area, and capacitance of the power gating structure, thus improving circuit performance, power, and leakage. The scheme is compared with the conventional power gating structure via mixed-mode physics-based two-dimensional numerical simulations. Analysis of virtual supply/ground bounce for the proposed scheme is also presented.
Abstract:
Discloses are CMOS circuit designs that combine MTCMOS and hybrid orientation technology to achieve the dual objectives of high performance and low standby leakage power. The invention utilizes novel combinations of a thick-oxide high-VTH PFET header with various gate- and body-biased schemes in HOT technology to significantly reduce the performance penalty associated with conventional PFET headers. A first embodiment of the invention provides a HOT-B high-VTH thick oxide bulk PFET header scheme. This header scheme can be expanded by application of a positive gate bias VPOS (VPOS>VDD) to the HOT-B PFET header during standby mode and a negative gate bias VNEG (VNEG
Abstract:
A SRAM that keeps the memory cell array under a low voltage in the Standby mode and Write mode, and raises the memory cell array supply voltage to a high voltage in the Read mode. A SRAM comprising: at least one memory cell circuit, comprising a latch circuit with at least two inverters, and comprising two power receiving terminals for receiving power; and a power supplying circuit, for providing the power to the memory cell circuit, such that the voltages at the power receiving terminals of the latch circuit is below a predetermined voltage level when data is written to the latch circuit. In one embodiment, the memory cell circuit includes a plurality of data accessing terminals and the data accessing terminals are respectively controlled by at least two pass-transistor switch devices.
Abstract:
A threshold voltage measurement device is disclosed. The device is coupled to a 6T SRAM. The SRAM comprises two inverters each coupled to a FET. Power terminals of one inverter are in a floating state; the drain and source of the FET coupled to the inverter are short-circuited. Two voltage selectors, a resistor, an amplifier and the SRAM are connected in a negative feedback way. Different bias voltages are applied to the SRAM for measuring threshold voltages of two FETs of the other inverter and the FET coupled to the other inverter. The present invention uses a single circuit to measure the threshold voltages of the three FETs without changing the physical structure of the SRAM. Thereby is accelerated the measurement and decreased the cost of the fabrication process and measurement instruments.
Abstract:
The present invention provides an IG 7T FinFET SRAM, which adopts independently-controlled-gate super-high-VT FinFETs to achieve a stacking-like property, whereby to eliminate the read disturb and half-select disturb. Further, the present invention uses keeper circuits and read control voltage to reduce leakage current of the bit lines during read. Furthermore, the present invention can effectively overcome the problem of the conventional 6T SRAM that is likely to have read errors at low operation voltage.
Abstract:
SRAM writing system and related apparatus are provided. The writing system of the invention has a dummy replica writing circuit, a negative pulse controller and at least a normal writing circuit; each normal writing circuit includes a write driver and a negative pulse supplier. While writing, the dummy replica writing circuit drives a dummy replica bit-line, such that the negative pulse controller generates a negative pulse control signal according to level of the dummy replica bit-line. In each writing circuit, when the write driver conducts to connect an associated bit-line to a bias end for driving a level transition, the negative pulse supplier switches the bias end from an operation voltage to a different negative pulse voltage according to the received negative pulse control signal.