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    Photoimageable dielectric epoxy resin system film
    13.
    发明授权
    Photoimageable dielectric epoxy resin system film 失效
    可光成像介电环氧树脂体系膜

    公开(公告)号：US06835533B2

    公开(公告)日：2004-12-28

    申请号：US10781073

    申请日：2004-02-18

    申请人： Elizabeth Foster ,  Gary A. Johansson ,  Heike Marcello ,  David J. Russell

    发明人： Elizabeth Foster ,  Gary A. Johansson ,  Heike Marcello ,  David J. Russell

    IPC分类号： G03F7038

    CPC分类号： G03F7/0385 ,  G03F7/038 ,  H05K3/0023 ,  H05K3/4644 ,  H05K3/4676 ,  Y10T428/24851

    摘要： A method for fabricating circuitized substrates which reduces shorts, and does not require baking and resulting film. The method employs a photoimageable dielectric film, having a solvent content less than about 5%, and a glass transition temperature, when cured, which is greater than about 110° C. A photoimageable dielectric film is provided having from about 95% to about 100% solids, and comprising: from 0% to about 30% of the solids, of a particulate rheology modifier; from about 70% to about 100% of the solids of an epoxy resin system (liquid at 20° C.) comprising: from about 85% to about 99.9% epoxy resins; and from about 0.1 to 15 parts of the total resin weight, a cationic photoinitiator; from 0% to about 5% solvent; applying the photoimageable dielectric film to a circuitized substrate; and exposing the film to actinic radiation.

    摘要翻译： 一种制造电路化基板的方法，其减少短路，并且不需要烘烤和得到的膜。 该方法使用溶剂含量小于约5％的光致成像电介质膜，当固化时玻璃化转变温度大于约110℃。提供具有约95％至约100的光致成像电介质膜 ％固体，并且包含：0％至约30％的固体，颗粒状流变改性剂; 约70％至约100％的环氧树脂体系的固体（20℃的液体），包含：约85％至约99.9％的环氧树脂; 和约0.1至15份的总树脂重量，阳离子光引发剂; 0％至约5％的溶剂; 将光致成像电介质膜施加到电路化基板上; 并将膜暴露于光化辐射。

    Method of fabricating circuitized structures
    14.
    发明授权
    Method of fabricating circuitized structures 失效
    制造电路结构的方法

    公开(公告)号：US06706464B2

    公开(公告)日：2004-03-16

    申请号：US10345561

    申请日：2003-01-16

    申请人： Elizabeth Foster ,  Gary A. Johansson ,  Heike Marcello ,  David J. Russell

    发明人： Elizabeth Foster ,  Gary A. Johansson ,  Heike Marcello ,  David J. Russell

    IPC分类号： G03F740

    CPC分类号： G03F7/0385 ,  G03F7/038 ,  H05K3/0023 ,  H05K3/4644 ,  H05K3/4676 ,  Y10T428/24851

    摘要： A method for fabricating circuitized substrates which reduces shorts, and does not require baking and resulting film. The method employs a photoimageable dielectric film, having a solvent content less than about 5%, and a glass transition temperature, when cured, which is greater than about 110° C. A photoimageable dielectric film, is provided having from about 95% to about 100% solids, and comprising: from 0% to about 30% of the solids, of a particulate rheology modifier, from about 70% to about 100% of the solids of an epoxy resin system (liquid at 20° C. comprising: from about 85% to about 99.9% epoxy resins; and from about 0.1 to 15 parts of the total resin weight, a cationic photoinitiator; from 0 to about 5% solvent, applying the photoimageable dielectric film to a circuitized substrate; and exposing the film to actinic radiation.

    摘要翻译： 一种制造电路化基板的方法，其减少短路，并且不需要烘烤和得到的膜。 该方法采用溶剂含量小于约5％的光致成像电介质膜，当固化时玻璃化转变温度大于约110℃。提供了可见光电介质膜，其具有约95％至约 100％固体，并且包含：固体的0％至约30％的颗粒状流变改性剂，约70％至约100％的环氧树脂体系的固体（液体在20℃，包括：来自 约85％至约99.9％的环氧树脂;和约0.1至15份的总树脂重量，阳离子光引发剂; 0至约5％的溶剂，将可光成像的电介质膜施加到电路化基板;以及将膜暴露于 光化辐射。

