公开(公告)号：US20130123726A1

公开(公告)日：2013-05-16

申请号：US13524192

申请日：2012-06-15

Applicant: Jiun-Jang Yu ,  Chiung-Hsiung Chen ,  Chun-An Lu ,  Hong-Ching Lin

Inventor： Jiun-Jang Yu ,  Chiung-Hsiung Chen ,  Chun-An Lu ,  Hong-Ching Lin

IPC: A61F13/42 ,  G06K19/077

CPC classification number: H01Q1/2225 ,  H01Q1/273 ,  H01Q9/285

Abstract: A radio frequency (RF) identification tag including a substrate, a planar antenna, an RF chip, a plurality of signal conductors and a plurality of ground conductors is provided. The RF chip receives an RF signal from the planar antenna to generate an identification code. The signal conductors are coupled to the planar antenna. The ground conductors, interlaced on two opposite sides of the signal conductors, and the signal conductors are adjacent to each other and disposed on the substrate to form a coplanar waveguide structure which includes an impedance match portion and a transmission portion. The impedance match portion has an input end coupled to the signal conductors and a ground plane coupled to the ground conductors. The RF chip is disposed between the input end and the ground plane. The transmission portion is connected between the impedance match portion and the planar antenna.

Abstract translation: 提供了包括基板，平面天线，RF芯片，多个信号导体和多个接地导体的射频（RF）识别标签。 RF芯片从平面天线接收RF信号以产生识别码。 信号导体耦合到平面天线。 在信号导体的两个相对侧交织的接地导体和信号导体彼此相邻并且设置在基板上以形成包括阻抗匹配部分和透射部分的共面波导结构。 阻抗匹配部分具有耦合到信号导体的输入端和耦合到接地导体的接地平面。 RF芯片设置在输入端和接地平面之间。 传输部分连接在阻抗匹配部分和平面天线之间。

公开(公告)号：US20100166952A1

公开(公告)日：2010-07-01

申请号：US12651207

申请日：2009-12-31

Applicant: Kuo-Chan Chiou ,  Hong-Ching Lin ,  Szu-Po Huang ,  Chun-An Lu

Inventor： Kuo-Chan Chiou ,  Hong-Ching Lin ,  Szu-Po Huang ,  Chun-An Lu

IPC: B22F7/00 ,  C09D1/00

CPC classification number: C09D7/61 ,  B22F1/0022 ,  B22F7/04 ,  B22F2998/10 ,  B82Y30/00 ,  C08K3/08 ,  C08K9/02 ,  C09D1/00 ,  C09D7/62 ,  C09D7/67 ,  B22F9/24 ,  B22F9/305

Abstract: A nano-metal solution, nano-metal complex grains, and a manufacturing method of a metal film are provided. The nano-metal solution includes metal grains having an amount of 0.1˜30 wt %, metallic-organic self-decomposition molecules having an amount of 0.1˜50 wt % and having formula 1, and a solvent having an amount of 20˜99.8 wt %: wherein M represents a metal ion. The metallic-organic self-decomposition molecules and the metal grains are evenly mixed in the solvent, and the metallic-organic self-decomposition molecules are adsorbed on surfaces of the metal grains.

Abstract translation: 提供纳米金属溶液，纳米金属络合物颗粒和金属膜的制造方法。 纳米金属溶液包含0.1〜30重量％的金属颗粒，0.1〜50重量％的金属有机自分解分子，具有式1的溶剂和20〜99.8重量％的溶剂 ％：其中M表示金属离子。 金属有机自分解分子和金属颗粒在溶剂中均匀混合，金属有机自分解分子被吸附在金属颗粒的表面上。

公开(公告)号：US20120138565A1

公开(公告)日：2012-06-07

申请号：US13096548

申请日：2011-04-28

Applicant: Jiun-Jang YU ,  Hong-Ching LIN

Inventor： Jiun-Jang YU ,  Hong-Ching LIN

IPC: B65D23/14

CPC classification number: B65D23/14 ,  B65D2203/10

Abstract: A bottled structure includes a bottle, a liquid substance and an electrical tag. The bottle has a body. The body has a bottle opening. The liquid substance is contained in the body and has a dielectric constant. The electrical tag is disposed on the body. The electrical tag has a radiator, wherein the radiation power of the radiator is stronger on the top or the bottom of the bottle opening than that on a plane perpendicular to the body according to the dielectric constant of the liquid substance.

