Abstract:
Provided is a phase-change memory using a single-element semimetallic thin film. The device includes a storage node having a phase-change material layer and a switching element connected to the storage node, wherein the storage node includes a single-element semimetallic thin film which is formed between an upper electrode and a lower electrode. Thus, the write speed of the phase-change memory can be increased compared with the case of a Ge—Sb—Te (GST) based material.
Abstract:
A storage node may include a bottom electrode contact layer, a phase change layer connected to the bottom electrode contact layer, and a top electrode layer connected to the phase change layer. The bottom electrode contact layer may protrude toward the phase change layer. A phase change memory device may include a switching device and the storage node. The switching device may be connected to the bottom electrode contact layer. A method of manufacturing the storage node may include forming a via hole in an insulating interlayer, at least partially filling the via hole to form a bottom electrode contact layer, protruding the bottom electrode contact layer from the via hole, and forming a phase change layer that covers the bottom electrode contact layer. A method of manufacturing a phase change memory device may include forming the switching device on a substrate and manufacturing the storage node.
Abstract:
A phase change RAM (PRAM) including a resistance element having a diode function, and methods of fabricating and operating the same are provided. The PRAM may include a substrate, a phase change diode layer formed on the substrate and an upper electrode formed on the phase change diode layer. The phase change diode layer may include a material layer doped with first impurities, and a phase change layer which is stacked on the doped layer. The phase change layer may show characteristics of a semiconductor material doped with impurities having an opposite conductive type to that of the first impurities.
Abstract:
A full CMOS SRAM cell having the capability of having a reduced aspect ratio is described. The SRAM cell includes first and second transfer transistors of n-channel types, first and second driving transistors of the n-channel types and first and second load transistors of p-channel types. Each of the transistors has source and drain regions on opposite sides of a channel region formed in a semiconductor substrate and a gate over the channel region. The cell includes a first common region defined by the drain regions of the first transfer transistor and the first driving transistor connected in series therethrough. A second common region is defined by the drain regions of the second transfer transistor and the second driving transistor connected in series therethrough. The drain region of the first load transistor is disposed adjacent to the first common region between the first and second common regions. The drain region of the second load transistor is disposed between the drain region of the first load transistor and the second common region. First and second gate electrode layers are disposed generally parallel to each other, and respectively serving as the gates of the first driving transistor and the first load transistor and as the gates of the second driving transistor and the second load transistor, wherein each of the first and second gate electrode layers is made of a conductive material of a first level. First and second interconnecting layers are each made of a conductive material of a second level different from the first level, the first interconnecting layer connecting the first common region to the drain region of the first load transistor and the second gate electrode layer, the second interconnecting layer connecting the second common region to the drain region of the second load transistor and the first gate electrode layer.
Abstract:
A semiconductor device and methods of forming a semiconductor device are disclosed. In the methods, a layer, such as an insulating interlayer, is formed on a substrate. A first trench is formed in the layer, and a mask layer is formed in the first trench. The mask layer has a first thickness from a bottom surface of the first trench to the top of the mask layer. The mask layer is patterned to form a mask that at least partially exposes a sidewall of the first trench. A portion of the mask adjacent to the exposed sidewall of the first trench has a second thickness smaller than the first thickness. The layer is etched to form a second trench using the mask as an etching mask. The second trench is in fluid communication with the first trench. A conductive pattern is formed in the first trench and the second trench.
Abstract:
There is provided a source driver capable of controlling the timing of source line driving signals in a liquid crystal display device. The source driver includes a plurality of output circuits, each output circuit including an output buffer and a switch. The output buffer amplifies an analog image signal, and the switch outputs the amplified analog image signal as a source line driving signal in response to a control signal. The source driver further comprises a control circuit for generating the control signal, the control circuit comprising: a delay circuit delaying a switch signal and generating a delayed switch signal; and a multiplexer selecting one of the switch signal and the delayed switch signal in response to a selection signal and outputting the selected signal as the control signal.
Abstract:
Provided is a probe card of a semiconductor testing apparatus, including a printed circuit board to which an electrical signal is applied from external, a space transformer having a plurality of probes directly contacting with a test object, and interconnectors connecting the printed circuit board to the probes of the space transformer. The space transformer includes substrate pieces which the probes are installed on one sides of, and a combination member joining and unifying the substrate pieces together so as to form a large-area substrate with the substrate pieces on the same plane. This probe card is advantageous to improving flatness even with a large area, as well as testing semiconductor chips formed on a wafer in a lump.
Abstract:
Disclosed is a cantilever-type probe and methods of fabricating the same. The probe is comprised of a cantilever being longer lengthwise relative to the directions of width and height, and a tip extending from the bottom of the cantilever and formed at an end of the cantilever. A section of the tip parallel to the bottom of the cantilever is rectangular, having four sides slant to the lengthwise direction of the cantilever.
Abstract:
A device and method for liquid-phase thin film epitaxial growth are disclosed wherein yield and quality of semiconductors in the fabrication sequences are improved. The device comprises an electric furnace which is disposed outside a quartz tube, a plurality of boats which are disposed within the quartz tube in accordance with a sort of melting liquids and a plurality of auxiliary heating devices are disposed around the boats with a power source independent from the electric furnace. According to this fabrication sequence, after heating the inner part of the quartz tube up to a first temperature level by supplying the power source to the electric furnace, the melting liquids are firstly melted down enough by means of selectively heating the auxiliary heating devices up to a second temperature level higher than the first temperature level, the substrates are then moved to be in contact with the melting liquids and an epitaxial growth layer is consequently formed through selectively reducing the temperature of the auxiliary heating devices to other levels different from the first and second level.
Abstract:
An insulation layer is formed on a substrate. A first mask is formed on the insulation layer. The first mask includes a plurality of line patterns arranged in a second direction. The plurality of line patterns extend in a first direction substantially perpendicular to the second direction. A second mask is formed on the insulation layer and the first mask. The second mask includes an opening partially exposing the plurality of line patterns. The opening has an uneven boundary at one of a first end portion in the first direction and a second end portion in a third direction substantially opposite to the first direction. The insulation layer is partially removed using the first mask and the second mask as an etching mask, thereby forming a plurality of first trenches and second trenches. The plurality of first trenches and the second trenches are arranged in a staggered pattern.