Method for making an LED array
    11.
    发明授权
    Method for making an LED array 失效
    制造LED阵列的方法

    公开(公告)号:US5242840A

    公开(公告)日:1993-09-07

    申请号:US763293

    申请日:1991-09-20

    Applicant: Ki-Joon Kim

    Inventor: Ki-Joon Kim

    CPC classification number: H01L27/153

    Abstract: There is disclosed a method for making array capable of realizing large output and large-scale integration by using a heterogenous film which can electrically insulate between LEDs, (LEDs) by the diffusion of an impurity into a substrate. The improved LED array manufacturing method includes the steps of: forming a luminescent layer, of a first conductivity type, a transparent layer and a cap-layer over the semiconductor substrate, forming of a cap layer made into a given pattern by etching a given portion of said cap layer; forming of a diffusion region converted into the first conductivity type by the injection of an impurity into a given portion of the transparent layer; forming an oxide film on the entire surface except the area where the cap layer is covering the transparent layer 13; and forming an electrode over the cap layer and a common electrode under the semiconductor substrate.

    Abstract translation: 公开了一种使阵列能够实现大输出和大规模集成的方法,该方法通过使用通过将杂质扩散到衬底中而使LED(LED)电绝缘的异质膜。 改进的LED阵列制造方法包括以下步骤:在半导体衬底上形成第一导电类型,透明层和盖层的发光层,通过蚀刻给定部分形成制成给定图案的盖层 的所述盖层; 通过将杂质注入到透明层的给定部分中,形成转变成第一导电类型的扩散区; 在覆盖透明层13的区域以外的整个表面上形成氧化膜; 以及在所述覆盖层上形成电极,在所述半导体衬底下方形成公共电极。

    Method for making an LED array
    12.
    发明授权
    Method for making an LED array 失效
    制造LED阵列的方法

    公开(公告)号:US5063420A

    公开(公告)日:1991-11-05

    申请号:US440673

    申请日:1989-11-24

    Applicant: Ki-Joon Kim

    Inventor: Ki-Joon Kim

    CPC classification number: H01L27/153

    Abstract: There is disclosed a method for making a light-emitting diode array capable of realizing large output and large-scale integration by using a heterogenous film which can electrically insulate between LEDs, (LEDs) by the diffusion of an impurity into a substrate. The improved LED array manufacturing method includes the steps of: forming a luminescent layer, of a first conductivity type, a transparent layer and a cap-layer over the semiconductor substrate; forming of a cap layer made into a given pattern by etching a given portion of said cap layer; forming of a diffusion region converted into the first conductivity type by the injection of an impurity into a given portion of the transparent layer; forming an oxide film on the entire surface except the area where the cap layer is covering the transparent layer; and forming an electrode over the cap layer and a common electrode under the semiconductor substrate.

    Abstract translation: 公开了一种制造发光二极管阵列的方法,该发光二极管阵列能够通过使用通过将杂质扩散到衬底中而使LED(LED)电绝缘的异质膜来实现大输出和大规模集成。 改进的LED阵列制造方法包括以下步骤:在半导体衬底上形成第一导电类型,透明层和帽层的发光层; 通过蚀刻所述盖层的给定部分来形成制成给定图案的盖层; 通过将杂质注入到透明层的给定部分中,形成转变成第一导电类型的扩散区; 在覆盖透明层的区域以外的整个表面上形成氧化膜; 以及在所述覆盖层上形成电极,在所述半导体衬底下方形成公共电极。

    Method of making an LED array
    13.
    发明授权
    Method of making an LED array 失效
    制造LED阵列的方法

    公开(公告)号:US4999310A

    公开(公告)日:1991-03-12

    申请号:US399954

    申请日:1989-08-29

    Applicant: Ki-Joon Kim

    Inventor: Ki-Joon Kim

    Abstract: A method of making an LED array capable of enhancing an internally generated light density with heterojunction by supporting the LED array with a current injection region by growing heterogeneous film and diffusing a zinc impurity. The improved LED array is capable of producing a high optical power by radiating efficiently a generated light beam without disturbance. To achieve the objects of the present invention, the method comprises: a first process for sequentially growing an n-type junction layer, a p-type radiative layer, a current blocking layer and n-type transparent layer over a semiconductor substrate; a second process for photo-etching the current blocking layer and n-type transparent layer in order to inject current; a third process for diffusing zinc impurity to form current injection region by electrically connecting p-type electrode with p-type radiative layer over the surface of current blocking layer as n-type transparent layer; a fourth process for performing a photo-etching so as to separate each element; and a fifth process for forming respective electrodes over the surface and inside of element.

    Abstract translation: 一种制造LED阵列的方法,所述LED阵列能够通过产生非均相膜并扩散锌杂质,通过用电流注入区支持LED阵列,从而通过异质结增强内部产生的光密度。 改进的LED阵列能够通过有效地辐射产生的光束而无扰动地产生高光功率。 为了实现本发明的目的,该方法包括:在半导体衬底上顺序生长n型结层,p型辐射层,电流阻挡层和n型透明层的第一工艺; 用于光电蚀刻电流阻挡层和n型透明层以便注入电流的第二工艺; 通过将电流阻挡层的表面上的p型电极与p型辐射层电连接作为n型透明层,将锌杂质扩散形成电流注入区域的第三种工艺; 用于进行光蚀刻以分离每个元件的第四工艺; 以及在元件的表面和内部形成各个电极的第五工艺。