Abstract translation: 瓶装结构包括瓶子，液体物质和电子标签。 瓶子有一个身体。 身体有一个瓶子开口。 液体物质包含在体内并具有介电常数。 电标签设置在主体上。 电标签具有散热器，其中根据液体物质的介电常数，散热器的辐射功率在瓶口的顶部或底部比垂直于主体的平面的辐射强度更强。

公开(公告)号：US20110101283A1

公开(公告)日：2011-05-05

申请号：US12813749

申请日：2010-06-11

Applicant: Chun-An Lu ,  Hong-Ching Lin

Inventor： Chun-An Lu ,  Hong-Ching Lin

IPC: H01B1/02 ,  H01B1/00 ,  H01B1/12 ,  B05D5/12 ,  H01B1/04 ,  B05D3/06

CPC classification number: H01B1/22 ,  C08K9/04 ,  C09D5/24 ,  C09D7/62 ,  C09D7/70 ,  C09D11/52 ,  H01B1/24

Abstract: An electrically conductive composition and a fabrication method thereof are provided. The electrically conductive structure includes a major conductive material and an electrically conductive filler of an energy delivery character dispersed around the major conductive material. The method includes mixing a major conductive material with an electrically conductive filler of an energy delivery character to form a mixture, coating the mixture on a substrate, applying a second energy source to the mixture while simultaneously applying a first energy source for sintering the major conductive material to form an electrically conductive composition with a resistivity smaller than 10×10−3Ω·cm.

Abstract translation: 提供导电组合物及其制造方法。 导电结构包括主要导电材料和分散在主要导电材料周围的能量输送特性的导电填料。 该方法包括将主要导电材料与能量输送特性的导电填料混合以形成混合物，将混合物涂覆在基底上，向混合物施加第二能量源，同时施加第一能量来烧结主导电 材料以形成电阻率小于10×10-3＆OHgr·cm的导电组合物。

公开(公告)号：US07821136B2

公开(公告)日：2010-10-26

申请号：US11552534

申请日：2006-10-25

Applicant: Ying-Chang Houng ,  Hong-Ching Lin ,  Chi-Jen Shih ,  Shao-Ju Shih

Inventor： Ying-Chang Houng ,  Hong-Ching Lin ,  Chi-Jen Shih ,  Shao-Ju Shih

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: C23C18/06 ,  C23C18/08 ,  H05K1/097 ,  H05K3/105 ,  Y10T428/256

Abstract: Methods for forming conductive layers. A layer of metal composite is applied on a substrate, comprising a plurality of metal flakes, a plurality of nanometer metal spheres, and a plurality of mixed metal precursors. The plurality of mixed metal precursors comprises a mixture of inorganic salts and organic acidic salts. The layer of metal composite is cured to induce an exothermic reaction, thereby forming a conductive layer on the substrate at a relatively low temperature (

Abstract translation: 形成导电层的方法。 将金属复合材料层施加在基板上，包括多个金属薄片，多个纳米金属球体和多个混合金属前体。 多种混合金属前体包括无机盐和有机酸性盐的混合物。 固化该金属复合层以引起放热反应，从而在较低温度（<200℃）下在基板上形成导电层。

公开(公告)号：US20100116893A1

公开(公告)日：2010-05-13

申请号：US12506367

申请日：2009-07-21

Applicant: Jiun-Jang Yu ,  Hsin-Hsien Yeh ,  Hong-Ching Lin ,  Chiung-Hsiung Chen

Inventor： Jiun-Jang Yu ,  Hsin-Hsien Yeh ,  Hong-Ching Lin ,  Chiung-Hsiung Chen

IPC: G06K19/06

CPC classification number: G06K19/07749 ,  G06K19/0775

Abstract: A radio frequency identification (RFID) tag including a substrate, an RFID chip, a chip contact part, a folding circuit and a radiation part is provided. The chip contact part is formed on the substrate and electrically coupled to the RFID chip. The folding circuit is formed on the substrate and electrically coupled to the chip contact part. The folding circuit has a winding part, which forms a hollow region, for compensating the antenna electric length. The radiation part is formed on the substrate and electrically coupled to the folding circuit, wherein one terminal of the winding part of the folding circuit is open, and the other terminal is electrically coupled to the radiation part. At least one of the folding circuit and the radiation part is asymmetric to the chip contact part.

