LED module fabrication method
    11.
    发明授权
    LED module fabrication method 有权
    LED模组制作方法

    公开(公告)号:US08193012B2

    公开(公告)日:2012-06-05

    申请号:US12779589

    申请日:2010-05-13

    Applicant: Hsuan-Chih Lin

    Inventor: Hsuan-Chih Lin

    Abstract: A method of fabricating a LED module by: bonding one or multiple LED chips and multiple conducting terminals to a circuit substrate, and then molding a packing cup on the circuit substrate over by over molding for enabling the LED chip(s) and the conducting terminals to be exposed to the outside of the packing cup, and then molding a lens on the packing cup and the LED chip(s) by over-molding. By means of directly molding the lens on the packing cup and the LED chip(s), no any gap is left in the lens, avoiding deflection, total reflection or light attenuation and enhancing luminous brightness and assuring uniform distribution of output light.

    Abstract translation: 一种通过以下方式制造LED模块:将一个或多个LED芯片和多个导电端子连接到电路基板上,然后通过过模塑将电路基板上的填料杯模制成可使LED芯片和导电端子 暴露于包装杯的外部,然后通过过度成型将透镜模制在包装杯和LED芯片上。 通过将透镜直接模制在包装杯和LED芯片上,透镜中没有留下任何间隙,避免了偏转,全反射或光衰减,并提高了发光亮度,并保证了输出光的均匀分布。

    Light-emitting device pressure ring structure
    12.
    发明授权
    Light-emitting device pressure ring structure 有权
    发光装置压环结构

    公开(公告)号:US08038328B2

    公开(公告)日:2011-10-18

    申请号:US12785782

    申请日:2010-05-24

    Abstract: A light-emitting device pressure ring structure includes a mounting base for mounting, a circuit board accommodated in the mounting base and having electrode pins connectable to an external power source, a holder member insertable in the mounting base, a light-emitting unit fixedly mounted in the holder member with a bottom heat sink thereof suspending outside the holder member and tubular electrodes thereof connectable to the electrode pins of the circuit board for power input, and a pressure ring cap detachably threaded onto the mounting base to hold down the holder member and to keep the heat sink of the light-emitting unit outside the mounting base for quick dissipation of waste heat from the light-emitting devices of the light-emitting unit.

    Abstract translation: 一种发光装置压环结构,包括安装用安装基座,容纳在安装基座中的电路板,具有可连接到外部电源的电极引脚,可插入安装基座的保持器构件,固定安装的发光单元 在保持器构件中,其底部散热器悬挂在保持器构件的外部,并且可连接到用于电力输入的电路板的电极引脚的管状电极,以及可拆卸地旋拧到安装基座上以压住保持构件的压力环帽, 以将发光单元的散热片保持在安装基座外部,以便从发光单元的发光装置快速散发废热。

    HEAT-CONDUCTING MODULE
    13.
    发明申请
    HEAT-CONDUCTING MODULE 审中-公开
    导热模块

    公开(公告)号:US20090038782A1

    公开(公告)日:2009-02-12

    申请号:US12187741

    申请日:2008-08-07

    CPC classification number: F28D15/0275 F28F2275/085 F28F2275/122

    Abstract: In a heat-conducting module and a method for manufacturing the same, the heat-conducting module includes a heat-conducting base and a heat pipe. The surface of the heat-conducting base is formed with a groove. Both sides of the groove protrude upwards to form two side walls respectively. Both of the side walls are provided with hooks respectively that are engaged with each other. The heat pipe is accommodated in the groove of the heat-conducting base and is thus covered and sandwiched by the two side walls. Via this arrangement, the connection between the heat pipe and the heat-conducting base can be firm and steady. In this way, the tight contact between the heat pipe and the heat-conducting base can be increased and the heat-conducting efficiency of the heat-conducting module can be enhanced.

    Abstract translation: 在导热模块及其制造方法中,导热模块包括导热基座和热管。 导热基体的表面形成有凹槽。 槽的两侧向上突出,分别形成两个侧壁。 两个侧壁分别设置有彼此接合的钩。 热管容纳在导热基座的槽中,由此被两侧壁覆盖并夹持。 通过这种布置,热管和导热基座之间的连接可以牢固稳定。 以这种方式,可以提高热管与导热基座之间的紧密接触,并且可以提高导热模块的导热效率。

    Heat sink and method for manufacturing the same
    14.
    发明申请
    Heat sink and method for manufacturing the same 审中-公开
    散热器及其制造方法

    公开(公告)号:US20070151711A1

    公开(公告)日:2007-07-05

    申请号:US11325543

    申请日:2006-01-05

    Abstract: A heat sink and a method for manufacturing the same. The heat sink is used to contact on a heat-generating source of an electronic device. The heat sink comprises a heat-conducting member and at least one heat pipe. With the bottom edge of a heat-absorbing end of the heat pipe contacting with the surface of the heat-generating source, and with the tight connection between the heat pipe and the heat-conducting member, the heat-conducting rate and the heat-dissipating performance of the heat sink can be greatly increase.

