公开(公告)号：US20140273641A1

公开(公告)日：2014-09-18

申请号：US13843274

申请日：2013-03-15

Applicant: David Noel Light ,  Hung-Ming Wang ,  David Rodney Baker ,  Peter Tho Nguyen ,  Dexter Shih-Wei Pao

Inventor： David Noel Light ,  Hung-Ming Wang ,  David Rodney Baker ,  Peter Tho Nguyen ,  Dexter Shih-Wei Pao

IPC: H01R13/46 ,  H01R43/16

CPC classification number: H01R43/16 ,  H01R12/7082 ,  H01R12/714 ,  H01R12/73 ,  H01R13/2407 ,  H01R13/2442 ,  H05K3/281 ,  H05K3/285 ,  H05K3/4015 ,  H05K2201/0116 ,  H05K2201/0133 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/0162 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/2036 ,  Y10T29/49208

Abstract: Disclosed is an electrical connector having a substrate and movable electrical contacts which are mounted to the substrate and extend a distance D from the substrate. A layer of compressible material (such as a foam or elastomeric material) is positioned on the substrate adjacent at least some of the electrical contacts and ideally has an uncompressed thickness slightly greater than the distance D to provide for protection of the electrical contacts. When a mating electrical device such as an electrical connector or other circuit member is mated to the electrical connector with its electrical contacts and its layer of compressible material, the layer of compressible material is compressed to a thickness less than the distance D, allowing the contacts to make a suitable electrical interconnection to the mating electrical device. The compressible material may be selected which has a force-to-compression plot which includes at least one inflection, defining a first region on one side of the inflection where a given increment of force provides a larger increment of compression and a second region on the other side of the inflection where the same increment of compressive force provides a substantially smaller increment of compression. The compressible material can function to prevent damage to the movable electrical contacts from handling, packing, shipping, assembly, testing, connection and/or mating of the connector.

Abstract translation: 公开了一种电连接器，其具有基板和可移动的电触头，其安装到基板并且从基板延伸距离D。 一层可压缩材料（例如泡沫或弹性体材料）被定位在邻近至少一些电触头的衬底上，并且理想地具有稍微大于距离D的未压缩厚度以提供对电触点的保护。 当诸如电连接器或其他电路构件的匹配电气装置与其电触头及其可压缩材料层配合到电连接器时，可压缩材料层被压缩至小于距离D的厚度，允许触点 以便与匹配的电气设备形成适当的电互连。 可选择可压缩材料，其具有力至压缩图，其包括至少一个拐点，在拐点的一侧上限定第一区域，其中给定的力增量提供更大的压缩增量，并且第二区域 拐点的另一侧，同样的压缩力增量提供了显着更小的压缩增量。 可压缩材料可以起到防止可移动电触头损坏连接器的处理，包装，运输，组装，测试，连接和/或配合的作用。

公开(公告)号：US07416975B2

公开(公告)日：2008-08-26

申请号：US11232718

申请日：2005-09-21

Applicant: Cyprian E. Uzoh ,  Bulent M. Basol ,  Hung-Ming Wang ,  Homayoun Talieh

Inventor： Cyprian E. Uzoh ,  Bulent M. Basol ,  Hung-Ming Wang ,  Homayoun Talieh

IPC: H01L21/44

CPC classification number: H01L21/2885 ,  C25D5/02 ,  C25D7/123 ,  C25D17/005

Abstract: A method is provided for manufacturing removable contact structures on the surface of a substrate to conduct electricity from a contact member to the surface during electroprocessing. The method comprises forming a conductive layer on the surface. A predetermined region of the conductive layer is selectively coated by a contact layer so that the contact member touches the contact layer as the electroprocessing is performed on the conductive layer.

Abstract translation: 提供了一种用于在基板的表面上制造可移除接触结构以在电加工期间将电从接触构件传导到表面的方法。 该方法包括在表面上形成导电层。 导电层的预定区域被接触层选择性地涂覆，使得当在导电层上进行电处理时，接触构件接触接触层。

公开(公告)号：US06685820B2

公开(公告)日：2004-02-03

申请号：US10132143

申请日：2002-04-26

Applicant: Kuo-Chin Chen ,  Ching-Hwa Chang ,  Yu-Feng Lin ,  Tai-Sheng Yuan ,  Hung-Ming Wang ,  Jenn-Fang Wu ,  Huei-Yin Cheng

Inventor： Kuo-Chin Chen ,  Ching-Hwa Chang ,  Yu-Feng Lin ,  Tai-Sheng Yuan ,  Hung-Ming Wang ,  Jenn-Fang Wu ,  Huei-Yin Cheng