Abstract translation: 提供了包括基板，RFID芯片，芯片接触部件，折叠电路和辐射部件的射频识别（RFID）标签。 芯片接触部分形成在基板上并电耦合到RFID芯片。 折叠电路形成在基板上并电耦合到芯片接触部分。 折叠电路具有绕组部分，其形成中空区域，用于补偿天线电长度。 辐射部分形成在基板上并电耦合到折叠电路，其中折叠电路的绕组部分的一个端子是开放的，另一个端子电耦合到辐射部分。 折叠电路和辐射部分中的至少一个与芯片接触部分不对称。

公开(公告)号：US20070054112A1

公开(公告)日：2007-03-08

申请号：US11552534

申请日：2006-10-25

Applicant: Ying-Chang Houng ,  Hong-Ching Lin ,  Chi-Jen Shih ,  Shao-Ju Shih

Inventor： Ying-Chang Houng ,  Hong-Ching Lin ,  Chi-Jen Shih ,  Shao-Ju Shih

IPC: B32B15/02 ,  B32B9/00

CPC classification number: C23C18/06 ,  C23C18/08 ,  H05K1/097 ,  H05K3/105 ,  Y10T428/256

Abstract: Methods for forming conductive layers. A layer of metal composite is applied on a substrate, comprising a plurality of metal flakes, a plurality of nanometer metal spheres, and a plurality of mixed metal precursors. The plurality of mixed metal precursors comprises a mixture of inorganic salts and organic acidic salts. The layer of metal composite is cured to induce an exothermic reaction, thereby forming a conductive layer on the substrate at a relatively low temperature (

Abstract translation: 形成导电层的方法。 将金属复合材料层施加在基板上，包括多个金属薄片，多个纳米金属球体和多个混合金属前体。 多种混合金属前体包括无机盐和有机酸性盐的混合物。 固化该金属复合层以引起放热反应，从而在较低温度（<200℃）下在基板上形成导电层。

公开(公告)号：US06384705B1

公开(公告)日：2002-05-07

申请号：US09476432

申请日：1999-12-30

Applicant: Yu-Ting Huang ,  Wen-Song Ko ,  Mean-Jue Tung ,  Hong-Ching Lin ,  Li-Jiun Wang

Inventor： Yu-Ting Huang ,  Wen-Song Ko ,  Mean-Jue Tung ,  Hong-Ching Lin ,  Li-Jiun Wang

IPC: H01F500

CPC classification number: H01F17/0013 ,  H01F2017/0026 ,  H01F2017/0093 ,  H03H7/427 ,  H03H2001/0085

Abstract: A miniaturized common mode EMI filter with a greatly simplified design so that it can be manufactured very economically. The common mode filter includes: (a) a magnetic main body; (b) a pair of substantially identical electrically conductive planar coils embedded in the magnetic main body; and (c) an insulative planar coil sandwiched between the pair of electrically conductive planar coils, wherein the insulative planar coil has a pattern that is substantially identical to and inclusive of the pattern of the electrically conductive planar coils so as to insulate the pair of electrically conductive planar coil from each other. The common mode filter retains low normal mode impedance and high common mode impedance, with a substantially reduced physical size, so that it can cost-effectively maintain a high fidelity of the normal mode waveform of signals for electronic devices that utilize differential transmission technology and keep the common mode EMI noise to a minimum.