    Abstract translation: 散热器及其制造方法。 散热器用于在电子设备的发热源上接触。 散热器包括导热构件和至少一个热管。 随着热管的吸热端的底部边缘与发热源的表面接触,并且随着热管和导热构件之间的紧密连接,导热率和热传导率, 散热性能可以大大提高。

    Heat dissipating module and method of fabricating the same
    15.
    发明申请
    Heat dissipating module and method of fabricating the same 审中-公开
    散热模块及其制造方法

    公开(公告)号:US20070131390A1

    公开(公告)日:2007-06-14

    申请号:US11297450

    申请日:2005-12-09

    Abstract: A heat dissipating module includes thermal conductive pipes and a thermal fin module. The thermal fin module made by pressing and stacking is mounted on the thermal conductive pipes. Next, a jig is set on a top surface of the thermal fin module, and a force compresses the thermal fin module, so as to reduce a distance between two fins of the thermal fin module. Then, a fixing plate is set above the thermal fin module on the thermal conductive pipes, and the jig is removed. Finally, the fixing plate is fixed on the thermal fin module, and the thermal fin module is securely fixed with the thermal conductive pipes. Therefore, the assembled heat dissipating module could not be loosed and deformed during delivery and the engaging contact between the fins and the thermal conductive pipes are enhanced, so to increase the heat dissipating effect of the heat dissipating module.

    Abstract translation: 散热模块包括导热管和散热片模块。 通过压制和堆叠制成的散热片模块安装在导热管上。 接下来,在散热片模块的顶面上设置夹具,并且力压缩热散热片模块,以便减小散热片模块的两个散热片之间的距离。 然后,将固定板设置在导热管上的散热片模块上方,并移除夹具。 最后,固定板固定在散热片模块上,散热片模块与导热管牢固固定。 因此,组装的散热模块在输送期间不能松动和变形,并且翅片和导热管之间的接合接触增强,从而增加散热模块的散热效果。

    Light emitting diode lamp structure
    16.
    发明授权
    Light emitting diode lamp structure 有权
    发光二极管灯结构

    公开(公告)号:US09303848B2

    公开(公告)日:2016-04-05

    申请号:US14468799

    申请日:2014-08-26

    Abstract: A light emitting diode (LED) lamp structure (100) of the present invention includes a housing body (102), a LED lamp module (500), and an electronic module (700, 700′). The housing body (102) includes a lamp base (200), a module base (400), a connecting ring (300) connecting the lamp base (200), and at least one clasping member (104) connecting the module base (400). The LED lamp module (500) connects the connecting ring (300) and is disposed on the lamp base (200). The electronic module (700, 700′) connects the clasping member (104) and is disposed on the module base (400). Thereby, assembling, disassembling and replacing can be achieved without any tools. Meanwhile, the entrance of moisture is also prevented, so that a life span of an electronic device is prolonged.

    Abstract translation: 本发明的发光二极管(LED)灯结构(100)包括壳体(102),LED灯模块(500)和电子模块(700,700')。 壳体(102)包括灯座(200),模块基座(400),连接灯座(200)的连接环(300)和连接模块基座(400)的至少一个夹紧构件(104) )。 LED灯模块(500)连接连接环(300)并设置在灯座(200)上。 电子模块(700,700')连接夹紧构件(104)并且设置在模块基座(400)上。 因此,可以在没有任何工具的情况下实现组装,拆卸和更换。 同时,还防止了水分的入口,从而延长了电子设备的使用寿命。

    LED heat sink module, LED module for LED heat sink module
    17.
    发明授权
    LED heat sink module, LED module for LED heat sink module 有权
    LED散热模块,LED散热模块LED模组

    公开(公告)号:US08342716B2

    公开(公告)日:2013-01-01

    申请号:US12761727

    申请日:2010-04-16

    Applicant: Hsuan-Chih Lin

    Inventor: Hsuan-Chih Lin

    Abstract: A LED head sink module includes a LED module, which comprises a circuit substrate, a LED chip installed in the circuit substrate, a packing cup molded on the circuit substrate around the LED chip and a lens molded on the packing cup over the LED chip, a heat sink, which has a base and a flat mounting block located on the bottom side of the base for stopping against the circuit substrate of the LED module for absorbing waste heat, a bracket, which has a center opening that receives the circuit substrate of the LED module, first retaining members for fastening to a retaining portion at the periphery of the packing cup and second retaining members for fastening to the flat mounting block of the heat sink, and a water seal sandwiched between the LED module and the bracket to seal off outside moisture and dust.