    METHODS OF FORMING PATTERNS AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES USING THE SAME
    15.
    发明申请
    METHODS OF FORMING PATTERNS AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES USING THE SAME 有权
    形成图案的方法和使用该方法制造半导体器件的方法

    公开(公告)号:US20140264516A1

    公开(公告)日:2014-09-18

    申请号:US14210329

    申请日:2014-03-13

    Abstract: An insulation layer is formed on a substrate. A first mask is formed on the insulation layer. The first mask includes a plurality of line patterns arranged in a second direction. The plurality of line patterns extend in a first direction substantially perpendicular to the second direction. A second mask is formed on the insulation layer and the first mask. The second mask includes an opening partially exposing the plurality of line patterns. The opening has an uneven boundary at one of a first end portion in the first direction and a second end portion in a third direction substantially opposite to the first direction. The insulation layer is partially removed using the first mask and the second mask as an etching mask, thereby forming a plurality of first trenches and second trenches. The plurality of first trenches and the second trenches are arranged in a staggered pattern.

    Abstract translation: 在基板上形成绝缘层。 在绝缘层上形成第一掩模。 第一掩模包括沿第二方向布置的多个线图案。 多个线图案沿着基本上垂直于第二方向的第一方向延伸。 在绝缘层和第一掩模上形成第二掩模。 第二掩模包括部分地暴露多个线图案的开口。 开口在第一方向的第一端部和第一方向的第三方向的第二方向的第一方向的一侧具有不均匀的边界。 使用第一掩模和第二掩模作为蚀刻掩模来部分去除绝缘层,从而形成多个第一沟槽和第二沟槽。 多个第一沟槽和第二沟槽以交错图案布置。

    METHOD OF FABRICATING RESISTANCE VARIABLE MEMORY DEVICE AND DEVICES AND SYSTEMS FORMED THEREBY
    16.
    发明申请
    METHOD OF FABRICATING RESISTANCE VARIABLE MEMORY DEVICE AND DEVICES AND SYSTEMS FORMED THEREBY 审中-公开
    电阻可变存储器件的制造方法及其形成的器件及其系统

    公开(公告)号:US20130040408A1

    公开(公告)日:2013-02-14

    申请号:US13569425

    申请日:2012-08-08

    CPC classification number: H01L21/76897 H01L27/228 H01L27/2436

    Abstract: An exemplary method of forming a variable resistance memory may include forming first source/drain regions in a substrate, forming gate line structures and conductive isolation patterns buried in the substrate with the first source/drain regions interposed therebetween, and forming lower contact plugs on the first source/drain regions. The forming of lower contact plugs may include forming a first interlayer insulating layer, including a first recess region exposing the first source/drain regions adjacent to each other in a first direction, forming a conductive layer in the first recess region, patterning the conductive layer to form preliminary conductive patterns spaced apart from each other in the first direction, and patterning the preliminary conductive patterns to form conductive patterns spaced apart from each other in a second direction substantially orthogonal to the first direction.

    Abstract translation: 形成可变电阻存储器的示例性方法可以包括在衬底中形成第一源极/漏极区域,形成栅极线结构和埋入衬底中的导电隔离图案,其中介于其间的第一源极/漏极区域形成下部接触插塞 第一源/漏区。 下接触塞的形成可以包括形成第一层间绝缘层,其包括在第一方向上暴露彼此相邻的第一源极/漏极区的第一凹部区域,在第一凹部区域中形成导电层,图案化导电层 以在第一方向上形成彼此间隔开的初步导电图案,并且将初步导电图案图案化以形成在与第一方向大致正交的第二方向上彼此间隔开的导电图案。

    METHOD OF OPERATING A PHASE-CHANGE MEMORY DEVICE
    17.
    发明申请
    METHOD OF OPERATING A PHASE-CHANGE MEMORY DEVICE 审中-公开
    操作相变存储器件的方法

    公开(公告)号:US20120099371A1

    公开(公告)日:2012-04-26

    申请号:US13343383

    申请日:2012-01-04

    CPC classification number: G11C11/5678 G11C13/0004

    Abstract: A method of operating a phase-change memory device including a phase-change layer and a unit applying a voltage to the phase-change layer is provided. The method includes applying a reset voltage to the phase-change layer, wherein the reset voltage includes at least two pulse voltages which are continuously applied.

    Abstract translation: 提供一种操作包括相变层和向相变层施加电压的单元的相变存储器件的方法。 该方法包括将复位电压施加到相变层,其中复位电压包括连续施加的至少两个脉冲电压。

    Phase-change memory using single element semimetallic layer
    20.
    发明申请
    Phase-change memory using single element semimetallic layer 有权
    使用单元素半金属层的相变存储器

    公开(公告)号:US20090283738A1

    公开(公告)日:2009-11-19

    申请号:US12213234

    申请日:2008-06-17

    CPC classification number: H01L45/1233 H01L45/06 H01L45/148

    Abstract: Provided is a phase-change memory using a single-element semimetallic thin film. The device includes a storage node having a phase-change material layer and a switching element connected to the storage node, wherein the storage node includes a single-element semimetallic thin film which is formed between an upper electrode and a lower electrode. Thus, the write speed of the phase-change memory can be increased compared with the case of a Ge—Sb—Te (GST) based material.

    Abstract translation: 提供了使用单元件半金属薄膜的相变存储器。 该装置包括具有相变材料层和连接到存储节点的开关元件的存储节点,其中存储节点包括形成在上电极和下电极之间的单元件半金属薄膜。 因此,与基于Ge-Sb-Te(GST)的材料的情况相比,可以提高相变存储器的写入速度。

Patent Agency Ranking