Abstract translation: 一种小型化的共模EMI滤波器，其设计大大简化，可以非常经济地制造。 共模滤波器包括：（a）磁性主体; （b）嵌入在磁性主体中的一对基本相同的导电平面线圈; 和（c）夹在所述一对导电平面线圈之间的绝缘平面线圈，其中所述绝缘平面线圈具有与所述导电平面线圈的图案基本相同并且包括所述导电平面线圈的图案的图案，以使所述一对电气 导电平面线圈彼此。 共模滤波器保持低正常模式阻抗和高共模阻抗，物理尺寸大大降低，从而可以以低成本的方式保持利用差分传输技术的电子设备信号的正常模式波形的高保真度并保持 将共模EMI噪声降至最低。

公开(公告)号：US20130044401A1

公开(公告)日：2013-02-21

申请号：US13587005

申请日：2012-08-16

Applicant: Hsin-Hsien Yeh ,  Hong-Ching Lin ,  Tsung-Wen Chen ,  Wen-Hao Deng

Inventor： Hsin-Hsien Yeh ,  Hong-Ching Lin ,  Tsung-Wen Chen ,  Wen-Hao Deng

IPC: H02H3/38 ,  H01H85/48

CPC classification number: H02H3/202 ,  H01H85/0039 ,  H01H85/10 ,  H01H85/12 ,  H01M10/446 ,  H01M10/486 ,  H02H7/18

Abstract: A protection component includes: a package substrate; a first fuse unit disposed in the package substrate, having a first fusing region; a second fuse unit disposed in the package substrate, having a second fusing region which is close to the first fusing region; and a first buried cave disposed in the package substrate corresponding to the first and second fusing regions. When one of the first and second fusing regions is blown out, the first buried cave assists energy of fuse melting to break the other of the first and second fusing regions.

Abstract translation: 保护部件包括：封装基板; 布置在所述封装衬底中的第一熔丝单元，具有第一熔化区域; 设置在所述封装基板中的第二熔丝单元，具有靠近所述第一熔融区域的第二熔融区域; 以及设置在与第一和第二熔融区域相对应的封装衬底中的第一掩埋洞穴。 当第一熔融区域和第二熔融区域中的一个被吹出时，第一掩埋洞穴帮助熔丝熔化的能量破坏第一和第二熔化区域中的另一个。

公开(公告)号：US20100270516A1

公开(公告)日：2010-10-28

申请号：US12563419

申请日：2009-09-21

Applicant: Chun-An LU ,  Hong-Ching LIN ,  Kuo-Chan CHIOU ,  Szu-Po HUANG

Inventor： Chun-An LU ,  Hong-Ching LIN ,  Kuo-Chan CHIOU ,  Szu-Po HUANG

IPC: H01B1/12

CPC classification number: B22F9/30 ,  B22F1/025 ,  B22F2998/00 ,  C01G1/02 ,  C01P2002/72 ,  C01P2006/40 ,  C09D11/52 ,  B22F2301/10 ,  B22F2301/052 ,  B22F2301/15 ,  B22F2301/25 ,  B22F2301/205 ,  B22F2301/30 ,  B22F2301/35

Abstract: A method for forming nanometer scale dot-shaped materials is provided. The method includes providing a sub-micrometer scale material and a metallo-organic compound. The sub-micrometer scale material and the metallo-organic compound are mixed in a solvent. Then, the metallo-organic compound is decomposed by thermal decomposition process and reduced to form a plurality of nanometer scale dot-shaped materials on the sub-micrometer scale material, wherein the sub-micrometer scale material and the nanometer-scale dot-shaped materials are heterologous materials. Then, the plurality of nanometer scale dot-shaped materials is melted, such that a plurality of the adjacent sub-micrometer scale materials is connected to each other to form a continuous interface between the sub-micrometer scale materials.

Abstract translation: 提供了形成纳米级点状材料的方法。 该方法包括提供亚微米级材料和金属有机化合物。 亚微米级材料和金属有机化合物在溶剂中混合。 然后，金属有机化合物通过热分解过程分解，并在亚微米级材料上还原形成多个纳米级点状材料，其中亚微米级材料和纳米级点状材料 是异源材料。 然后，使多个纳米级点状材料熔化，使得多个相邻的亚微米级材料彼此连接，以形成亚微米级材料之间的连续界面。