    Abstract translation: LED头模块包括LED模块,其包括电路基板,安装在电路基板中的LED芯片,模制在LED芯片周围的电路基板上的封装杯和模制在LED芯片上的封装杯上的透镜, 散热器,其具有位于基座的底侧上的基部和平坦的安装块,用于阻挡用于吸收废热的LED模块的电路基板,支架具有接收电路基板的中心开口 LED模块,用于紧固到包装杯周边的保持部分的第一保持构件和用于紧固到散热器的平坦安装块的第二保持构件以及夹在LED模块和支架之间的水封以密封 外面的水分和灰尘。

    CRANK APPARATUS EQUIPPED WITH LABOR-SAVING MECHANISM AND BICYCLE CRANK ASSEMBLY

    公开(公告)号:US20240317356A1

    公开(公告)日:2024-09-26

    申请号:US18603510

    申请日:2024-03-13

    CPC classification number: B62M3/00 B62M11/02

    Abstract: A crank apparatus equipped with a labor-saving mechanism and a bicycle crank assembly are disclosed. The crank apparatus includes a crank mechanism, a transmission mechanism, a supporting module and a rotating arm module. The crank mechanism includes a crank, an axle-end gear and a pedal-end gear. The transmission mechanism includes a rotating axle having a circular groove. The supporting module is adapted to sheathe the rotating axle and includes an outer ring and rollers received inside the circular grooves and clamped between the rotating axle and the outer ring. The rotating arm module includes a first rotating arm and a second rotating arm. One end of the second rotating arm is connected to the first rotating arm, and another end of the second rotating arm is connected to the pedal-end gear. Accordingly, the transmission stability and useful lifetime of the crank apparatus and bicycle crank assembly are increased.

    Electronic implement replacement structure
    19.
    发明授权
    Electronic implement replacement structure 有权
    电子工具更换结构

    公开(公告)号:US09328910B2

    公开(公告)日:2016-05-03

    申请号:US14468967

    申请日:2014-08-26

    Abstract: An electronic implement replacement structure includes a housing body (102) and an electronic module (300). The housing body (102) has a base (110) and a connecting ring (120) connected to the base (110). The connecting ring (120) includes press portions (124) and notches (122) spaced apart from one another and respectively disposed between each two adjacent press portion (124). A guiding groove (126) is formed on an outer surface of each of the press portions (124). The electronic module (300) is disposed on the base (110) and corresponding to the connecting ring (120). The electronic module (300) includes an electronic unit (310) and a rotatable ring (330) enclosing the electronic unit (310). An inner wall of the rotatable ring (330) has a sliding block (332) correspondingly and rotatably engaged with the guiding groove (126). Therefore, assembling and disassembling can be achieved without any tools.

    Abstract translation: 电子工具更换结构包括壳体(102)和电子模块(300)。 壳体(102)具有连接到基座(110)的底座(110)和连接环(120)。 连接环(120)包括彼此间隔开并分别设置在每个相邻的两个按压部分(124)之间的按压部分(124)和凹口(122)。 在每个按压部分(124)的外表面上形成引导槽(126)。 电子模块(300)设置在基座(110)上并对应于连接环(120)。 电子模块(300)包括电子单元(310)和包围电子单元(310)的可旋转环(330)。 可旋转环(330)的内​​壁具有与引导槽(126)相对应并可旋转地接合的滑块(332)。 因此,无需任何工具即可实现组装和拆卸。

    LIGHT EMITTING DIODE LAMP STRUCTURE
    20.
    发明申请
    LIGHT EMITTING DIODE LAMP STRUCTURE 有权
    发光二极管结构

    公开(公告)号:US20160061425A1

    公开(公告)日:2016-03-03

    申请号:US14468799

    申请日:2014-08-26

    Abstract: A light emitting diode (LED) lamp structure (100) of the present invention includes a housing body (102), a LED lamp module (500), and an electronic module (700, 700′). The housing body (102) includes a lamp base (200), a module base (400), a connecting ring (300) connecting the lamp base (200), and at least one clasping member (104) connecting the module base (400). The LED lamp module (500) connects the connecting ring (300) and is disposed on the lamp base (200). The electronic module (700, 700′) connects the clasping member (104) and is disposed on the module base (400). Thereby, assembling, disassembling and replacing can be achieved without any tools. Meanwhile, the entrance of moisture is also prevented, so that a life span of an electronic device is prolonged.

    Abstract translation: 本发明的发光二极管(LED)灯结构(100)包括壳体(102),LED灯模块(500)和电子模块(700,700')。 壳体(102)包括灯座(200),模块基座(400),连接灯座(200)的连接环(300)和连接模块基座(400)的至少一个夹紧构件(104) )。 LED灯模块(500)连接连接环(300)并设置在灯座(200)上。 电子模块(700,700')连接夹紧构件(104)并且设置在模块基座(400)上。 因此,可以在没有任何工具的情况下实现组装,拆卸和更换。 同时,还防止了水分的入口,从而延长了电子设备的使用寿命。

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