    PROCESS AND MATERIALS FOR MAKING CONTAINED LAYERS AND DEVICES MADE WITH SAME
    16.
    发明申请
    PROCESS AND MATERIALS FOR MAKING CONTAINED LAYERS AND DEVICES MADE WITH SAME 审中-公开
    用于制造包含层的工艺和材料及其制品

    公开(公告)号：US20130087779A1

    公开(公告)日：2013-04-11

    申请号：US13704003

    申请日：2011-06-16

    申请人： Kyung-Ho Park ,  Nora Sabina Radu ,  Gary A. Johansson ,  William J. Delaney ,  Adam Fennimore ,  Daniel David Lecloux

    发明人： Kyung-Ho Park ,  Nora Sabina Radu ,  Gary A. Johansson ,  William J. Delaney ,  Adam Fennimore ,  Daniel David Lecloux

    IPC分类号： B05D3/06 ,  H01L51/52 ,  H01L51/56

    CPC分类号： B05D3/06 ,  C08G2261/3162 ,  C08G2261/95 ,  G03F7/027 ,  G03F7/405 ,  H01L51/0004 ,  H01L51/0035 ,  H01L51/50 ,  H01L51/5048 ,  H01L51/52 ,  H01L51/56

    摘要： There is provided a process for forming a contained second layer over a first layer, including the steps: forming the first layer having a first surface energy; treating the first layer with a priming material to form a priming layer; exposing the priming layer patternwise with radiation resulting in exposed areas and unexposed areas; developing the priming layer to effectively remove the priming layer from the unexposed areas resulting in a first layer having a pattern of priming layer, wherein the pattern of priming layer has a second surface energy that is higher than the first surface energy; and forming the second layer by liquid depositions on the pattern of priming layer on the first layer.The priming material has Formula I or Formula I′: In Formula I or Formula I′: Ar1 and Ar2 are the same or different and are aryl groups; R1 through R5 are independently the same or different at each occurrence and are D, F, alkyl, aryl, alkoxy, silyl, or a crosslinkable group; R6 is H, D, or halogen; a through e are independently an integer from 0 to 4; f is 1 or 2; g is 0, 1 or 2; h is 1 or 2; and n is an integer greater than 0.

    摘要翻译： 提供了一种用于在第一层上形成包含的第二层的方法，包括以下步骤：形成具有第一表面能的第一层; 用起动材料处理第一层以形成起动层; 以辐射模式曝光引发层，导致曝光区域和未曝光区域; 开发底漆层以有效地从未曝光区域去除底漆层，从而产生具有起泡层图案的第一层，其中底漆层的图案具有高于第一表面能的第二表面能; 以及通过在第一层上的起动层的图案上的液体沉积形成第二层。 起始材料具有式I或式I'：在式I或式I'中：Ar 1和Ar 2相同或不同，为芳基; R 1至R 5各自独立地相同或不同，为D，F，烷基，芳基，烷氧基，甲硅烷基或可交联基团; R6是H，D或卤素; a至e独立地为0至4的整数; f为1或2; g为0,1或2; h为1或2; 并且n是大于0的整数。

    High optical contrast resin composition and electronic package utilizing same
    19.
    发明授权
    High optical contrast resin composition and electronic package utilizing same 失效
    高光学造影树脂组合物和使用其的电子封装

    公开(公告)号：US06337375B1

    公开(公告)日：2002-01-08

    申请号：US09660851

    申请日：2000-09-13

    申请人： Gary A. Johansson ,  Konstantinos I. Papathomas

    发明人： Gary A. Johansson ,  Konstantinos I. Papathomas

    IPC分类号： C08F28300

    CPC分类号： H05K1/0269 ,  H05K1/0373 ,  H05K3/4644 ,  H05K2203/161 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31522

    摘要： A composition for use in making high optical contrast and UV light fluorescing dielectric material usuable in printed circuit boards, which in turn may form part of an electronic package. The composition comprises a resin, a coloring agent, and a fluorescing agent. A dielectric material is also defined that comprises a reinforcing material combined with the composition, the dielectric material forming at least one layer in combination with at least one conductive layer for the electronic package.

    摘要翻译： 用于制造印刷电路板中使用的高光学对比度和UV光荧光介质材料的组合物，其可以形成电子封装的一部分。 组合物包含树脂，着色剂和荧光剂。 还定义了一种电介质材料，其包括与该组合物组合的增强材料，该电介质材料与用于电子封装的至少一个导电层组合形成至少一层。