IPC: C25C100

CPC classification number: C23F1/46 ,  C22B3/44 ,  C22B7/006 ,  C22B13/045 ,  C22B23/04 ,  C23G1/36 ,  C25C1/14 ,  C25C1/18 ,  Y02P10/234

Abstract: The present invention relates to a method for treating spent tin or tin/lead stripping solution used in the electronic industry, particularly in the manufacture of printed circuit boards or a lead frames. Said method comprises (i) electrolytically reducing copper ions in the solution to copper at a low temperature; (ii) electrolytically oxidizing Sn2+ and Pb2+ in the solution at a high temperature to form solid tin and lead oxides and hydroxides; (iii) separating solid tin and lead oxides and hydroxides from the solution; (iv) dissolving tin and lead oxides and hydroxides obtained in step (iii) in a strong alkali or acidic solution; and (v) electrolytically reducing the alkali or acidic solution obtained in step (iv) at a high temperature to recover metallic tin and lead. Also, the filtrate obtained in step (iii) above is useful for preparing fresh tin or tin/lead stripping solution.

Abstract translation: 本发明涉及一种用于处理电子工业中使用的废锡或锡/铅剥离溶液的方法，特别是在印刷电路板或引线框的制造中。 所述方法包括（i）在低温下将溶液中的铜离子电解还原成铜; （ii）在高温下在溶液中电解氧化Sn 2+和Pb 2+，形成固体锡和氧化铅和氢氧化物; （iii）从溶液中分离固体锡和氧化铅和氢氧化物; （iv）将步骤（iii）中获得的锡和氧化铅和氢氧化物溶解在强碱或酸性溶液中; 和（v）在高温下电解还原步骤（iv）中得到的碱或酸性溶液以回收金属锡和铅。 此外，上述步骤（iii）中获得的滤液可用于制备新鲜的锡或锡/铅剥离溶液。

公开(公告)号：US06573459B2

公开(公告)日：2003-06-03

申请号：US10200815

申请日：2002-07-22

Applicant: David R. Baker ,  Hung-Ming Wang

Inventor： David R. Baker ,  Hung-Ming Wang

IPC: H05K116

CPC classification number: H01L23/49572 ,  H01L23/3107 ,  H01L23/49582 ,  H01L24/01 ,  H01L2924/00014 ,  H01L2924/12042 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4921 ,  Y10T428/12493 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/24983 ,  H01L2224/45099 ,  H01L2924/00

Abstract: Flexible leads for making electrical connection in microelectronic components includes two metallic layers. The structural or core layer of the lead is formed having a hardness greater than the hardness of the second layer. The relative hardness between the first and second layers is achieved by controlling the grain size during deposition of the respective layers from an electroless or electroplating bath.

公开(公告)号：US06248656B1

公开(公告)日：2001-06-19

申请号：US09374394

申请日：1999-08-13

Applicant: David R. Baker ,  John Grange ,  David Light ,  Hung-Ming Wang

Inventor： David R. Baker ,  John Grange ,  David Light ,  Hung-Ming Wang

IPC: H01L2144

CPC classification number: H01L21/4857 ,  H01L21/486

Abstract: Metal leads are formed on a copper conductive layer by applying a first resist and a main resist over the first resist, and forming aligned openings in these resist. A bottom layer of cover metal such as gold is plated onto the copper conductive layer in these openings, followed by a principal metal such as copper. The main resist is then removed so as to expose edges of the principal metal layer. A jacket of cover metal is plated onto the exposed edges and surfaces of the principal metal layer. During this stage, the first resist prevents deposition of the cover metal except on the leads. The jacket merges with the bottom layer of cover material, so as to form a continuous coating extending around the perimeters of the leads. The first resist is removed, and the conductive layer is etched away. The cover metal protects the principal metal during the etching stage.

Abstract translation: 通过在第一抗蚀剂上施加第一抗蚀剂和主抗蚀剂，在铜导电层上形成金属引线，并在这些抗蚀剂中形成对准的开口。 覆盖金属如金的底层被镀在这些开口中的铜导电层上，随后是诸如铜的主要金属。 然后去除主抗蚀剂以暴露主金属层的边缘。 将覆盖金属的护套电镀在主金属层的暴露的边缘和表面上。 在这个阶段，第一个抗蚀剂防止除了引线之外的覆盖金属的沉积。 护套与覆盖材料的底层合并，以形成围绕引线周边延伸的连续涂层。 去除第一抗蚀剂，并且蚀刻掉导电层。 覆盖金属在蚀刻阶段保护主要金属。